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ENGINEERING LEADER: Balancing Technical Innovation with Operational PerformanceDriving new technology injection through innovative problem solving & design/manufacturing rigor.Experienced technology executive (running organizations from 30 to 400 direct reports, and 3 startups), with expertise in introducing new technology and innovation while driving cost and lead time out of development and manufacturing operations; specializing in accelerating transition from design to production. Often called on to turn around struggling organizations or introduce new technologies, while also serving as key technical resource (rising to the rank of Senior Technical Fellow at L3Harris Technologies). Specific expertise in robotics, MEMS, sensors, design, & electronic manufacturing, with a Ph.D. in robotics, combined MS/MBA, and BSME degrees. Select accomplishments include:• New Technology Injection – Introduced new flow control MEMS technology at MicroStaq, inertial sensor technology at Kistler, integrated MEMS technology with microelectronics at Sandia, network control of robots at Sandia, and radiation tolerant products (memory, power supplies, SSD’s, etc.) at Mercury. Various inventions and new processes led to 5 patents and applications. • New Design Culture – Led implementation of DFM and DTC at L3Harris and development of low-cost RF-modem products. • Yield Improvement – Drove design and process improvements at L3Harris that resulted in yields going from 60% to over 90%. Led design and process improvements at Kavlico that resulted in yield improvement from 65% to 96%. • Lead Time Reduction – Drove design and process improvement activities at L3Harris that resulted in on time delivery improving from 80% to over 98%. Reduced new product development time at Kistler from 28 months to 9 months on average. Improved OTD at Mercury by 30% while reducing overhead by over 50%.
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Vp EngineeringMercury Systems Nov 2019 - Nov 2021Phoenix, Arizona AreaLed design and process development of new microelectronic product applications including memory, SSD's, GPS, sensors, et al. including radiation tolerant memory, SSD's, and power supplies. Reduced overhead by over 50% during tenure while improving on-time delivery to over 70%. -
Division Chief Engineer/Senior Fellow/Deputy Vp EngineeringL3 Technologies Aug 2007 - Nov 2019Greater Salt Lake City AreaDeputy VP Engineering/Division Chief Engineer/Senior Fellow, SLC (2012 – Present)Responsible for administration of engineering activities, 1200 person staff, revenue, & costs.• Lead implementation of new design processes including Design to Cost, Design for Manufacturability, Continuous Improvement, and other strategic projects.o Resulted in yields improving from less than 60% to over 90%, and on time delivery improving from less than 80% to over 98%.• Key decision maker for “Blue Sky” R&D, all Capital projects (Chair), university research, and product development investments. • Met or exceeded all revenue ($250M), cost and budgetary goals past 5 years, and met or exceeded all Capital budgetary goals ($20M) for past 3 years.Director Hardware Development, Salt Lake City (400 reports) (2011 – 2012) Directed hardware development activities including RF, mechanical, circuit card design and layout, digital and analog design, embedded programming, FPGA development, and network development.Director Transition Engineering, Salt Lake City (60 reports) (2007 – 2011) Directed design to production activities for portfolio of communications products.• Led development/implementation of robust design/Design for Six Sigma methods. • Led development of two innovative modem products: Bandit and SIR/TNR. -
Vp Engineering And OperationsL3 Technologies Aug 2005 - Aug 2007Redmond, WaHired to turn around troubled MEMS IMU (combination MEMS accelerometer and gyro) development contract (30 months late at my hire date) and build a MEMS design and production capability within L-3 Communications. Included management of 40 personnel. -
Vp Engineering And OperationsMicrostaq Aug 2002 - Aug 2005Developed design and fabrication processes for a silicon microvalve product for automotive HVAC and other automotive applications for MEMS startup. -
Director Of Mems Product DevelopmentKavlico Corporation Jun 2000 - Aug 2002Led development and production of MEMS pressure sensors with integrated analog electronics for the automotive industry. Responsibilities included leading 40 people in mechanical and electronic design, wafer fab production, process development, packaging, and micro failure analysis. •Managed production wafer fab at annual production level of 2.4 million units•Led process improvement and cost reduction initiative resulting in 45% unyielded die cost reduction in one product and 55% reduction in a second (over previous production year).•Directed process development resulting in 50% yield improvement.•Led development of four new sensor products for production. -
Director Of EngineeringKistler Instrument Corporation May 1998 - Jun 2000Led the product development and other technical activities for Kistler’s product line of piezoelectric acceleration, pressure, and force sensors/electronics. •Initiated three new accelerometer product technologies. -
Principal Member Of The Technical StaffSandia National Laboratories Aug 1989 - May 1998•Led development of MEMS devices like a high-g accelerometer (including integrated digital microelectronics). First successful device fabricated using Sandia’s R&D 100 award winning and commercially licensed integrated micromachining/microelectronics process.•Co-developed MEMS device development process.•Developed and taught course in the design and analysis of MEMS devices.*Led development of multi-axis robot workcell for remediation of nuclear waste including simulation, control, and sensors.*Led development of remote robot control via high speed networks. -
Engineering DirectorEnhanced Robot Systems 1987 - 1989Startup company devoted to commercialization of my doctorate research in robot sensing and calibration. Won one contract at Hercules Aerospace where a system was sucessfully implemented.
Brady Davies Skills
Brady Davies Education Details
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Mechanical Engineering -
Engineering Management -
Mechanical Engineering
Frequently Asked Questions about Brady Davies
What is Brady Davies's role at the current company?
Brady Davies's current role is Associate Teaching Professor, Brigham Young University, Department of Mechanical Engineering.
What is Brady Davies's email address?
Brady Davies's email address is br****@****com.com
What schools did Brady Davies attend?
Brady Davies attended Brigham Young University, Brigham Young University, Brigham Young University.
What skills is Brady Davies known for?
Brady Davies has skills like Aerospace, Sensors, Systems Engineering, Engineering Management, Electronics, Simulations, Testing, Engineering, Design For Manufacturing, Manufacturing Engineering, R&d, Manufacturing.
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Brady Davies
Multi-Unit Music Studio Operator | Music Education #MakingmorethanmusiciansSalt Lake City Metropolitan Area1gmail.com1 +180183XXXXX
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2hmscnv.com, gmail.com
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1jadeglobal.com
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