Applied Global Services Marketing

Working directly for CMO, led efforts for developing first company product roadmap and for late stage startup 3D printing company. Defined and drove program to develop first of a kind process fingerprinting and process analytics software products for metal printing. Conducted market research and developed structured methodoly for application based market segment prioritization. Defined requirements and drove product vision across development team for next generation 3D printer products.

Primay role to develop strategy and marketing collateral for fab consulting services supporting equipment and service growth for all equipment segments ($3.5B service revenue, >$250M consulting services). Lead annual strategy plan development process for fab consulting services and development of all materials for executive level communication. Directed competitive analysis for yield, output, and cost improvements and served as primary interface to engineering to develop new consulting service offerings.

Led global product management team to develop semiconductor processing equipment in foundry and memory segments. Extensive experience with plasma, laser, and chemical process. Customer facing new product penetration leader with success penetrations in Samsung, Intel, and TSMC. Developed downstream marketing and engagement strategies for foundry customers (Qualcomm, Broadcom, Apple). Created and implemented alternative business models (royalties, materials, pay per use) for new segments. Recognized across company as a marketing subject matter expert contributing to the development of best known methods for product development methodologies. Known as industry expert and invited speaker at key packaging conferences (IWLPC, IMAPs, IEEE, ECTC) with more than 90 patents and technical publications.Led development program from seed funding for first of a kind integrated plasma/laser wafer dicing tool. Built cross functional global development team (19 people) consisting of laser, etch, and coating process engineers, mechanical and electrical engineers with deep packaging expertise. Formed deep customer relationships in Intel, Sony, Qualcomm, and key OSATS (Amkor, SPIL, UTAC) resulting in first ever tool sale to Qualcomm.

Drove business development effort securing investment and defining products for emerging product group in image sensor segment. Aligned cross business unit strategy for smart phone application leveraging LED drivers, ambient light sensor, and power management product portfolio for back light systems.

Increasingly responsible product management roles including product management team leadership for equipment with >65% market share in $300M market.

Electrical Division specialist qualified in all disciplines for safe operation of pressurized boiling water naval nuclear power plants. Extended Persian Gulf deployments 1994 and 1996.