Bill Mace Email & Phone Number

United States

Austin, Texas Area

Part time consultation - engaged in the solution of electronic packaging and assembly process issues on a variety of commercial, military and government products. Products range from human implantable electronics to advanced sensing and measurement systems. As part of my activities I provide 3-D modeling of design concepts that can be input to 3-D printers. Rapid turn capability for design iteration evaluations is provided. Other prototyping capabilities are provided through the use of the TechShop facilities.

Austin, Texas Usa

I am still retired but I will be keeping up with technical issues by participating in the activities of the Central Texas Electronics Association. My role will be to help secure topics and speakers for our meetings. The CTEA is the focal point for the Surface Mount Technology Association and the International Microelectronics and Packaging Society in Central Texas.

Austin, Tx

Responsible for social media broadcasts for our meetings

Austin, Texas Metropolitan Area

Austin, Texas Area

Performing part-time consulting to Criteria Labs programs. Work includes tooling design, process set-up, testing, electronic packaging materials selections e.g. underfills, encapsulants, solders etc. Assist at certain customer meetings to provide early project input as required.

Austin, Texas

Part-time activity providing support for re-packaging of optical component.

Austin, Texas

Part-time activity providing electronic packaging and materials guidance to the new products developed by the Solar Power Technologies team.

Responsible for reviewing and inputting well drilling and production data for Jones energy gas wells. Maintain records of field assets, assign assets and assign field employees to well support activities.

Managed one engineer, two technicians and four operators. Responsible for packaging development and NPI support. Also responsible for a two shift assembly operation. TeraVicta developed and manufactured an RF MEMS switch packaged on a ceramic substrate with a hermetic lid enclosure. While there I trained employees in FMEA preparation and deployment. I prepared and revised many of our process documents and trained employees on their use.

Austin, Texas Area

At Freescale Semiconductor I was a platform manager, responsible for flip chip on ceramic platform packages. The chip families using this platform type were complex high I/O microprocessors.

Austin, Texas Area

At Peak I worked with customers on tray and waffle pack designs and materials to provide an optimum cost effective solution for their component shipping and storage needs.

Austin, Texas Area

While at Jempac I established the process FMEA for the product. I also worked on the tooling and assembly issues and how best to apply the proprietary encapsulant material Jempac developed.

Huntsville, Al, Endicott, Ny, Austin, Tx

I began my career at IBM in their Federal Systems Division. I was responsible for non-metallic materials selection and application for products deployed on NASA space programs. I also did the same activity in support of IBM products built for the Army, Air Force and Navy. I maintained a Secret clearance. Eventually I moved to the Office Products Division and supported printer development materials applications and finally to the Systems Technology Division where I established the plastic packaging lab for electronic packaging development. I retired from IBM in1992.