Boon Khai Ng Email & Phone Number

La Crescenta-Montrose, Ca, Us

La Crescenta-Montrose, Ca, Us

Minneapolis, Mn, Us

• Led a cross-functional team to investigate critical CGM component-level failures at the assembly line. ► Performed and identified root causes, developed solutions, collaborated with suppliers to improve manufacturing process using DOE, and validated supplier’s new process via PPAP. ► Developed component new specs, validated (Gage R&R study) and transferred new test method to supplier for in-process monitoring. ► Double the supplier’s process capability. Met aggressive commercialization timeline while overcoming supply chain and great resignation obstacles. The product received CE mark approval in 2023.• Led the development of on-body long term adhesive components for next-generation CGM products. Developed strategies and roadmap for adhesive patch selection, design control activities, generated intellectual properties, device-level test methods development, and clinical studies.• Responsible for developing key relationships with critical suppliers.• Managed and mentored a team of R&D technician and engineers.

• Worked in a team to design and develop 2nd generation ORION visual cortical prosthesis, an advanced long-term implant (60 electrodes) that stimulates the visual cortex of the brain to form vision for the blind.• Developed manufacturing process for assembling cortical prosthesis and trained manufacturing engineers and assemblers. Procure equipment; designed tools, fixtures and molds. • Conduct technical Design Reviews. • Improved the adhesion strength between silicone and polyimide film via design and process. • Managed and mentored senior engineers and other new engineers as they were on boarded into the organization. • In charge of the machine shop by providing training on CNC and vertical mill.

Valencia, Ca, Us

• Worked in a team to design and develop the implantable case (40 x 20 x 6mm) of a miniature implantable pulse generator (IPG) that is suitable for SCS, OAB and PNS applications. • Worked in a team to develop the assembly process to assemble electronic components into the implantable case. • Led the development of the implantable 8-electrode coil lead for peripheral nerve stimulation (PNS) application. Product received FDA approval in 2019.• Led and managed the execution of design verification/validation and failure analysis of the implantable 8-electrode coil lead for PNS application. • Offered sustaining engineering guidance and support of products after technology transfer. • Assist the establishment of requirements for implantable 8-electrode coil lead and bipolar lead. • Led and managed the execution of design verification/validation and failure analysis of the bipolar lead for implantable myo-electric sensor (IMES) application.• Led project to explore low cost implant packaging by hermetic sealing sensor by using Nanofoil and AuSn.• Led a long term in-vitro corrosion study on the effect of laser welding that jointed NiTi, SS 316L and Ti components of an implant device. • Responsible for leading process validation (OQ and PQ) effort of resistance and laser welding of some of the manufacturing process. • Led project to design, build and test the Liquid Crystal Polymer (LCP) based lead. Established requirements and designed a battery of mechanical and electrical testings to evaluate and characterize the LCP based lead. • Led project to design, build and test 6 channels *cuff lead* for hypoglossal nerve stimulation. Developed engineering process to weld and mold the cuff for use in multiple animal studies. Developed cuff electrodes for MRI compatibility studies. Established clinical requirements and designed a battery of mechanical testings to characterize the long term reliability of the cuff electrode.

Lead effort to increase the efficiency to perform mechanical inspection of production parts using theexisting optical inspection system. This is achieved through rigorous review and modification of existing automated inspection programs, by introducing alternative inspection methods, and through enhancing the capability to inspect multiple parts.

• Developed testing methods through referencing ASTM and ISO standards: T-peel test, flexural bending, and durometer test.• Developed analytical models to solve complicated engineering problems: CTE of 3 bi-material, CTE effects on molding, Flexural bend strength and Buckling load of an implant component.• Design, verify and validate an implantable device from conceptualization to production. • Led component failure analysis. Develop corrective actions. Verify and Validate effectiveness of corrective actions. • Led engineers to design, develop and characterize a system to measure thin film array deflection (µm) under varying loads (µg). Led engineers to conduct a comprehensive MSA study on the bench test. Developed system has an uncertainty budget of about 25μm. • Led engineers to develop a comprehensive software (using Excel) that would automatically extract raw data (CSV) from multiple sources, analyze and output result as a report. Deployment of software saves engineers at least 30min of analyzing and generating report.• Participated in cross-functional engineering team to develop, evaluate, verify and validate next generation thin film array.• Led effort to conduct Gage R&R analysis comparing in house and vendor equipments measurement capability.• Conducted a comprehensive impact assessment on Nitinol through extensive literature review. Plan a road map and put forth a recommendation on the appropriate biocompatibility testing to be tested based on ISO 10993 to regulatory team.• Established an effective system to verify all mechanical inspection programs. Developed Department Operation Procedure (DOP) and trained all engineers and quality inspectors on the system.•Product received FDA approval in 2013.

• Developed design verification testing protocols, perform the required testing and write final reports. • Lead component failure analysis. Developed corrective actions. Verified and validated effectiveness of corrective actions. • Designed surgeon training tools such as anatomical eye model and Second Sight retina prosthetic device.• Collaborate with other engineering teams to develop process to electroplate multiple arrays simultaneously. • Designed and evaluated molds for various applications. (Molding Silicone, Thermoforming Polyimide)• Researched and developed process to reduce stress-related effects of encapsulating Polyimide film with Silicone due to CTE of both materials. • Provide mechanical design support to design, build and evaluate tooling and fixtures for various R&D projects.• Planned, organized training and maintained production line. Incorporated new processes and methods, streamlined existing operations.

• Developed techniques to electroplate Platinum Grey (PtG) on electrodes of the prototype thin film array for implantable neuromodulator. • Characterized and developed process to reduce stress-related effects in the metal coated Polyimide thin film. • Characterized bonding strength of near-infrared thin film bonding. (LCP, PEEK and Polyimide) • Provide mechanical design support to design, build and evaluate tooling and fixtures for various R&D projects. • Scheduled operators activities and planned resources in order to meet deadlines. • Worked with suppliers to ensure components met design requirements, and cost targets.

• Designed and built a mechanical pressure system that uniformly bonds two 2” wafers.• Designed and built a co-planarity sensor system to ensure the intimacy of two 2” wafers.• Designed and built a mechanical system that detects the real-time melting of the solder material. • Worked with a principal engineer to design and build a manual desktop microwave bonder that incorporated an in-situ 5um high accuracy alignment system. • Investigated and troubleshot mechanical failure of electronic packaging equipment.• Performed thermal and structural stress analysis using FEA software to support product development.• Studied stress-strain effects of bonded substrate with different materials due to CTE. • Designed and packaged high-density electronic interconnect (focal plane array and system-on-a-package). • Studied adhesion of solder (Al, Au, Pb, In, InAg, AgSn and AuSn) bonding between different substrates (Si, GaAs, SiC, FR4, Cu, Alumina, quartz, glass, PZT, AlSiC, DCB and polymer).• Bonded substrate to die in a high vacuum (10-6 Torr) environment to create hermetic sealing. • Developed bonding processes for different applications and customer products • Developed software programs and related documentation for systems control and data acquisition of electronic packaging equipment.

• Participated in design of machinery parts and mechanical testing fixtures.• Designed prototype with 3D solid modeling and 2D engineering layout.• Worked with clients to analyze and improve manufacturing equipments.• Investigated wear and fatigue of industrial parts using FEA software

Master'S Degree, Mechanical Engineering - Electronic Packaging

Bachelor'S Degree, Mechanical Engineer