Brad Levin Email & Phone Number

Mountain View, California, Us

San Jose, California, Us

Lead hardware development of market leading 200G & 400G OSAs in a lean organization with demanding schedules• Managed 2 product design teams comprised of 14 design authority, program manager, optical, RF, mechanical, FEA, process, and test engineers. Hired 10 employees in all of the team’s disciplines to form effective R&D teams.• Responsible for entire New Product Introduction (NPI) program including product development strategy, architectural definition, product design, design for manufacturability (DFM), Design for Testability (DFT), Design Verification Testing (DVT), process development, vendor interaction, manufacturing readiness, collaboration with manufacturing operations, resource requirements and allocation, schedule and budget (>$1Million annual OPEX)• Championed and led a strategic initiative to develop Lumentum’s first integrated Chip-on-Board (COB) product design from concept through customer alpha deliveries reducing OSA cost by 20% and Capex by 4 Million• Led next generation 200Gb/s & 400Gb/s ROSA, TOSA, and module packaging development using high speed flex circuit design from concept through customer deliveries resulting in the industry leading 400G OSAs in QSFP-DD and OSFP Transceivers demoed at OFC 2018 fostering immediate customer engagements

San Jose, California, Us

Managed design teams through development of 100Gb/s & 200Gb/s coherent receivers with deep technical challenges• Designed and developed from concept to production 100Gb/s Micro-ICR & 200Gb/s Dual ICR coherent receivers for CFP2-ACO Transceiver• Responsible for product development strategy, architectural definition, product design, design for manufacturability (DFM), interaction with manufacturing engineering, scoping of resources, and defining schedules for production release• Championed and led product design using Lumentum’s first back-illuminated flip-chip high speed PD arrays resulting in smaller/faster PDs, increased coupling efficiency, and allowed for more relaxed assembly tolerances• Flip-Chip PD Array designed into a subsequent OSA designs in other teams• Collaborated with international R&D teams in Ottawa, Canada & Shenzhen, China throughout the development• Led accelerated hardware and software development of high speed test equipment necessary to screen for PD array imbalance issues. Tester allowed for PD level screening to save on cost and yield at higher levels of integration.

San Jose, California, Us

Led a team to develop innovative low-cost designs enabling early market leadership of 100Gb/s transceivers• Managed 8 optical, mechanical, FEA, process engineers• Designed and developed from concept to production the world’s first 100Gb/s receiver used in QSFP2, CFP2, CFP4 transceivers giving the company a 1-2 year technology advantage over competitors• Received prestigious Zenith Award indicating the significance of the product impact to the company• Conceived architecture which used elliptical PDs to precisely trade-off between aperture size and speed• Conceived architecture which used TIR polished Planar Lightwave Circuits (PLCs) for vertical optical coupling to PD arrays without using lenses• Receiver architecture was subsequently used on 6+ additional receiver programs and is still in use today• Recruited by VP of Engineering to join a tiger team to provide technical support and solve a 40G QSFP+SR4 Damp Heat reliability problem which had hindered the team’s progress for an extended period. Identified root cause and implemented a screening tool to prevent the issue within 1 month leading to a successful pass of reliability re-test

San Jose, California, Us

Designed multiple transceivers and award-winning 10Gb/s OSAs which claimed market leadership for several years• Designed and developed from concept to production 40Gb/s & 100Gb/s coherent receivers which incorporated an innovative low-cost plastic lens array for vertical optical coupling from PLC to PD Array• Designed and developed from concept to production 10Gb/s ILMZ & CW TOSA• Designed and developed from concept to production the world’s smallest tunable optical transmitter in 2008 to fit in an XFP transceiver giving the company a 3-4 year technology advantage over competitors• 2 Million+ ILMZ TOSAs produced• ILMZ TOSA architecture was subsequently used in 8+ additional transmitters and is still in use today• Received prestigious Zenith Award indicating the significance of the product impact to the company• Designed, built, and developed process and equipment for sub-micron precision alignment system of ILMZ TOSA optics requiring consideration of equipment calibration, cycle time, equipment stability and repeatability, and capital budgets• Designed and developed from concept to production 10Gb/s Transceivers using low-cost Cooled TOSA and PIN ROSA

Executed on innovative designs which quickly led to company growth and acquisition• One of 7 Founders of Ignis Optics, acquired by Bookham in Oct. 2003• Principal mechanical designer of Pluggable SFP (2.5 Gb/s), XENPAK (10 Gb/s), & XFP (10 Gb/s) Transceivers• Primary contributor to all transceiver designs in overall product design concept, overall assembly and manufacturing process, mechanical package design and detail in ProE, OSA design concept & mechanical detail, and piece part manufacturing process & vendor selection• Developed innovative product designs incorporating miniature injection-molded plastic and glass lenses, hermetic ceramic packaging with and without a thermoelectric cooler (TEC), singlemode ferrule interfaces both rigid bore and ferrule/split-sleeve configurations, connector interfaces• Designed and built custom laser welder and lens alignment systems necessary for the assembly of the products• Part design in MIM, Zinc Die Casting, Etched and Stamped Sheet metal, Thick and Thin Film Ceramic, Multilayer HTCC, Screw machined receptacles with integrated ferrules/split sleeves/lenses/isolators, hermetic lids with windows• Designed for High Frequency EMI solutions using various mechanical techniques including form in place gasketing and sheet metal shields

Galway, Ie

Developed numerous fiber optic products on a highly accelerated schedule allowing for efficient market penetration• Initial member of a west coast startup division of low-cost active fiber optic products• Mechanical designer of the Gigabit Ethernet/Fiber Channel MT-RJ Multimode Transceiver, 125 Mb/s Fast Ethernet/OC-3 MT-RJ Multimode Transceiver, Pluggable SFP (1.0625, 1.25, and 2.12 Gb/s) MT-RJ Multimode Transceivers, Pluggable (1.0625, 1.25, and 2.12 Gb/s) LC Multimode Transceivers, Pluggable SFP LC Singlemode Transceiver• First product development from concept to production release was an unprecedented 9 months• Key contributor to all transceiver designs in overall design concept, overall assembly and manufacturing process, mechanical package design and detail in ProE, OSA design concept and mechanical detail, and piece part manufacturing process and vendor selection• Worked closely with low cost manufacturing facilities for both initially designing the products for high volume manufacturing and facilitating the manufacturing of the product, including working at an overseas manufacturing site for 1 month to directly address various manufacturing yield and throughput issues (mechanical assembly, optical alignment, soldering, epoxy) as well as oversee characterization builds and initial product release

Stanford, Ca, Us

RAPID PROTOTYPING LABORATORY (RPL) (Sept 1997–Feb 1998)Developed alternate method to additive manufacturing (AM) for fabricating movable plastic parts• Examined various techniques of creating layered wax molds• A single-cast of polyurethane was used in these molds to create objects with moving parts• Used these processes to design (in AutoCAD) and manufacture a working “inchworm” toy with several moving parts• Discoveries lead to automation of mold process which continued to be used by the laboratory for future workDEXTEROUS MANIPULATION LABORATORY (DML) (May 1997–Sept 1997)Gained experience working across multiple disciplines on a tight schedule• Designed, manufactured, and programmed an extremely low-cost one-degree of freedom force feedback joystick• Joystick used to represent the lab at the ASME conference• Redesigned and continued program development for a 2 finger dexterous manipulatorPRODUCT REALIZATION LABORATORY (PRL) (Sept 1996–Dec 1997)Increased knowledge and hands-on experience with numerous fabrication techniques• Became proficient in the use of many machining tools including mills, lathes, CNC Mills (specifically HAAS and DynaMill machines), Lasercamm and many woodworking tools• Used these tools to quickly prototype and manufacture numerous projects including a self-designed automatic golf ball mark repair tool• Additional experience with casting, injection molding, and silver brazingSCHICK/WILKINSON DIVISION OF WARNER LAMBERT CO. (Sept 1996–June 1997)Worked with customer to deliver award-winning design for use on manufacturing line• Collaborated in the research, design, and fabrication of a micro-friction measuring device for testing razor blade quality• Completed device shipped to Schick to be tested and used as part of their everyday manufacturing process• Device was awarded a Bronze Award in the 1997 Lincoln Arc Welding Foundation Design, Engineering and Fabrication Competition

Master'S Degree, Mechanical Engineering

Bachelor'S Degree, Engineering Physics/Applied Physics