Brandon Lee Email & Phone Number

Boston, MA, US

• Engineering Management and Leadership:o Engineering Management for POS Device and SME for Payment Device development along with other feature sets, such as Restaurant Echo system. o Architecting and Managing New.
• Accomplishments on Projects:o Launched a New POS devices for multi purposes, such as Terminal and Kiosk ready. o Quality improvements for legacy products against Field Return and per customers’ feedback. o 3rd.
• Contributions to Organization and Company:o Managing Mechanical engineering team with full execution on product development and growing teams simultaneously. o Introduced a development process for Toast Internal.

Redmond, Washington, US

• Engineering Management and Leadership:o Led Hand-Held Smartphone Devices (Dual Hinge Foldable Smartphone) Mechanical Engineering team from Architecture, Early Design concept till Mass Production with improvements on.
• Accomplishments on Projects:o Introduced the new Hinge Mechanism with Improved Quality and Improved DFA (Design for Assembly) and DFR (Design for Repairability). o Achieved fully certified 5G product as of Microsoft.
• Contributions to Organization and Company:o Set up a Development Processes for Smartphone, product (over Surface Product Development Processes) with requirements added to each Milestones. o Improved Manufacturing Yield.

New York, NY, US

• Mechanical Architecture Engineering, Mechanical Engineering Technical Manager, ODM/JDM Engineering Technical Lead
• Act in a leadership capacity to oversee operations from Payment Device Product Definition to Product(s) Mechanical Engineering in partnership with ODM/JDM from Taiwan
• Attain PCI certification to meet requirement goals, initiating early architecture concepts and platform designs to be expanded into Verifone CM5 product families per Product Management requirements and ID design Intents
• Projects included items such as a CM5 printer module version and CM5 without a printer version
• Mentor and supervise a team of internal Mechanical Engineers across development sites for Verifone Taiwan; managed team members include FEA, Simulation, ODM, JDM, CM and NPI Engineers
• Work cross-functionally and across managerial levels to resolve program concerns, setting forth next-level actions to make development progress

Chicago, Illinois, US

• Mechanical Engineering Manager/ Technical Lead (2008 – 2017)
• Directed all aspects of initial product layout stack up designs as an element of overall initial architecture design
• Developed cutting-edge, industry-leading product designs including Moto Z2 Play, Moto G 4th Generation, Moto G 1st Generation, MOTO E2, Droid RAZR I, Droid Bionic, Droid 2 and Rival; featured thinnest product thickness.
• Teamed with the Advanced Technology Team to introduce new technology and materials including Kevlar, AL Anodizing, Slide Phone Mechanisms and Haptic Touch; improved MOTO Mod connectivity across each tier of products
• Created concepts for and launched smartphones, leading a team of 15 Mechanical Engineer direct reports and co-developing with various global sites located in Asia
• Worked within predetermined key performance indicators (KPIs) to achieve success, both on an individual basis with each Mechanical Engineer and on a cross-functional team level

Chicago, Illinois, US

• Sr. Staff Mechanical Engineer (2007 – 2008)
• Crafted and introduced an Initial layout design in liaison with the Industrial Design and Product Management Teams, ensuring alignment with customers’ requirements
• Remained mindful of lessons learned from previously-launched products, correcting field issues as needed to ensure success
• Managed major components and housing design processes including plastic mold, die-casting, double injection molding and metal insert molding
• Successfully fulfilled Design For Manufacturing (DFM), Design For Cost (DFC) and Design For Serviceability (DFS) requirements
• Performed expert-level failure analyses and implemented corrective actions for all designs to ensure adherence to quality and reliability objectives

Chicago, Illinois, US

• Sr. Staff Mechanical Engineer, ODM Mechanical Engineering, Technical Leader
• Managed initial architecture design in conjunction with ID and Product Management Teams, also oversaw all aspects of mechanical engineering detail design with an ODM partner from Taiwan
• Developed and designed ODM, creating Motorola experiences including Six Sigma-based Tolerance Analysis
• Coordinated FEA, drop simulation review and DPHU issue resolution processes seamlessly
• Efficaciously launched six product offerings in 1.5 years, managing all development cycles per product requirement goals related to cost and DFX, particularly mass production volumes

Chicago, Illinois, US