Brandon Lee Email & Phone Number

Boston, Ma, Us

• Engineering Management and Leadership:o Engineering Management for POS Device and SME for Payment Device development along with other feature sets, such as Restaurant Echo system. o Architecting and Managing New Generation of POS system per customers’ requirements and legacy products Lessons & Learns. o Leading Mechanical Engineering Team including New Architecture Early Concept Development for multiple POS and Payment products developments.o Managing Toast Internal Mechanical Engineering team and ODM/ JDM partners with multiple projects running simultaneously. • Accomplishments on Projects:o Launched a New POS devices for multi purposes, such as Terminal and Kiosk ready. o Quality improvements for legacy products against Field Return and per customers’ feedback. o 3rd Generation Handheld Payment Device with DFX goals met. o Initiated New POS Echo system including a New Terminal, GFD and Payment Devices. • Contributions to Organization and Company:o Managing Mechanical engineering team with full execution on product development and growing teams simultaneously. o Introduced a development process for Toast Internal Engineering and ODM / JDM development Models. o Managing JDM Engineering Partner Oversea for multiple products from initial Product Definition to Mass Production. o Control and Manage Budget including both Internal development and ODM / JDM development cost, resources and project schedules.

Redmond, Washington, Us

• Engineering Management and Leadership:o Led Hand-Held Smartphone Devices (Dual Hinge Foldable Smartphone) Mechanical Engineering team from Architecture, Early Design concept till Mass Production with improvements on Design, Reliability, Product Quality and Factory issue closures. o Fulfilled technical and engineering challenges from Hinge Design for Dual Screen Products and Improved Camera Quality issue over the previous generation. o Successfully incorporated 5G Antenna and RF design requirements to thinnest stack up and dual display form factor. o Contributed cross functional teams’ review and decision making with New Technology team, ID Team, Component Technology Team, NPI and Manufacturing team to fulfill all design requirements.o Managed 6 Direct reports, 12 indirect reports from MS Internal Mechanical Engineering teams and 13 of indirect reports from Manufacturing teams. • Accomplishments on Projects:o Introduced the new Hinge Mechanism with Improved Quality and Improved DFA (Design for Assembly) and DFR (Design for Repairability). o Achieved fully certified 5G product as of Microsoft 1st Product with all ID requirements met (Thinnest design language).o Initiated 3rd Generation Design Concept with new Hinge Design concept by Flex PCB (instead of cable connection). • Contributions to Organization and Company:o Set up a Development Processes for Smartphone, product (over Surface Product Development Processes) with requirements added to each Milestones. o Improved Manufacturing Yield with cost saving from Quality Control process introduced. o On time delivery for 2nd Generation of Duo.

New York, Ny, Us

Mechanical Architecture Engineering, Mechanical Engineering Technical Manager, ODM/JDM Engineering Technical Lead • Act in a leadership capacity to oversee operations from Payment Device Product Definition to Product(s) Mechanical Engineering in partnership with ODM/JDM from Taiwan• Attain PCI certification to meet requirement goals, initiating early architecture concepts and platform designs to be expanded into Verifone CM5 product families per Product Management requirements and ID design Intents • Projects included items such as a CM5 printer module version and CM5 without a printer version• Mentor and supervise a team of internal Mechanical Engineers across development sites for Verifone Taiwan; managed team members include FEA, Simulation, ODM, JDM, CM and NPI Engineers • Work cross-functionally and across managerial levels to resolve program concerns, setting forth next-level actions to make development progress• Set forth process improvements including a shorter path of engineering assessment, particularly Antenna Performance Evaluation and Design For Assembly, Cost and Manufacturing (DFX) in early development stages• As a result of the above, shortened overall development processes notably

Chicago, Illinois, Us

Mechanical Engineering Manager/ Technical Lead (2008 – 2017) • Directed all aspects of initial product layout stack up designs as an element of overall initial architecture design• Developed cutting-edge, industry-leading product designs including Moto Z2 Play, Moto G 4th Generation, Moto G 1st Generation, MOTO E2, Droid RAZR I, Droid Bionic, Droid 2 and Rival; featured thinnest product thickness available at the time while also meeting product requirements with customer satisfaction guaranteed• Teamed with the Advanced Technology Team to introduce new technology and materials including Kevlar, AL Anodizing, Slide Phone Mechanisms and Haptic Touch; improved MOTO Mod connectivity across each tier of products• Created concepts for and launched smartphones, leading a team of 15 Mechanical Engineer direct reports and co-developing with various global sites located in Asia• Worked within predetermined key performance indicators (KPIs) to achieve success, both on an individual basis with each Mechanical Engineer and on a cross-functional team level• Also partnered with Product Managers, Program & Project Managers and NPI Team to develop and finalize a consolidated development schedule, resource management best practices and budget controls

Chicago, Illinois, Us

Sr. Staff Mechanical Engineer (2007 – 2008) • Crafted and introduced an Initial layout design in liaison with the Industrial Design and Product Management Teams, ensuring alignment with customers’ requirements • Remained mindful of lessons learned from previously-launched products, correcting field issues as needed to ensure success • Managed major components and housing design processes including plastic mold, die-casting, double injection molding and metal insert molding• Successfully fulfilled Design For Manufacturing (DFM), Design For Cost (DFC) and Design For Serviceability (DFS) requirements• Performed expert-level failure analyses and implemented corrective actions for all designs to ensure adherence to quality and reliability objectives• Coached and led a team of junior Mechanical Engineers using a Lean Six Sigma design approach to guide collaborative operations

Chicago, Illinois, Us

Sr. Staff Mechanical Engineer, ODM Mechanical Engineering, Technical Leader • Managed initial architecture design in conjunction with ID and Product Management Teams, also oversaw all aspects of mechanical engineering detail design with an ODM partner from Taiwan• Developed and designed ODM, creating Motorola experiences including Six Sigma-based Tolerance Analysis• Coordinated FEA, drop simulation review and DPHU issue resolution processes seamlessly• Efficaciously launched six product offerings in 1.5 years, managing all development cycles per product requirement goals related to cost and DFX, particularly mass production volumes

Chicago, Illinois, Us