Managed multi-discipline engineering team developing liquid level sensors including PCBs, firmware, mechanical housings.Developed PCBAs & BOMs for multiple products. Managed component ordering for prototypes. Designed circuits to meet Intrinsic Safety requirements.Wrote embedded firmware and served as part of code review board.Evaluated component and PCB trace antennas for cost and TX/RX efficiency. Used outside consultants to review/improve designs. Compared efficiency/cost of BLE Modules with integrated antennas to component-based solutions with on-board or trace antennas. Worked with an outside lab to obtain FCC approvals for designs.Worked with a team to develop overall software architecture for products with multiple processors and external BLE communications. Performed firmware development on additional projects with embedded processors in low power environments.Managed mechanical engineers designing housings to hold electronics and sensors and meet relevant impact resistance requirements.Transitioned products into manufacturing by developing functional test specifications, reviewing manufacturing equipment designs, developing calibration procedures and working with sourcing on initial parts procurement. Managed release of all drawings/specifications into ERP system for manufacturing release.Performed project management activities for teams’ projects using company’s gated development process.Developed product requirements specifications and generated cost estimates, timelines and budgets for the project. Used Jira and Instagantt to track activities and generate timelines. Developed plans for field trials.Recruited and hired staff for the team including training on processes and tools. Managed on-site and remote contractors. Managed summer interns.

Responsible for the engineering department for optical sensor division. Led product development activities for optical components and systems comprising optical/magnetic components. Managed budgets, staffing, contractors and IP protection.Led teams performing design, verification, qualification and manufacturing release for new optical products. Teams were responsible for system architecture, circuit development and package development for optical components including plastic molding. Managed PCB development and release to production. Developed and implemented environmental qualification tests and reliability testing.Implemented a phase gate process for product development. Improved project tracking and control to ensure consistent audit success with ISO 9001 and IATF 16949. Managed staff for project plans and timelines to enable better project reporting and assessments. Managed activities and multi-site gate reviews.Developed guidelines for product development and reliability testing. Established standards for the engineering department using industry best practices for testing and environmental qualification. Developed process for patent submission and application development using an outside law firm. Wrote/co-wrote patent disclosures for projects with 12 total filings with USPTO and eight issued patents. Developed and presented roadmaps and product demonstrations at customers in US, Europe and Asia. Attended voice-of-customer meetings during early product concept development. Partnered with the product management team on roadmaps for next generation products and developed staffing plans to enable proper resources for projects. Created technical roadmaps to align with product line management roadmaps.Team was responsible for supporting two internal and one external factory for production of existing products and release of new products into Manufacturing.

Experienced Engineering Manager / Project Lead / Software Developer with an extensive background in embedded systems engineering. Strong blend of business acumen and technical skills with excellent communication skills. Experienced manager of technical teams. Extensive experience managing client and partner relationships. Strong development experience in C/C++.

Responsible for technical sales and post-sale customer support for DSP licensing business. Managed internal applications engineering team developing audio and voice firmware. Developed product collateral and training and provided on-site training for customers, DSP field application engineers and sales teams. Worked with partners to develop software modules and qualify modules for customer use.

Applications Team ManagerResponsible for applications-related software and hardware technology development for LSI DSPs. Managed internal and external hardware and software projects to develop customer ready application modules for audio, video and voice markets. Worked with multiple software companies to develop audio and video codecs including MP3, WMA, MPEG-4, AAC, aacPlus, H.264, Ogg-Vorbis. Wrote and reviewed contracts and statements of work for modules. Lead team to internally develop voice software applications for VoIP and VoWiFi applications. Managed team designing evaluation boards incorporating DSPs and FPGAs. Responsible for implementing audio/video demonstration platforms on evaluation boards. Wrote and reviewed customer collateral such as user guides, API library descriptions and example system guidelines. Supervised team supporting customers employing modules in their end products.Verisilicon acquired the ZSP division from LSI Logic in 2006.