Research And Development Engineer
Wets and Deps Process Engineer (July, 2023 - March, 2024) -Assisted in the execution of wafer fabrication processes, including cleaning, patterning, deposition, etching, and metrology, by operating various nanofabrication tools. Primary responsibilities involved processing lots through Chemical Bath Deposition (CBD) and Plasma/Chemical Vapor Deposition (PVD/CVD) to meet specified requirements. Additional tasks included packaging lots for singulation and performing coating, cleaning, assembling, and inspection using relevant packaging and metrology equipment.Laser Dicing Technician (March, 2024 - September, 2024) -Operated and maintained advanced laser dicing equipment to achieve precise cutting of semiconductor wafers and other R&D materials. Key responsibilities included generating and converting file formats using post-processing software, developing customized laser recipes for new materials to enhance cutting performance, and implementing Statistical Process Control (SPC) for various testing machines, including tensile, fatigue, rheology, and structural tests.