Brian Carlson
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Brian Carlson Email & Phone Number

Head of Product and Partnerships at Baya Systems
Location: Austin, Texas, United States 13 work roles 2 schools
1 work email found @nxp.com 6 phones found area 212, 214, 732, and 972 LinkedIn matched
✓ Verified August 2026 4 data sources Profile completeness 100%

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Work email b****@nxp.com
Direct phone (212) ***-****
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Current company
Role
Head of Product and Partnerships
Location
Austin, Texas, United States
Company size

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Brian Carlson is listed as Head of Product and Partnerships at Baya Systems, a with 10 employees, based in Austin, Texas, United States. AeroLeads shows a work email signal at nxp.com, phone signal with area code 212, 214, 732, 972, and a matched LinkedIn profile for Brian Carlson.

Brian Carlson previously worked as Global Marketing Director - Automotive Processors at Nxp Semiconductors and Director, Product Line Management at Nxp Semiconductors. Brian Carlson holds Master Of Science, Electrical Engineering from Southern Methodist University.

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{first}.{last}@nxp.com
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Profile bio

About Brian Carlson

Trusted, technology product management, product marketing, and business development executive with over 30 years’ excellence aggressively growing semiconductor, software, and systems businesses by driving valued innovation and creating new opportunities. Effective communicator, with solid technical and business experience, delivering results from strategy to sales.★ PRODUCT VISION: Championed many innovations to create new experiences and award-winning products.★ BUSINESS DEVELOPMENT: Generated millions of dollars in business with technologies, business models, and strategic partnerships.★ CUSTOMER FOCUS: Recognized for proactive, above and beyond, field and customer engagements.★ COMMUNICATIONS: Communicate complex topics in easy-to-understand ways to influence, drive, and sell.★ STRONG TECHNICAL FOUNDATION: Lead with credibility as MSEE with broad technical experience.-------------------------------------------------------------------------------------------------------------------------------------------Strengths (SF 2.0): Strategic, Learner, Achiever, Responsibility, AnalyticalSkills: product management, product marketing, technology marketing, technology strategy, strategic partnerships, strategic planning, product strategy, product development, business development, competitive analysis, leadership, cross-organizational leadership, board member, project management, corporate spokesperson, evangelist, analytical, detail-oriented, voice of customer

Listed skills include Product Management, Strategic Partnerships, Embedded Systems, Competitive Analysis, and 28 others.

Current workplace

Brian Carlson's current company

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Baya Systems
Baya Systems
Head of Product and Partnerships
Austin, TX, US
Website
Employees
10
AeroLeads page
13 roles

Brian Carlson work experience

A career timeline built from the work history available for this profile.

Head Of Product And Partnerships

Austin, Tx, Us

Global Marketing Director - Automotive Processors

Current

Eindhoven, Noord-Brabant, Nl

Global marketing of automotive processors and software solutions that enable software-defined vehicles (SDVs) and create new business opportunities with global automotive OEMs, Tier-1s and ecosystem partners worldwide. • Drive outbound marketing and evangelism for automotive processors and software solutions • Serve as automotive thought leader, industry speaker and NXP spokesperson, including interface to media and analysts on key automotive industry topics and NXP product announcements and launches. • Spearhead NXP vehicle data intelligence efforts to help accelerate the automotive digital transformation • Corporate Gamechanger Award winner for cross-NXP collaboration creating popular S32G GoldBox for vehicle networking development • Recognized as industry software-defined vehicle (SDV) expert and serve as advisor to organizations such as the Connected Vehicle Systems Alliance (COVESA) and the SDVerse vehicle software marketplace.(Applications: software-defined vehicles, central compute, service-oriented gateway, telematics, connected vehicles, domain controllers, zonal gateways, zone controllers, advanced telematics, ECU consolidation, ADAS/AD safety processor, central vehicle computer, central vehicle controller, propulsion domain controller, EV traction inverter control, battery management, vehicle network processor, post-quantum cryptography (PQC), usage-based insurance, vehicle health management and more)

Mar 2020 - Present

Director, Product Line Management

Eindhoven, Noord-Brabant, Nl

Product line management of industry-leading, highly-integrated, safe, and secure vehicle network processor solutions for service-oriented gateways, domain controllers and ADAS/autonomous driving safety processors. • Drive solutions to transform vehicle architectures and create new industry business opportunities • Introduced S32G - the world's first Vehicle Network Processor to the automotive market• Led business development with North American and Asian automotive OEMs and Tier 1s • Collaborated across automotive product lines and with innovative industry partners to offer optimized, end-to-end system solutions for differentiation• Provide automotive market insights and voice of customers to the organization

Nov 2016 - Mar 2020

Technology Marketing Director

Santa Clara, California, Us

Created value and differentiation for customers and increased revenue for Intel by driving new user experiences into mobile client platforms as part of the Client Computing Group (CCG) with $32B annual revenue. Evangelized technology and user experiences and communicated value propositions, developed sales and training collateral, drove and prioritized design wins, represented the voice of the customer to improve products, and collaborated with the field for success. • Led Intel Smart Sound Technology (Intel SST) audio, voice and speech business and marketing. Design wins increased 7x in 2015. Exceeded 2015 total in first quarter of 2016.• Created software licensing business to generate multi-million dollar revenue stream. Trailblazing work recognized and leveraged by other groups within the company.• Evangelized wide range of platform technologies and the benefits they provided to influence customer (OEM/ODM) design wins such as: - Intel® Smart Sound Technology for audio, voice and speech solutions - Digital Signal Processors (DSPs) for power-efficient processing - AirFuel Resonant wireless charging as part of Intel "No Wires" initiative - Intel® RealSense 3D/depth cameras that enable many new, immersive user experiences - Image Signal Processor for advanced imaging and vision applications• Received Intel Hall of Fame Award and 16 recognition awards for going "above and beyond" to address customer needs and supporting the Intel worldwide sales team.

Jan 2015 - Jul 2016

Director Product Line Management

Santa Clara, California, Us

Led business, product, and customer strategy for Android tablets in the Mobile Computing Group. Provided direction and prioritization to 100’s of people in cross-functional teams to meet goals. • Intel became #1 merchant tablet processor vendor with over 46 million devices in 2014. It was 460% increase over 2013 and 6 million above the target.• Championed new vertical market tablet opportunities across company to expand business.• Business champion for imaging and 3D/depth technologies to differentiate Intel computing products.• Key contributor to four OEM long-term agreements in the areas of differentiation and customization opportunities to strengthen customer commitments and revenue opportunities.

Jan 2013 - Dec 2014

Vice Chairman - Board Of Directors

Piscataway, New Jersey, Us

Represented Texas Instruments and served as vice-chairman on the MIPI Board of Directors.The MIPI Alliance includes over 275 leading companies in the mobile industry that share the objective of defining and promoting open specifications for interfaces in mobile devices.• Oversaw and advocated TI corporate MIPI strategy and coordinated efforts and communications across multiple business units. • Championed several, successful initiatives to expand the scope, membership and industry prominence of the organization. Membership went from 75 to 225 companies during my board tenure (200% growth).• Founder of the Marketing Working Group responsible for marketing strategy and promotion. Led new brand strategy, website, key collateral and messaging efforts that continue to be cornerstones for the organization today.• Influenced board to address adjacent markets (IoT, automotive, wearables...) and identified the need for a sensor interface that resulted in the MIPI I3C / SenseWire interface.

Dec 2008 - Dec 2012

Senior Product Line Manager - Omap Processors

Dallas, Tx, Us

Directed worldwide product management and product marketing from concept to silicon for TI OMAP™ application processors targeting mobile platforms and leveraged in automotive and Internet of Things (IoT) applications. Role involved market and competitive analysis, business justification, product requirements, value propositions, architecture alignment, checkpoints, customer design wins, sales collateral, evangelism, blogging, go-to-market activities, and press/analyst interviews.• Influenced top smartphone and tablet OEM executives, platform architects and chipset evaluators to achieve many design wins.• Well-received OMAP 5 launch at Mobile World Congress tradeshow: worldwide press conference, 50+ interviews, Telly award-winning concept video and a wide range of sales collateral.• Led product definition and business justification for OMAP 5 derivative devices to meet unique needs of non-mobile, embedded processing markets.• Drove strategic partnerships to showcase and differentiate OMAP processors with operators and complementary technology providers for competitive advantages.• Increased industry awareness serving as TI mobile spokesperson and senior technology strategist, with strong, long-term relationships with key mobile and embedded processing press and analysts.

Nov 2008 - Dec 2012

Technology Marketing Manager

Dallas, Tx, Us

Oversaw mobile technology strategy and marketing, competitive analysis and IP management. Managed team of seven marketing managers defining strategy and IP roadmaps for twelve technology domains (CPU, imaging, video, graphics, connectivity, audio/speech, security, peripherals, miniaturization, modem, RF and power management) to address IP needs ahead of product development.• Proactively created new technology marketing group that reduced time-to-market up to 33%.• Developed comprehensive, five-year technology strategy and market segment roadmaps that enabled more-informed decisions, increased TI competitiveness and reduced time-to-market.• Championed multi-disciplined SMP evaluation task force to obtain executive support for first dual-core mobile processor and educated customers and the industry on the competitive advantages.• Collaborated with multiple tier-1 mobile OEMs on long-term needs and mapping to technology solutions.• Created corporate, device and core IP competitive intelligence reports and positioning statementscritical for organization alignment and successful customer engagements.• Corporate marketer for Arm® processor technologies driving requirements for future symmetric multi-processing (SMP) cores and promoting new Arm technologies. • Initiated industry promotion of TI SmartReflex® power and performance management technologies as a TI competitive advantage.• Member, Group Technical Staff representing top technical achievers in the company.

Nov 2004 - Nov 2008

Product Marketing Manager

San Jose, Ca, Us

Developed new DSP standard product business based on IP acquired from DSP startup ZSP Corporation. Responsible for business strategy, business development, product definition, customer engagements, pricing and promotion. Led internal development initiatives and external partnerships to offer complete solutions to the market. Worked across organizations to ensure development of competitive product that was recognized as a breakthrough in performance and cost by industry.• Expanded product line to increase opportunities with successive quarterly revenue growth during tenure. • Spearheaded DSP known good die (KGD) strategy for high-volume, wireless VoIP market opportunities - Enabled 82% reduction in package size to expand into new applications - Partnered with SyChip (acquired by Murata) to integrate into Voice over Wireless LAN module - Effort was catalyst for LSI corporate wafer-level packaging capability to address unprecedented system integration with ASICs/SoCs (link below)• Created corporate Voice over IP (VoIP) strategy and Z.Voice product line with DSP, vocoders, bundled device/software packages and reference designs. (link below) - Successful VoIP business was established with major design wins in Asia • Initiated synergistic partnerships with Micrel and Arcturus Networks that resulted in a wireless VoIP router reference design, using ZSP DSPs for voice processing, that expanded market opportunities and grew business for all three companies. (press release below)• Product management and product marketing efforts resulted in LSI403LC DSP winning the 2004 Electronic Products & GSPx Product of Year awards. The ZSP business was acquired by VeriSilicon when LSI shifted focus to storage systems. The ZSP DSP and software capabilities continue to be leveraged today based on the strong software and ecosystem support developed during tenure.

Apr 2002 - Oct 2004

Software Marketing Manager

San Jose, Ca, Us

• Identified internal software development and ecosystem needs to be successful in target markets (audio/voice, VoIP). • Created strongest ecosystem (ZSP Solution Partners) in DSP IP licensing market by formalizing relationships with 50 diverse solution partners that provided a competitive advantage to enable business growth. • Branded and launched ZOpen software framework which provides integration guidelines with supporting utilities, compliant third-party algorithms, and a supporting methodology that simplifies and standardizes application development. This was a key enabler for supporting a successful business.

Mar 2001 - Apr 2002

Senior Consulting Engineer

Successfully expanded DNA's prior telecom-focused business with new DSP-based opportunities by leveraging my DSP expertise, business skills, and strong industry relationships. • Strategic technical/business manager for Texas Instruments (TI) account. Significantly expanded design services business by addressing unique TI customer needs and offering complementary products and design services which led to volume production opportunities .• Increased sales by 54% in one year.• Chief architect of several DSP-based products for key customer accounts in multiple industries such as telecommunications, semiconductors, and industrial. • Architect and designer of 672-channel, 48 DSP-core, echo cancellation and compression Compact PCI module for Jetstream Communications Voice-over-DSL gateway. - Generated $22 million and established leadership with 50% market share• Led architecture and design of multiple products for TI including TMS320C62x EVM/McEVM, 5402 DSK, PCI2040 5410 EVM and 5510 EVM. • Creator of the TI "Common Connector" for daughterboards that enabled many TI business units to increase complementary device attach rates with C5x/C6x DSPs and extend products into new markets quickly with minimal effort.DNA was acquired by Flextronics to design products for other companies.

Nov 1996 - Mar 2001

Software Product Manager

Hyperception, Inc.

Responsible for product strategy, definition, development and marketing of visual, real-time DSP software development tools. • Increased software sales 100% in first year by establishing an international distribution network.• Invented underlying real-time execution and dynamic compilation technologies of the Hypersignal RIDE product that allowed complex DSP products to be developed graphically with block diagrams and executed real-time on plug-in DSP boards. Performance was accelerated by >10x.• Developed strategic partnerships with key DSP industry executives (silicon, board and algorithm vendors) to create mutual, profitable business.Hyperception was acquired by National Instruments, and key technologies are embedded in their very popular LabVIEW graphical programming product.

Oct 1993 - Oct 1996

Senior Systems Engineer

Principal architect and designer for many successful secure communications products based on TI TMS32010/C20/C25/C30/C50 Digital Signal Processors (DSPs) deployed in Air Force fighters and Navy ships.• Research and development work involving speech recognition, vocoders and diverse modem technologies• Performed extensive DSP hardware, algorithms, software and systems design work involving speech compression and recognition and diverse modems• Managed several HW/SW design, system integration, and software development and test teamsRaytheon subsequently acquired E-Systems.

Aug 1983 - Sep 1993
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Colleagues at Baya Systems

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2 education records

Brian Carlson education

Master Of Science, Electrical Engineering

Southern Methodist University

Bachelor’S Degree, Electrical Engineering

Southern Methodist University
FAQ

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What company does Brian Carlson work for?

Brian Carlson works for Baya Systems.

What is Brian Carlson's role at Baya Systems?

Brian Carlson is listed as Head of Product and Partnerships at Baya Systems.

What is Brian Carlson's email address?

AeroLeads has found 1 work email signal at @nxp.com for Brian Carlson at Baya Systems.

What is Brian Carlson's phone number?

AeroLeads has found 6 phone signal(s) with area code 212, 214, 732, 972 for Brian Carlson at Baya Systems.

Where is Brian Carlson based?

Brian Carlson is based in Austin, Texas, United States while working with Baya Systems.

What companies has Brian Carlson worked for?

Brian Carlson has worked for Baya Systems, Nxp Semiconductors, Intel Corporation, Mipi Alliance, and Texas Instruments.

Who are Brian Carlson's colleagues at Baya Systems?

Brian Carlson's colleagues at Baya Systems include Pete Hsieh, Greene Deanna, Bryan Dick, Aman Kapoor, and Kevin Ginter.

How can I contact Brian Carlson?

You can use AeroLeads to view verified contact signals for Brian Carlson at Baya Systems, including work email, phone, and LinkedIn data when available.

What schools did Brian Carlson attend?

Brian Carlson holds Master Of Science, Electrical Engineering from Southern Methodist University.

What skills is Brian Carlson known for?

Brian Carlson is listed with skills including Product Management, Strategic Partnerships, Embedded Systems, Competitive Analysis, Soc, Semiconductors, Digital Signal Processors, and Wireless.

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