Bimal Shah Email & Phone Number

Bengaluru, Ka, In

Bengaluru, Karnataka, India

Relocated to India to establish and lead Intel’s Product Quality and Reliability team, driving CPU and SoC product qualification, strategic planning, post-launch support, and in-depth reliability analysis. My team delivers voltage guardband strategies, DPM assessments, and reliability modeling, ensuring optimized performance and cost-efficiency for Intel’s cutting-edge products. Collaborating with Technology Development, Design, Architecture, and Marketing teams, we develop advanced… Show more Relocated to India to establish and lead Intel’s Product Quality and Reliability team, driving CPU and SoC product qualification, strategic planning, post-launch support, and in-depth reliability analysis. My team delivers voltage guardband strategies, DPM assessments, and reliability modeling, ensuring optimized performance and cost-efficiency for Intel’s cutting-edge products. Collaborating with Technology Development, Design, Architecture, and Marketing teams, we develop advanced methodologies and lead customer communication on product reliability. As team leader, I define priorities, drive cross-functional results, foster an inclusive culture, and oversee the Product Quality Network at Intel’s Bangalore site. Show less

Chandler, Arizona

Leading my team, we drive the development, definition, and certification of test processes for Intel’s next-generation products. Our focus is on creating efficient, cost-effective test processes that maximize yields and reduce miscorrelation rates while ensuring the highest quality and reliability for Intel’s customers. We spearhead strategic initiatives to develop and qualify technology solutions that address increasing product complexity, playing a key role in transitioning from development… Show more Leading my team, we drive the development, definition, and certification of test processes for Intel’s next-generation products. Our focus is on creating efficient, cost-effective test processes that maximize yields and reduce miscorrelation rates while ensuring the highest quality and reliability for Intel’s customers. We spearhead strategic initiatives to develop and qualify technology solutions that address increasing product complexity, playing a key role in transitioning from development to manufacturing and standardizing critical business processes to support Intel’s evolving product roadmap. Show less

Chandler, Az

Led complex development initiatives for High Density Modular Tester (HDMT) programs, managing testing protocols for next-generation microprocessors across wafer, die, and package levels, while integrating advanced RF and high-power/performance capabilities. Oversaw schedule adherence, cost management, risk mitigation, and resource planning for multi-million dollar programs with teams of over 30 engineers. From concept to full-scale implementation, drove the design, development, validation, and… Show more Led complex development initiatives for High Density Modular Tester (HDMT) programs, managing testing protocols for next-generation microprocessors across wafer, die, and package levels, while integrating advanced RF and high-power/performance capabilities. Oversaw schedule adherence, cost management, risk mitigation, and resource planning for multi-million dollar programs with teams of over 30 engineers. From concept to full-scale implementation, drove the design, development, validation, and deployment of key technical capabilities across Intel's manufacturing facilities. Show less

Chandler, Arizona

Spearheaded the creation and qualification of the semiconductor industry's first Know-Good-Die (KGD) solution, setting a new industry benchmark and providing Intel with a sustained competitive edge.Led groundbreaking advancements in multi-million dollar test equipment, achieving industry-leading cost efficiency and generating over $1 billion in ROI over ten years.Orchestrated end-to-end process development, including innovative process steps, KPI optimization, and seamless integration… Show more Spearheaded the creation and qualification of the semiconductor industry's first Know-Good-Die (KGD) solution, setting a new industry benchmark and providing Intel with a sustained competitive edge.Led groundbreaking advancements in multi-million dollar test equipment, achieving industry-leading cost efficiency and generating over $1 billion in ROI over ten years.Orchestrated end-to-end process development, including innovative process steps, KPI optimization, and seamless integration from prototyping to High Volume Manufacturing (HVM).Directed global cross-functional collaboration with suppliers in Japan, China, the USA, Malaysia, and India, enhancing project success and fostering strong international partnerships.Managed and mentored a cross-functional team of 30+ engineers across diverse domains, driving excellence and innovation.Awarded Intel’s highest honor for Innovation and Execution Excellence, recognizing exceptional contributions to the industry. Show less

Chandler, Arizona

Led the comprehensive development and deployment of assembly and test processes for Intel's inaugural genuine Mobile product, navigating over 60 complex steps from development through High Volume Manufacturing (HVM) in Malaysia and China.Drove product advancement by steering path-finding initiatives, defining parameters, and ensuring alignment across teams. Managed a cross-functional team of 20+ engineers across the USA, China, and Malaysia.Innovated NPI Methodology, achieving an… Show more Led the comprehensive development and deployment of assembly and test processes for Intel's inaugural genuine Mobile product, navigating over 60 complex steps from development through High Volume Manufacturing (HVM) in Malaysia and China.Drove product advancement by steering path-finding initiatives, defining parameters, and ensuring alignment across teams. Managed a cross-functional team of 20+ engineers across the USA, China, and Malaysia.Innovated NPI Methodology, achieving an 80% reduction in Time-to-Market through optimized test flows.Oversaw comprehensive project management, including scope, costs, and risks, conducting Design of Experiments (DOEs), Failure Mode and Effect Analysis (FMEA), and integrated risk assessments.Delivered cutting-edge technology with a record-setting timeline of 6 months from initial Silicon to full Product Qualification, saving over $2 million and earning Intel’s highest award for Innovation and Execution Excellence. Show less

Chandler, Arizona

Led critical test technology development for Intel’s Chipset and Desktop products, managing the entire product lifecycle from Path-finding to factory ramp-up.Drove the implementation of 10+ process steps and six advanced test tools, ensuring technical excellence and quality.Led New Product Introduction (NPI) and applied Statistical Process Control (SPC) to ensure product reliability.Successfully launched multiple products across global manufacturing sites in Malaysia and… Show more Led critical test technology development for Intel’s Chipset and Desktop products, managing the entire product lifecycle from Path-finding to factory ramp-up.Drove the implementation of 10+ process steps and six advanced test tools, ensuring technical excellence and quality.Led New Product Introduction (NPI) and applied Statistical Process Control (SPC) to ensure product reliability.Successfully launched multiple products across global manufacturing sites in Malaysia and China.Recognized with multiple awards for outstanding contributions and innovation. Show less

Chandler, Arizona

Engineered innovative burn-in test equipment and process solutions for mobile bare die and CPU products, driving advancements across multiple silicon generations.Developed test equipment, tooling, and metrology solutions, scaling processes across Intel’s global manufacturing sites (Israel, Costa Rica, Malaysia, China, Philippines).Delivered multi-million dollar tools on budget and on schedule, achieving over $10 million in cost savings.Pioneered technologies like package shorts… Show more Engineered innovative burn-in test equipment and process solutions for mobile bare die and CPU products, driving advancements across multiple silicon generations.Developed test equipment, tooling, and metrology solutions, scaling processes across Intel’s global manufacturing sites (Israel, Costa Rica, Malaysia, China, Philippines).Delivered multi-million dollar tools on budget and on schedule, achieving over $10 million in cost savings.Pioneered technologies like package shorts detection, dynamic thermal control, and burn-in testing for SRAM, significantly improving functionality and efficiency.Led the transition from LGA to BGA in Intel’s Test on Balls (ToB) conversion, optimizing cost, yield, and quality from prototype to factory ramp-up. Show less

Master Of Business Administration - Mba, Business Administration And Management, General, Gpa: 3.98

Leading With Finance, Finance, General

Ms, Mechanical Engineering, Gpa: 3.83

Activities and Societies: Certification in Electronic Packaging

Be, Mechanical Engineering

Activities and Societies: Debate Team, Cultural Festival Organization