Partner/Cto
CurrentFocusing on Semiconductor industry investment especially EV industry
Mar 2022 - Present
AeroLeads people directory · profile
Bin Lu Email & Phone Number
A Maker in my heart
at
Summitview Capital
1 work email found
@summitviewcapital.com
LinkedIn matched
✓ Verified May 2026
4 data sources
Profile completeness 100%
Current company
Role
A Maker in my heart
Location
Saratoga, California, United States
Who is Bin Lu? Overview
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Quick answer
Bin Lu is listed as A Maker in my heart at Summitview Capital, based in Saratoga, California, United States. AeroLeads shows a work email signal at summitviewcapital.com and a matched LinkedIn profile for Bin Lu.
Bin Lu previously worked as Partner/CTO at Summitview Capital and Chief Executive Officer at Boardup. Bin Lu holds Master Of Science - Ms, Electrical, Electronics And Communications Engineering from Tsinghua University.
Company email context
Email format at Summitview Capital
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{first_initial}{last}@summitviewcapital.com
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AeroLeads found 1 current-domain work email signal for Bin Lu. Compare company email patterns before reaching out.
Profile bio
About Bin Lu
Excellent on emebedded software system design/ debugging/ hardware schematic design. and engineering team management. A firm believer of MVP, Successfully launched several products. Ran from concept, system design, verificaiton to NPI, Mass production.Angel investor. Invested in:thinnectIntravu MedicalAudience AwardsChimera BiaengineeringDellferFlumeFront Range BioscienceMissionBioMovellusQurasenseStreanlyne
Listed skills include Embedded Systems, Embedded Software, Soc, Wireless, and 7 others.
Current workplace
Bin Lu's current company
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8 roles · 23 years
Bin Lu work experience
A career timeline built from the work history available for this profile.
Chief Executive Officer
Current- Manage various external agents to build a patented electric foldable skateboard.,
- Successfully completed online market research, Kickstarter campaign, setup overseas manufacture, and built up brand recognition by improving user experience from online represents, order, open box, and RMA.
- Developed a Bluetooth earphone which detects if one falls asleep, reduces the volume, then finally shuts off automatically. Designed the hardware and wrote software using 3D accelerometer sensor and 3D gyro.
- Developed and sell a few other electronic(IOT) products based on Nordic52810 and Lora, NBIOT module. Wrote a whole wirless communication protocol stack
- Consultant work on a Micro-Invasive Diagnostic Arthroscopy system design.
- Consultant work on laser scan 2D image measurement device and OCR using machine learning and AI.
Sep 2016 - Present
System/Asic Design Director
Responsible for sucurity system software and hardware architecture design. Implementation and verification on Xilinux Zynqmp FPGA platform
Oct 2021 - Mar 2022
Cto Cofounder
Epalmpay Network
- Managed engineering teams, developed and marketed mobile payment device and transaction payment software system, provided the mobile payment service to local retailers.
- Developed dual-sim iPhone companion using Bluetooth. Designed the software structure and hardware schematic.
- Developed wearable IOT device using TI CC2541 BLE for seaman rescue application.
- Hosted weekly meetings to collaborate with team members on goal implementation.
- Built relationships with customers to communicate issues and improvement suggestions.
- Planned and directed workflow, assembly methods, and workforce utilization.
Aug 2008 - Jun 2014
Svp Of Engineering
Spreadtrum Communication
Developed and marketed GSM/GPRS/EDGE/3G chipset (Several generation including various cost down versions) with rich multimedia functions and total software solution including protocol stack. Worked with marketing/sales team to define Chip system function specification especially Camera ISP function and video encoding/decoding. Overall chip and board level.
2003 - 2008
~5 yrs
Senior Embedded Software Engineer
Worked with Asic team to define chip function block best for overall performance while keep the die cost low. Successfully completed all software design, development and integration assignments on time.Designed and developed debugging tools.Created and updated software requirement and specification documents.Defined and developed the software Architecture.
Jul 2001 - Aug 2003
Senior Software Engineer
Design/debug chipset driver software,lower layer protocol stack. performance optimization.
Jul 1998 - Jun 2001
Senior Software Engineer
Developed digital wireless communication basestation using DECT technology. Developed PCB board. Driver software, protocal stack.
Mar 1996 - Jun 1997
3 education records
Bin Lu education
Master Of Science - Ms, Electrical, Electronics And Communications Engineering
Tsinghua University
Bachelor Of Science - Bs, Electrical And Electronics Engineering
Beijing Institute Of Technology
Emba, Business Administration And Management, General
China Europe International Business School (Ceibs)
FAQ
Frequently asked questions about Bin Lu
Quick answers generated from the profile data available on this page.
What company does Bin Lu work for?
Bin Lu works for Summitview Capital.
What is Bin Lu's role at Summitview Capital?
Bin Lu is listed as A Maker in my heart at Summitview Capital.
What is Bin Lu's email address?
AeroLeads has found 1 work email signal at @summitviewcapital.com for Bin Lu at Summitview Capital.
Where is Bin Lu based?
Bin Lu is based in Saratoga, California, United States while working with Summitview Capital.
What companies has Bin Lu worked for?
Bin Lu has worked for Summitview Capital, Boardup, Axiado Corporation, Epalmpay Network, and Spreadtrum Communication.
How can I contact Bin Lu?
You can use AeroLeads to view verified contact signals for Bin Lu at Summitview Capital, including work email, phone, and LinkedIn data when available.
What schools did Bin Lu attend?
Bin Lu holds Master Of Science - Ms, Electrical, Electronics And Communications Engineering from Tsinghua University.
What skills is Bin Lu known for?
Bin Lu is listed with skills including Embedded Systems, Embedded Software, Soc, Wireless, Arm, Consumer Electronics, Device Drivers, and Digital Product Development.
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