Bob Xing Email and Phone Number
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• 15+ years’ EE experience in computer electronics industry• Solid and direct EE experience on computer motherboard and system design including architect, schematic and PCB layout design, debugging, etc.• Broad knowledge of cross-team's design technologies (involves Power, SI, Bios, Thermal, EMC, Safety, etc.), validation, factory manufacturing, project management, etc.• Rich experience of working with ODM/OEM factory
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Mlb Product Engineer; Tpm苹果 Jun 2017 - PresentShanghai- Focus on failure analysis for Apple Mac motherboards.- As technical consultant, provide EE knowledge training, motherboard FA training and quality lessons learned to team.- Focus on MLB failure analysis. Review, drive and support OEM on motherboard repair skills improvement.- Drive scrap rate reduction of factory motherboard repairing and LRB(line return board) DPPM reduction.- Lead Field Failure Analysis efforts. Lead EFFA(early field FA) and identify/report motherboard high fall rate design and quality issues, improve field quality performance.- Drive motherboard debug & failure analysis with Product Design, Component Engineering, Test, and Supplier Quality. -
System Electronics EngineerIntel Jul 2012 - Jun 2017Shanghai City, China-Work on Notebook PC, Tablet and IOT hardware products development.-Define product specifications and hardware development requirements. -Work with ODM to complete schematic/layout design, testing, issue debugging as well as cost review, factory build audit, etc.-Track key components (Display, Battery, Touch Panel, Wireless, etc) market trends and regularly meet with vendors.-Handle EE related work including EE schedule, cost and risk management. Also work with ODM on detailed design, review their design, test reports and drive issue troubleshooting.-Work as validation PM and lead both internal teams and ODM to complete validation spec which involves functions,reliability,thermal,mechanical,etc. Work out test plan, review test progress and drive issue troubleshooting. Projects:Tablet(Intel Cherry Trail-T4 platform): xx Notebook(Intel Braswell Platform): xxNotebook(Intel Cherry Trail-T3 Platform):xxDevelop a 2 in 1 product which has tablet with detachable dock. There is battery in dock for tablet charging as well as longer battery life.Develop an 11.6’ foldable notebook that lid can flip over 360degrees like Lenovo Yoga.IOT products development:Develop IOT products which based on Gemtech LoRa, HD-PLC, and other LPWAN technologies. -
Senior Electronics EngineerHp Feb 2011 - Jul 2012- Work with US colleges on product spec definition. Involved in cost, schedule, and product requirements definition. - Work with ODM on products design. - Focus on EE design review,EE cost management, test reports review, debugging, etc. - Work on Regulatory related testing/debugging, conduct EMC testing in EMC lab.Hold weekly meeting with US and ODM engineers to review project progress. -
Senior Electronics Engineer;Design Team Leader华硕 Oct 2005 - Feb 2011Senior Electronics Engineer, Design Team leader - Lead a R&D team with 4~5 members. Work on PC motherboard hardware design. As project design lead, review schedule/design spec/cost/quotation, align with customer.- Developed total ~15 projects(motherboard) from kick-off to mass production which covers ATX, uATX, mini-ITX with PCB 4~8 layers.- Complete whole schematic design, release power spec to power team and other teams, review other teams' design and integrate their design to overall EE schematic. - Rich experience on PCB Layout design. Use Cadence Allegro to review layout. Define layout rules for layout engineers. Work with PCB supplier to confirm manufacture requirements.- Familiar with manufacturing line and process of factory.- Onsite support PCBA build on EVT/DVT/PVT phase.- Lead and work with Power,Bios,EMC,Thermal,Safety,HW testing teams to identify issues and get solutions in place.- Weekly bug review meeting with customer and PM and provide updates for project status and defects.Projects: Developed total ~15 motherboards from Kick-off to mass production, below are part of them.P5LP-LR: uATX 9.6inch*9.6inch, 4layers, Intel 945P+ICH7DHIP4BL-ME:uATX 9.6inch*9.6inch, 4layers, Intel G31+ICH7IPI43-TTM:uATX 9.6inch*9.6inch, 4layers, Intel G43+ICH10IPMIP-TM (DQ57TML):uATX 9.6inch*9.6inch, 4layers, Intel Ibex peak Q57IPMSB-BE (DH61BE):uATX 9.6inch*9.6inch, 4layers, Intel Cougar point H61,
Bob Xing Skills
Bob Xing Education Details
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Electronic And Information Engineering; Engineering
Frequently Asked Questions about Bob Xing
What company does Bob Xing work for?
Bob Xing works for 苹果
What is Bob Xing's role at the current company?
Bob Xing's current role is Senior Electronics Engineer, System Hardware Engineer, TPM.
What is Bob Xing's email address?
Bob Xing's email address is bo****@****ail.com
What schools did Bob Xing attend?
Bob Xing attended Jiangsu University.
What skills is Bob Xing known for?
Bob Xing has skills like Electronics, Pcb Design, Product Development, Program Management, Hardware, Computer Hardware, Motherboards, Tablets, System Design, Odm Management, Tablet, 项目管理.
Who are Bob Xing's colleagues?
Bob Xing's colleagues are Rahul P., Santhosh Yt, Irfan Siddiqui, Yashpal Gupta, Akshay Agarwal, Najee Reeves, Shadihayek Hayek.
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