Bill Donegan work email
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Bill Donegan personal email
Experienced design and applications engineer in microelectronics. * Highly motivated, self-directed, can work alone or in a team.* Oriented towards problem prevention.* Capable of assembling and leading ad hoc cross functional teams.* Experienced in chip design and layout. Background in circuit board design and layoutSpecialties: Assembling and leading cross-functional, multi-site, international teams to complete a design. Logic design, simulation, timing, chip / package layout, test program generation.PowerPC, embedded DRAM, High-Speed Serial links, PCI-Express, InfinibandLaminate design, mutli-chip modules, RoHS issues.
Ibm
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RetiredIbm Mar 2009 - Present
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Senior Applications EngineerInternational Business Machines 2002 - 2009Armonk, New York, Ny, Us* Drove chip and package design teams for more than 50 different parts to ensure first time right tape-outs on schedule. Coordinated the design of custom circuits and custom packages needed by these parts.* Performed detailed technical sizings on proposed chip and package designs.* Created and maintained technical documentation.* Organized ad-hoc cross-functional teams to solve problems at they arose.* Resolved problems with models and design tools used in chip and package designs. -
Senior Field Applications EngineerInternational Business Machines 1997 - 2002Armonk, New York, Ny, Us* Worked with customer to understand the application. Recommended design solutions. Documented the customer requirements so that development could respond to the requests for quote. This led to about 40 design ins of ASIC, custom, PowerPC, and other standart parts, as well as circuit boards and assembly services. * Coordinated with sales team.* Performed detailed technical sizings on proposed chip and package designs.* Created and maintained technical documentation.* Organized ad-hoc cross-functional teams to solve problems at they arose.* Resolved problems with models and design tools used in chip and package designs.
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Advisory Applications EngineerInternational Business Machines 1994 - 1997Armonk, New York, Ny, Us* Performed detailed technical sizings on proposed chip and package designs.* Created and maintained technical documentation.* Organized ad-hoc cross-functional teams to solve problems at they arose.* Resolved problems with models and design tools used in chip and package designs.
Bill Donegan Skills
Bill Donegan Education Details
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Champlain CollegeSoftware Engineering -
Syracuse UniversityComputer Engineering
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Rutgers UniversityElectrical Engineering
Frequently Asked Questions about Bill Donegan
What company does Bill Donegan work for?
Bill Donegan works for Ibm
What is Bill Donegan's role at the current company?
Bill Donegan's current role is Retired from IBM.
What is Bill Donegan's email address?
Bill Donegan's email address is w.****@****eee.org
What schools did Bill Donegan attend?
Bill Donegan attended Champlain College, Syracuse University, Rutgers University.
What skills is Bill Donegan known for?
Bill Donegan has skills like Logic Design, Simulation, Powerpc, Pcie, Timing, Simulations, Asic, Eda, Semiconductors, Microprocessors, Ic, Embedded Systems.
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