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@micron.com
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3 phones found area 503 and 208
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Harry Bloom is listed as Engineer | Product Development Expert | Leader at Micron Technology, based in Boise, Idaho, United States. AeroLeads shows a work email signal at micron.com, phone signal with area code 503, 208, and a matched LinkedIn profile for Harry Bloom.
Harry Bloom previously worked as Engineering Execution Manager - High Bandwidth Memory Product Engineering at Micron Technology and Development Lead - MNAND MCP Product Engineering at Micron Technology. Harry Bloom holds Bachelor’S Degree, Electrical And Computer Engineering from Oregon State University.
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AeroLeads found 1 current-domain work email signal for Harry Bloom. Compare company email patterns before reaching out.
I am an experienced Electrical Engineer and Technical Program Manager with nearly 10 years of expertise in Product Development and Management across a spectrum of next gen memory products including DRAM, NAND, UFS, ASIC, and High Bandwidth Memory. I have a proven track record of product lifecycle management success, having led multiple cutting-edge technology NPI programs to achieve product qualification and HVM product launch. Known for a concise and personal leadership style, I excel in fostering environments where efficiency and approachability go hand-in-hand. My goal is to be a catalyst for continuous improvement and positive team culture, elevating morale while driving productive outcomes. I am excited to apply my combination of technical expertise, servant leadership, and culture-building skills to innovative technologies, leading teams towards technological advancements while maintaining a people-oriented culture that drives continuous innovation.
Listed skills include Communication, Teamwork, Circuit Design/Simulation, Data Mining And Analysis, and 9 others.
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Boise, Idaho, US
o Responsible for product development deliverables and milestones for Micron’s Next Gen High Bandwidth Memory Product line designated for artificial intelligence and High-Performance Memory Customers. o Support HBM programs through various NPI phases including product concept, design, roadmap planning, execution, and ramping high volume manufacturing by.
Boise, Idaho, US
o Leader to a team of skilled engineers who collectively represent MCP PE for Micron's Global NPI MCP portfolio. Responsible and accountable for MCP PE activities and serve as cross-functional point of contact for MNAND LPDRAM related items and overall MCP PE product execution (LP4/5+NAND+ASIC).
Boise, Idaho, US
o MCP PE Lead and global PDT representative on 5 MNAND programs o Successfully Qualified and ramped to HVM 5 programs that incorporated combinations of LPDRR4 LPDDR5 & UFS3.0/UFS4.0 (DRAM, NAND, ASIC).o Responsible for defining MCP testing flows, test optimization and development, yield optimization and forecasting, quality monitoring, supporting component.
Boise, Idaho, US
Product Engineering Lead for 7 Automotive LPDRAM products. o Responsible for overall product performance including maintaining yields, qualifications, managing excursions, RMA support, technical debug, disposition management, and overall engineering ownership. o Ensured HVM stage, high revenue products were moving through production flow without issue and.
Boise, Idaho, US
Member of the core product engineering team for a mobile LPDDR4 design. Our team was responsible for the development, verification, validation and product ramp of a new LPDRAM product.
Elected Chief of Staff for the Micron employee resource group: Micron Young Professionals
Corvallis, OR, US
Worked 20+ hours a week during the entirety of my OSU education.
Arlington, Virginia, US
Substitute teacher for DODEA pacific school region during college winter and summer breaks, Positions held in Japan and Guam.
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Harry Bloom works for Micron Technology.
Harry Bloom is listed as Engineer | Product Development Expert | Leader at Micron Technology.
AeroLeads has found 1 work email signal at @micron.com for Harry Bloom at Micron Technology.
AeroLeads has found 3 phone signal(s) with area code 503, 208 for Harry Bloom at Micron Technology.
Harry Bloom is based in Boise, Idaho, United States while working with Micron Technology.
Harry Bloom has worked for Micron Technology, Micron Young Professionals, Oregon State University, and Dodea.
You can use AeroLeads to view verified contact signals for Harry Bloom at Micron Technology, including work email, phone, and LinkedIn data when available.
Harry Bloom holds Bachelor’S Degree, Electrical And Computer Engineering from Oregon State University.
Harry Bloom is listed with skills including Communication, Teamwork, Circuit Design/Simulation, Data Mining And Analysis, C/C++ Stl, Cad, Matlab, and Plc Ladder Logic.
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