Bob Ledoux

Bob Ledoux Email and Phone Number

Senior Hardware Engineer at GE Intelligent Platforms @ GE Intelligent Platforms
st. louis, missouri, united states
Bob Ledoux's Location
Swansea, Massachusetts, United States, United States
About Bob Ledoux

• Lead Architect, work closely with product management to define and architect the ATCA 40GbE Switch Blade. Project Schedules, Cost Estimates. Concept Design• Experience with system and board level design of ATCA packet and switch blades. • Expertise in high speed circuit board design and layout, signal integrity, power distribution, thermal analysis and management, system integration and testing• Expertise in many FPGA designs using both Verilog and VHDL.• Can create debug firmware in C to debug hardware and FPGA designs.• Six-Sigma Training.

Bob Ledoux's Current Company Details
GE Intelligent Platforms

Ge Intelligent Platforms

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Senior Hardware Engineer at GE Intelligent Platforms
st. louis, missouri, united states
Website:
emerson.com
Employees:
48965
Bob Ledoux Work Experience Details
  • Ge Intelligent Platforms
    Senior Hardware Engineer
    Ge Intelligent Platforms Jul 2006 - Present
    Foxboro Ma
    • Lead Architect and Senior Hardware designer on ATCA Blade products (Cavium Based Packet Processor and Fulcrum based 40G Switch Fabric.• Responsible for developing project requirements, schedules, cost estimates, man-power forecast, as well as define the product concept.• Design expertise in high speed circuit board design and layout, signal integrity, power distribution, thermal analysis and management, system integration and test.• Designed the payload FPGAs on the GE ATCA Blade… Show more • Lead Architect and Senior Hardware designer on ATCA Blade products (Cavium Based Packet Processor and Fulcrum based 40G Switch Fabric.• Responsible for developing project requirements, schedules, cost estimates, man-power forecast, as well as define the product concept.• Design expertise in high speed circuit board design and layout, signal integrity, power distribution, thermal analysis and management, system integration and test.• Designed the payload FPGAs on the GE ATCA Blade products. Integrating a number of control plane functions into the FPGAs.• Designed Cavium packet processor modules in the PCI-X/PCIe form factor. Show less
  • Sbs Technologies
    Pricipal Hardware Engineer
    Sbs Technologies Feb 2001 - Jul 2006
    Mansfield Ma
    Designed a number of complex FPGA’s for SBS. • Designed an FPGA that implemented the I-TDM protocol standard (SFP.0/1). I-TDM is a multiplexed voice over packet protocol that is optimized for Voice LANs and Packet Backplanes. The FPGA also includes the following functions: An 8-stream MVIP interface, a 512 channel TSI, dual GbE MAC/PCS cores, various integrated descriptor and Jitter Buffer memories, a 32-bit NIOS-II processor, a DDR and SDR SDRAM controllers.• Designed an ATM cell… Show more Designed a number of complex FPGA’s for SBS. • Designed an FPGA that implemented the I-TDM protocol standard (SFP.0/1). I-TDM is a multiplexed voice over packet protocol that is optimized for Voice LANs and Packet Backplanes. The FPGA also includes the following functions: An 8-stream MVIP interface, a 512 channel TSI, dual GbE MAC/PCS cores, various integrated descriptor and Jitter Buffer memories, a 32-bit NIOS-II processor, a DDR and SDR SDRAM controllers.• Designed an ATM cell auto-discovery and time-stamping function. The FPGA provided UTOPIA II interfaces, a CAM device controller, VPI/VCI re-mapper, time-stamp function, and CRC-32 generator/checker function. • Designed a 1024-channel HDLC controller to POS FPGA. The FPGA provides 8-HMVIP streams to support 32-E1 ports. Each HDLC Channel can support fractional DS0’s. The FPGA supports CCITT-16, CRC-16, and CRC-32. Captured HDLC frames are MPLS tagged and forwarded to a POS interface. The FPGA also provides various OAM statistics, a PPC interface. Also design the following boards:• Designed a PICMG AMC.1 form-factor I/O module to provide an OC3 to PCI-Express SAR function.• Designed a PICMG AMC.1 form-factor I/O module to provide a T1/E1 to GbE inter-working function.* A 6U CPCI 2.16 compliant, 32-Port T1/E1/J1 Monitor card. The blade includes T1/E1 Framers, a 1024-HDLC channel to POS FPGA, WINTEGRA 737 Packet Processor, IPMI function, 2.16 Ethernet, PPMC site. Show less
  • Telco Systems
    Principle Hardware Engineer
    Telco Systems Aug 2000 - Feb 2001
    Norwood Ma
    Designed a 16 channel HDLC Controller FPGA.
  • Meaurement Computing
    Computer Boards (Now Mc Measurement Computing)
    Meaurement Computing Jan 1997 - Jul 2000
    Middleboro Ma
    • Designed a 4-channel 80MHz ADC acquisition PCI module.• Designed a data-acquisition controller FPGA that provided all the control, triggering, time-stamping and programmable buffering for high-speed ADC & DAC boards.
  • Gtech Corporation
    Senior Hardware Engineer
    Gtech Corporation Jan 1991 - Jan 1997
    West Greenwich Ri
    Board Designs:• Contact Image Sensor (CIS) image reader/frame grabber module.• Motorola processor based modules.• Motorola 68HCF11 micro-controller based Smart Card and mag-stripe controller module.ASIC Design:• Designed a 20K gate 0.85u AMI standard cell gate array. The design consolidated the following functions: Keyboard controller, LCD video controller, sound generator, ADPCM, UARTs, SPI interface, Memory arbiters, and DMA controllers.
  • Brown University
    Xilinx Design Consultant
    Brown University Jan 1996 - Sep 1996
    Providence Ri
    XILINX design consultant for a microphone array research project.• Microphone Array Processor controller. The controller provided high speed DMA capability between a VIC/VAC interface, a MC68332 processor and eight AD21020 DSP modules.
  • Raytheon Corporation (Submarine Signal Division)
    Hardware Engineer
    Raytheon Corporation (Submarine Signal Division) Jan 1983 - Jan 1990
    Portsmouth, Ri

Bob Ledoux Skills

Fpga Embedded Systems Hardware Architecture Switches Firmware Mixed Signal Testing High Speed Digital Technical Leadership Integration Verilog Ddr2 Dc/dc Digital Signal Processors Hardware C Vhdl Embedded Software Electronics

Bob Ledoux Education Details

Frequently Asked Questions about Bob Ledoux

What company does Bob Ledoux work for?

Bob Ledoux works for Ge Intelligent Platforms

What is Bob Ledoux's role at the current company?

Bob Ledoux's current role is Senior Hardware Engineer at GE Intelligent Platforms.

What schools did Bob Ledoux attend?

Bob Ledoux attended Umass Dartmouth, Umass Dartmouth.

What are some of Bob Ledoux's interests?

Bob Ledoux has interest in Kite Boarding And Sailing, Exercise (P90x And Insanity).

What skills is Bob Ledoux known for?

Bob Ledoux has skills like Fpga, Embedded Systems, Hardware Architecture, Switches, Firmware, Mixed Signal, Testing, High Speed Digital, Technical Leadership, Integration, Verilog, Ddr2.

Who are Bob Ledoux's colleagues?

Bob Ledoux's colleagues are Swati Kale, Gabriel Mora Estribí, Pooja Pradhan, Rex Bobadilla, Kaustubh Deshpande, สุทธิพร เผ่าโนรี, Chantal Archambeau.

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