Customer Engineer
Returned to IBM Burlington in march after 10 months on temporary assignment in GlobalFoundries Malta site. On July 1, 2015, IBM divested its Microelectronics division to GlobalFoundries.
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@globalfoundries.com
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2 phones found area 408
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Bill Eakin is listed as Retired Customer Engineer at GLOBALFOUNDRIES based in Colchester, Vermont, United States. AeroLeads shows a work email signal at globalfoundries.com, phone signal with area code 408, and a matched LinkedIn profile for Bill Eakin.
Bill Eakin previously worked as Customer Engineer at Globalfoundries and Customer Engineer for 20nm and 14nm Technologies at Ibm And Global Foundries. Bill Eakin holds Ms. Mse, Enigineering from Lehigh University.
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Employed from 1991 to 2015 at IBM's Essex Junction 200mm wafer fab. Worked the first 5 years as a photo lithography engineer for the world's first dual damascene process. This responsibility evolved into the role as lead integration engineer for wiring, contacts and via levels during the era between 1um CMOS and 180nm CMOS. Honed device skills during 8 year stint in characterization as a Characterization engineer and engineering manager. The past 5 years have been in various positions within the IBM Quality Organization.EducationBSEE Lafayette College '87, Easton PA Eta Kappa NuMSMSE Lehigh University '91, Bethlehem PAInterestsFine Cabinetmaking - the "Fine" part is more goal than rankingWoodworking Hand Tool Collecting - I have great respect for the masters of the past who built wonderful pieces of furniture with such primitive, yet beautiful, tools. Restoring vintage tube electronicsPolitics - a past time that waxes and wanes over the years
Listed skills include Semiconductors, Cmos, Engineering Management, Characterization, and 11 others.
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Essex Junction, VT
Returned to IBM Burlington in march after 10 months on temporary assignment in GlobalFoundries Malta site. On July 1, 2015, IBM divested its Microelectronics division to GlobalFoundries.
Customer Engineers are the primary engineering interface for new product introduction to assure a seamless product ramp. Duties include: 1) gathering, documenting and executing any special customer requirements; 2) providing CPI samples; 3) regular status updates; 4) manage communications between the client's product engineering team and the fab's.
Malta, NY
Client facing engineer, New Product Introduction for clients in 20nm and 14nm technologies
Burlinton, VT
Lead customer Quality Engineer interfacing with Sony Computer Entertainment. Products serviced included PS-3 Game Processor (65nm and 45nm technologies), Still and video camera processors. This was a great assignment working with a great customer in a joint venture environment.After a re-organization when IBM Microelectronics entered into the Foundry.
Burlington, Vermont Area
Multiple positions (in ascending order through time):1. I-Line Litho Engineer and Level Owner for Aluminum Sub-etch, Tapered Via, and Dual Damasecene levels2. MOL/BEOL Integrator.5um through 180nm nodes3. Inline Characterization engineer4. Manger BEOL Inline Characterization Dept5. PowerPC Product Characterization.5um through 130nm nodes
Allentown, Pennsylvania Area
Entrepreneur. Created both start ups. PDMC was a political campaign consulting company providing Pennsylvania democrats with computer services for generating targeted mailing labels for campaign literature. Experience highlighted the lack of medium sized lettershop service providers in eastern PA. This led to the creation of Keystone Mailers. Keystone.
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Bill Eakin is listed as Retired Customer Engineer at GLOBALFOUNDRIES.
AeroLeads has found 1 work email signal at @globalfoundries.com for Bill Eakin.
AeroLeads has found 2 phone signal(s) with area code 408 for Bill Eakin.
Bill Eakin is based in Colchester, Vermont, United States.
Bill Eakin has worked for Globalfoundries, Ibm And Global Foundries, Global Foundries, Ibm, and Ibm Microelectronics.
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Bill Eakin holds Ms. Mse, Enigineering from Lehigh University.
Bill Eakin is listed with skills including Semiconductors, Cmos, Engineering Management, Characterization, Product Development, Process Integration, Rf, and Start Ups.
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