I was lead architect for Zurn's connected IoT platform and was responsible for new product and feature development, uniting device, backend, and frontend teams.I work closely with our leadership and product management teams to ensure our cloud-based infrastructure is robust, secure, and scalable and that our connected devices operate seamlessly for customers across North America.

I was lead hardware engineer for Zurn Industries IoT connected products. I developed custom low-power sensor platforms that utilize RF communication technologies like BLE and LoRa and embedded ARM microcontrollers to communicate with cloud infrastructure. I developed HAL and BSP firmware to simplify the development of embedded firmware using C and C++.I optimized product designs for power-consumption in order to deliver multi-year battery life while collaborating with manufacturing partners to reduce cost and improve manufacturability.I've introduced processes and practices to ensure high quality and clear transfer of information in the development and manufacturing of electronic products.

I designed on several highly complex ground-up custom computer appliance designs including complete implementations of multi-core ARMv8 processors, DDR4, multi-phase high-current switching regulators, and 10+ Gbps SERDES. I was a lead in designing the architecture of these systems and in implementing the most complex parts of the electronics. I gained significant experience laying out PCBs capable of meeting the signal integrity needs of high-speed interfaces while also achieving regulatory compliance for EMI.I've also worked on the development of software from embedded C++ on microcontrollers up through web-facing APIs using Python and NodeJS.

I was tasked with leading a newly-created team of engineers focused on developing custom computer hardware. The newly established ability to offer custom electronics, embedded software, and mechanical design expertise to customers was a competitive advantage for Dedicated Computing.I designed electronics implemented using a technologies like PCI Express, USB, Ethernet, fiber optics, and COM Express. I designed and layed out multi-layer PCBs that required careful attention to details like impedance, cross-talk, and skew.As part of this new capability, I developed a standardized design processes to enable consistent quality and straight-forward interaction with internal customers.

I was responsible for a team of 4-6 engineers working on multiple simultaneous projects. I developed engineering requirements, project plans, and cost estimates to support our product management organization and carried projects from pre-planning through manufacturing implementation.I expanded our capacity by defining, recruiting for and filling engineering technician positions, which helped to improve our bandwidth while keeping cost low.I took a lead role in the definition of a new product development processes that streamlined the engineering phase of new product introductions and shortened our time to market.

I participated in a wide variety of tasks including electronics design, product testing and troubleshooting. I worked to design for thermal, shock/vibration, and regulatory compliance.

Electronics design, prototyping, and testing including reliability and accelerated life testing.