Engineering Execution Manager - High Bandwidth Memory Product Engineering
Currento Responsible for product development deliverables and milestones for Micron’s Next Gen High Bandwidth Memory Product line designated for artificial intelligence and High-Performance Memory Customers. o Support HBM programs through various NPI phases including product concept, design, roadmap planning, execution, and ramping high volume manufacturing by employing cross functional life cycle management. o Provide leadership and direction to various product development teams by defining and prioritizing projects, identifying issues and risks, establishing parameters and resources needed to meet development timelines and by leading technical and tactical teams for real time critical issue resolution. o Represent Product Engineering teams in product development forums and day-day execution and serve as a primary liaison between Engineering teams and other cross functional teams. o Provide engineering input, technical recommendations, and engineering status updates to cross functional organizations including Business Unit, Global Quality, Supply Chain, Procurement, Test.o Manage engineering product sample execution, ensuring all internal and critical customer samples meet required vintage, test coverage, quality, and schedules. Provide regular status updates to Senior Leaders.o Oversee HBM product line end-end, serving as the program point of contact for execution issues and risks through all steps of the product flow, including fabrication, wafer test, assembly, backend test, and product shipment.
