Brendan Eng Email & Phone Number

Hillsboro, Oregon, United States

-Resolution Enhancement Technology/Optical Proximity Correction (RET/OPC)-Software engineering, scientific programming, simulations, and data science for next generation nanoscale semiconductor process technologies

Urbana-Champaign, Illinois Area

• Designed and grew semiconductor heterostructures using molecular beam epitaxy (MBE) growth for solar cells, lasers, and contact layers for projects funded by the Department of Energy (DOE) and National Science Foundation (NSF)• Achieved InAs virtual substrates with the lowest defect density in the world by over 2.5x through extensive characterization and defect analysis using scanning electron microscopy (SEM), atomic force microscopy(AFM), x-ray diffraction (XRD), and photoluminescence (PL)• Established a device fabrication procedure (photolithography, etching, metallization) in the cleanroom for semiconductor laser diodes along with electrical testing procedures (I-V and L-I-V) to successfully realize the first electrically-injected continuous wave laser in our lab at UIUC• Developed hardware and integrated software for mid-infrared photoluminescence and laser testing setups using electrical probe stations, optical test bench, and Python programming for automating testing and data collection for electronic device and materials characterization• Performed extensive data processing in MATLAB, Python, and Excel to analyze results and execute statistical data analysis for electronic device performance and material quality assessment• Developed effective communication skills through biweekly research presentations, collaborative meetings with other universities (Arizona State University, University of Texas at Austin, Yale University), and quarterly progress reports to the Department of Energy

Folsom, Ca

• Developed Python scripts for front-end tests of non-volatile memory products to reduce time of early product-cycle testing and burn-in• Collaborated regularly with failure analysis team to develop data extraction and analysis tools for electrical testing• Established methods to minimize read/write errors for new Intel NAND products to improve device reliability• Reinforced understanding of semiconductor device physics and learned processing procedure for NAND devices

-Performed photolithography, reactive-ion etching, and metal sputtering for the successful fabrication of strain sensors to support projects for an industrial startup-Analyzed device fabrication through scanning electron microscopy, optical microscopy, and profilometry

Dallas, Texas

• Analyzed the statistical alignment variations of over 50 reticles with ASML steppers to improve manufacturing yield for wafers processed in photolithography tools• Led the integration and calibration testing of detectors in UV bake tools to reduce errors in post-exposure bake processing • Designed a method to detect wafer damage with near-IR sensors after resist development for fault isolation for different process modules (lithography, thin-film, implant, diffusion, etch)• Headed a team of equipment engineers and technicians to integrate new software to verify the correct installment and replacement of photoresist bottles to reduce equipment downtime• Presented results at daily passdown meetings to keep an update of fabrication tools

ICOR Lab: Innovative COmpound semiconductoR (ICOR) Laboratory-Implemented MATLAB simulations to model the mechanical properties of stressor films deposited on different semiconductor epitaxial layers to support a collaborative project with four students-Investigated the process parameters for electroplated nickel stressor layers including electroplating bias, solution concentration, and plating time to optimize spalling fabrication process-Collected data using thin-film stress measurement system to analyze effects of Ni stressor layer deposition on spalling process

-Developed Python-based scripts to model the bandgaps and effective carrier masses from the Materials Project database to successfully extract material parameters from over 1000 materials-Initiated a research initiative to simulate the optical properties of TiO2/ZnO with MATLAB and COMSOL Multiphysics to enable high-throughput simulation capabilities

Cincinnati, Ohio

• Investigated oxidation, spallation, and corrosion processes in metallic coatings using scanning electron microscopy and laser confocal microscopy to assess material quality for jet engine components• Evaluated heat-cycle testing effects on the performance of environmental and thermal barrier coatings through mechanical testing and MATLAB data processing to test the dependability of new superalloy materials• Systematized mechanical testing and electron microscopy data into an accessible library for other engineers to access

Master'S Degree, Electrical And Computer Engineering, 3.93/4.00

Activities and Societies: Eta Kappa Nu (HKN), IEEE, ECE Graduate Student Advancement Committee (ECE-GSAC)

Bachelor'S Degree, Materials Science And Engineering, Minor In Electrical Engineering, 3.99/4.00

Activities and Societies: Materials Advantage, Keramos, INSPIRE (Institute for Solar Photovoltaic Innovation and Edutraining)-Social Chair.