Bob Malone Email & Phone Number

Neubiberg, München, DE

• Responsible for reengineering the company’s test development process in a lean way to ensure low cost, high quality and short time to market for a diverse set of products ranging from discrete power semiconductor.
• Responsible for defining, implementing and improving the company’s requirements driven test technology development process needed to support the introduction and ramp up of roadmap test technologies at internal and.

• Staffed, mentored and managed globally dispersed test development and manufacturing engineering teams who defined, developed, implemented and improved production test solutions for power management and class D audio.
• Provided leadership in the definition, implementation and continuous improvement of the company’s test technology roadmap, tools, standards and procedures for new product development.
• Defined, implemented and improved the company’s Quality Management System (QMS) for Test Engineering which was used to reduce costs, improve quality and time to market for new products.
• Defined, implemented and improved a test hardware development process that enabled verification and validation of new designs prior to transfer and release to production.
• Managed development projects using traditional and Agile project management methodologies.

Wilmington, MA, US

• Defined, developed, implemented and improved characterization and high volume production test solutions for MEMS accelerometers, gyroscopes and optical cross connect mirror arrays.
• Selected, hired, trained and mentored multi-disciplined staff of engineers and technicians responsible for supporting the development of new products and improvement of existing products.
• New product (NPI) responsibilities included the design and development of hardware and software for characterization and production test, Design Failure Modes and Effects Analyses (FMEAs), LabVIEW based bench level.
• Worked with Marketing and Sales to create derivative new products for applications including the IBM ThinkPad, Nintendo Wii and various automotive safety systems.
• Worked with Operations to implement cost reduction and quality improvements on released products.
• Member of corporate level team responsible for evaluating, selecting and implementing the company’s next generation of analog and mixed signal IC test platforms.

Wilmington, MA, US

• Designed and developed custom Multi-Chip Modules (MCM) including a voice encryption unit for a Japanese cellular telephone system and a guidance / control unit for a smart munition. These products included digital.
• Responsible for the detailed design of products including schematic capture, layout, packaging, test development and project management.
• Worked directly with customers from product concept through release to production. Also supported customers in resolution of system level issues such as EMI reduction.
• Received letters of commendation from customers and management on several multi-million dollar programs.

Wilmington, MA, US

• Designed and developed standard hybrid data conversion products for commercial, industrial and defense signal processing applications.

Master'S Degree, Electrical Engineering

Bachelor'S Degree, Electrical Engineering

Education record