Bk Tan Email & Phone Number

Bayan Lepas, Penang, Malaysia

Bayan Lepas, Penang, Malaysia

(A) Engineering Duties & Responsibilities :• Functioned as a Program Manager and Subject Matter Expert at FOL(Front of Line) Assembly Processes & Equipment.• Project leader to manage and coordinate improvement projects through initiation, planning, design, execution, monitoring, controlling and closure of the project by ensure each project meets timeline, budget, resources, volume production and line performance requirement based on basic project management skills.• Review the overall FOL assembly operations to identify the area of improvement for quality, productivity & cost savings project opportunity.• Review the capacity of existing/new product and identified material & equipment to be purchased. • Review and improve current manual processes through automation project in order to improve overall quality, cost & productivity.(B) Project accomplished are :• Automation Project Qualificationa) Open Short Test Handler Machine instead of manual handling with improvement on productivity, quality & cost saving.b) Integrated Die Blowing & Waffle Pack Cleaning Machine instead of manual handling with 10% productivity improvement and process simplification.• Operations(Quality, productivity & cost) Improvement Projectsa) Qualified Datacon Chameo Flip Chip Bonder to increase 30% capacity with cost avoidance due to capacity shortage.b) Reinforcement of Datacon Chameo Flip Chip Bonder platform to improve machine stability & processing speed with 15% productivity improvement. c) Single reflow processes machine parameter improvement to achieve 20% capacity increased.

Perak, Malaysia

(A)Engineering Duties and Responsibility :-• Attached to Front of Line (FOL) assembly in Advanced Packaging (Flip Chip QFN, SS/SIP BGA/LGA/FC, SIPMLPQ, SIPMLP Coper Clip and LED) product line.• Overall for wafer mount & saw, die attach, flip chip, wire bond and SMT (screen print, component mount, underfill, solder dispense, oven reflow & flux clean) processes• Managed a team of 4 engineers and 9 technical specialist and process technicians to drive their performance to achieve process yield, cost and equipment uptime and process quality control.• Coordinate the transfer of new products/process from R&D group for whole assembly processes.• Work with relevant development functions for process development, process optimization, new material phase-in, new equipment buy-off and installation.• Work interactively with internal (manufacturing, sales, purchasing, logistic, quality & engineering) and external (customers and suppliers) to seek out refinements and improvements to product quality, productivity and cost.• Overall engineering yield and improvement plan preparation and presentation for the customer Quarterly Business Review (QBR) and department Operation Review with Management.(B) Project accomplished are :• Lead frame design changed and Hitachi tape implementation on FCQFN product to improve assembly yield and quality to achieve >99% with total cost savings of yield loss RM345k/year.• Qualification of alternative flux clean material (Kyzen) with extend shelf life control and achieved cost saving RM300k/year.• Implementation of 30cc syringe solder dispense to reduce wastage and change event down time which able to achieve cost saving RM100K/year.• Qualification of new flip chip bonder (ESEC 2100FC) and new reflow oven (Heller) to improve productivity on package FCQFN by increase the capacity 100% and improve the flexibility of logistic planning.

Perak, Malaysia

(A) Engineering Duties, Responsibility and Project accomplished are:-• Attached to Front of Line (FOL) assembly in wafer back grinding, wafer mount & saw, die attach and die coating process for PDIP/PLCC/SOICN/SOICW packages.• Coordinator for overall 3rd optical yield and QA gate ppm improvement.• Coordinator for overall assembly yield (FOL & EOL) improvement for few key customers.• Start up and qualify new processes on new product for customer.• Prepare technical document and specifications for current and new product.• Conduct engineering evaluation to optimize, control and improve the quality of processes and products.• Examine and troubleshoot problems on process and equipment to improve process margin, stability and capacity of products.• To provide customer proper visibility of their products by sending relevant reports such as Yield, SPC data and maintaining good communication relationship with customer personnel.• Prepare Design of Experiment (DOE) and Monthly Improvement Projects for presentation in Operation Review with Management.• Respond to customer complaints, investigate the root cause and implement corrective action plans to resolve quality issues. • Focus team member on any engineering build and quality issue to ensure customer related processes are followed to guarantee the highest product quality possible.• Project accomplished as below: Implementation of tighten epoxy SR4 and with syringe 10cc for quality improvement and cost saving. Implementation of manual detaping jig to improve wafer breakages due to handling issue. Implementation of lead frame pickup holder with fix dimension to improve setup time at DA process. Implementation of wrong orientation pin detector to prevent wrong lead frame orientation at DA process. Qualify die coat process on SLP packages. Modified clamper on Dias machine for better marking on lead frame rail.