Bob Malone Email & Phone Number

Boston, Ma, Us

Neubiberg, München, De

• Responsible for reengineering the company’s test development process in a lean way to ensure low cost, high quality and short time to market for a diverse set of products ranging from discrete power semiconductor devices to SOC.• Responsible for defining, implementing and improving the company’s requirements driven test technology development process needed to support the introduction and ramp up of roadmap test technologies at internal and external production test sites.

• Staffed, mentored and managed globally dispersed test development and manufacturing engineering teams who defined, developed, implemented and improved production test solutions for power management and class D audio ICs and modules, advanced power MOSFET and IGBT devices, and GaN technologies.• Provided leadership in the definition, implementation and continuous improvement of the company’s test technology roadmap, tools, standards and procedures for new product development.• Defined, implemented and improved the company’s Quality Management System (QMS) for Test Engineering which was used to reduce costs, improve quality and time to market for new products.• Defined, implemented and improved a test hardware development process that enabled verification and validation of new designs prior to transfer and release to production.• Managed development projects using traditional and Agile project management methodologies.

Wilmington, Ma, Us

• Defined, developed, implemented and improved characterization and high volume production test solutions for MEMS accelerometers, gyroscopes and optical cross connect mirror arrays.• Selected, hired, trained and mentored multi-disciplined staff of engineers and technicians responsible for supporting the development of new products and improvement of existing products.• New product (NPI) responsibilities included the design and development of hardware and software for characterization and production test, Design Failure Modes and Effects Analyses (FMEAs), LabVIEW based bench level characterization capabilities, material evaluation and data analysis.• Worked with Marketing and Sales to create derivative new products for applications including the IBM ThinkPad, Nintendo Wii and various automotive safety systems.• Worked with Operations to implement cost reduction and quality improvements on released products. • Member of corporate level team responsible for evaluating, selecting and implementing the company’s next generation of analog and mixed signal IC test platforms.

Wilmington, Ma, Us

• Designed and developed custom Multi-Chip Modules (MCM) including a voice encryption unit for a Japanese cellular telephone system and a guidance / control unit for a smart munition. These products included digital signal processors (DSPs), digital ASICs, RAM, ROM and precision low noise A/D and D/A converters.• Responsible for the detailed design of products including schematic capture, layout, packaging, test development and project management.• Worked directly with customers from product concept through release to production. Also supported customers in resolution of system level issues such as EMI reduction. • Received letters of commendation from customers and management on several multi-million dollar programs.

Wilmington, Ma, Us

• Designed and developed standard hybrid data conversion products for commercial, industrial and defense signal processing applications.

Master'S Degree, Electrical Engineering

Bachelor'S Degree, Electrical Engineering

Education record