Brad Levin Email & Phone Number

Mountain View, California, US

San Jose, California, US

• Lead hardware development of market leading 200G & 400G OSAs in a lean organization with demanding schedules
• Managed 2 product design teams comprised of 14 design authority, program manager, optical, RF, mechanical, FEA, process, and test engineers. Hired 10 employees in all of the team’s disciplines to form effective R&D.
• Responsible for entire New Product Introduction (NPI) program including product development strategy, architectural definition, product design, design for manufacturability (DFM), Design for Testability (DFT), Design.
• Championed and led a strategic initiative to develop Lumentum’s first integrated Chip-on-Board (COB) product design from concept through customer alpha deliveries reducing OSA cost by 20% and Capex by 4 Million
• Led next generation 200Gb/s & 400Gb/s ROSA, TOSA, and module packaging development using high speed flex circuit design from concept through customer deliveries resulting in the industry leading 400G OSAs in QSFP-DD.

San Jose, California, US

• Managed design teams through development of 100Gb/s & 200Gb/s coherent receivers with deep technical challenges
• Designed and developed from concept to production 100Gb/s Micro-ICR & 200Gb/s Dual ICR coherent receivers for CFP2-ACO Transceiver
• Responsible for product development strategy, architectural definition, product design, design for manufacturability (DFM), interaction with manufacturing engineering, scoping of resources, and defining schedules for.
• Championed and led product design using Lumentum’s first back-illuminated flip-chip high speed PD arrays resulting in smaller/faster PDs, increased coupling efficiency, and allowed for more relaxed assembly tolerances
• Flip-Chip PD Array designed into a subsequent OSA designs in other teams
• Collaborated with international R&D teams in Ottawa, Canada & Shenzhen, China throughout the development

San Jose, California, US

• Led a team to develop innovative low-cost designs enabling early market leadership of 100Gb/s transceivers
• Managed 8 optical, mechanical, FEA, process engineers
• Designed and developed from concept to production the world’s first 100Gb/s receiver used in QSFP2, CFP2, CFP4 transceivers giving the company a 1-2 year technology advantage over competitors
• Received prestigious Zenith Award indicating the significance of the product impact to the company
• Conceived architecture which used elliptical PDs to precisely trade-off between aperture size and speed
• Conceived architecture which used TIR polished Planar Lightwave Circuits (PLCs) for vertical optical coupling to PD arrays without using lenses

San Jose, California, US

• Designed multiple transceivers and award-winning 10Gb/s OSAs which claimed market leadership for several years
• Designed and developed from concept to production 40Gb/s & 100Gb/s coherent receivers which incorporated an innovative low-cost plastic lens array for vertical optical coupling from PLC to PD Array
• Designed and developed from concept to production 10Gb/s ILMZ & CW TOSA
• Designed and developed from concept to production the world’s smallest tunable optical transmitter in 2008 to fit in an XFP transceiver giving the company a 3-4 year technology advantage over competitors
• 2 Million+ ILMZ TOSAs produced
• ILMZ TOSA architecture was subsequently used in 8+ additional transmitters and is still in use today

• Executed on innovative designs which quickly led to company growth and acquisition
• One of 7 Founders of Ignis Optics, acquired by Bookham in Oct. 2003
• Principal mechanical designer of Pluggable SFP (2.5 Gb/s), XENPAK (10 Gb/s), & XFP (10 Gb/s) Transceivers
• Primary contributor to all transceiver designs in overall product design concept, overall assembly and manufacturing process, mechanical package design and detail in ProE, OSA design concept & mechanical detail, and.
• Developed innovative product designs incorporating miniature injection-molded plastic and glass lenses, hermetic ceramic packaging with and without a thermoelectric cooler (TEC), singlemode ferrule interfaces both.
• Designed and built custom laser welder and lens alignment systems necessary for the assembly of the products

Galway, IE

• Developed numerous fiber optic products on a highly accelerated schedule allowing for efficient market penetration
• Initial member of a west coast startup division of low-cost active fiber optic products
• Mechanical designer of the Gigabit Ethernet/Fiber Channel MT-RJ Multimode Transceiver, 125 Mb/s Fast Ethernet/OC-3 MT-RJ Multimode Transceiver, Pluggable SFP (1.0625, 1.25, and 2.12 Gb/s) MT-RJ Multimode Transceivers.
• First product development from concept to production release was an unprecedented 9 months
• Key contributor to all transceiver designs in overall design concept, overall assembly and manufacturing process, mechanical package design and detail in ProE, OSA design concept and mechanical detail, and piece part.
• Worked closely with low cost manufacturing facilities for both initially designing the products for high volume manufacturing and facilitating the manufacturing of the product, including working at an overseas.

Stanford, CA, US

• RAPID PROTOTYPING LABORATORY (RPL) (Sept 1997–Feb 1998)Developed alternate method to additive manufacturing (AM) for fabricating movable plastic parts
• Examined various techniques of creating layered wax molds
• A single-cast of polyurethane was used in these molds to create objects with moving parts
• Used these processes to design (in AutoCAD) and manufacture a working “inchworm” toy with several moving parts
• Discoveries lead to automation of mold process which continued to be used by the laboratory for future workDEXTEROUS MANIPULATION LABORATORY (DML) (May 1997–Sept 1997)Gained experience working across multiple.
• Designed, manufactured, and programmed an extremely low-cost one-degree of freedom force feedback joystick

Master'S Degree, Mechanical Engineering

Bachelor'S Degree, Engineering Physics/Applied Physics