Brendan Eng Email & Phone Number

Hillsboro, Oregon, United States

-Resolution Enhancement Technology/Optical Proximity Correction (RET/OPC)-Software engineering, scientific programming, simulations, and data science for next generation nanoscale semiconductor process technologies

Urbana-Champaign, Illinois Area

• Designed and grew semiconductor heterostructures using molecular beam epitaxy (MBE) growth for solar cells, lasers, and contact layers for projects funded by the Department of Energy (DOE) and National Science.
• Achieved InAs virtual substrates with the lowest defect density in the world by over 2.5x through extensive characterization and defect analysis using scanning electron microscopy (SEM), atomic force microscopy(AFM).
• Established a device fabrication procedure (photolithography, etching, metallization) in the cleanroom for semiconductor laser diodes along with electrical testing procedures (I-V and L-I-V) to successfully realize the.
• Developed hardware and integrated software for mid-infrared photoluminescence and laser testing setups using electrical probe stations, optical test bench, and Python programming for automating testing and data.
• Performed extensive data processing in MATLAB, Python, and Excel to analyze results and execute statistical data analysis for electronic device performance and material quality assessment
• Developed effective communication skills through biweekly research presentations, collaborative meetings with other universities (Arizona State University, University of Texas at Austin, Yale University), and quarterly.

Folsom, CA

• Developed Python scripts for front-end tests of non-volatile memory products to reduce time of early product-cycle testing and burn-in
• Collaborated regularly with failure analysis team to develop data extraction and analysis tools for electrical testing
• Established methods to minimize read/write errors for new Intel NAND products to improve device reliability
• Reinforced understanding of semiconductor device physics and learned processing procedure for NAND devices

-Performed photolithography, reactive-ion etching, and metal sputtering for the successful fabrication of strain sensors to support projects for an industrial startup-Analyzed device fabrication through scanning electron microscopy, optical microscopy, and profilometry

Dallas, Texas

• Analyzed the statistical alignment variations of over 50 reticles with ASML steppers to improve manufacturing yield for wafers processed in photolithography tools
• Led the integration and calibration testing of detectors in UV bake tools to reduce errors in post-exposure bake processing
• Designed a method to detect wafer damage with near-IR sensors after resist development for fault isolation for different process modules (lithography, thin-film, implant, diffusion, etch)
• Headed a team of equipment engineers and technicians to integrate new software to verify the correct installment and replacement of photoresist bottles to reduce equipment downtime
• Presented results at daily passdown meetings to keep an update of fabrication tools

ICOR Lab: Innovative COmpound semiconductoR (ICOR) Laboratory-Implemented MATLAB simulations to model the mechanical properties of stressor films deposited on different semiconductor epitaxial layers to support a collaborative project with four students-Investigated the process parameters for electroplated nickel stressor layers including electroplating.

-Developed Python-based scripts to model the bandgaps and effective carrier masses from the Materials Project database to successfully extract material parameters from over 1000 materials-Initiated a research initiative to simulate the optical properties of TiO2/ZnO with MATLAB and COMSOL Multiphysics to enable high-throughput simulation capabilities

Cincinnati, Ohio

• Investigated oxidation, spallation, and corrosion processes in metallic coatings using scanning electron microscopy and laser confocal microscopy to assess material quality for jet engine components
• Evaluated heat-cycle testing effects on the performance of environmental and thermal barrier coatings through mechanical testing and MATLAB data processing to test the dependability of new superalloy materials
• Systematized mechanical testing and electron microscopy data into an accessible library for other engineers to access

Master'S Degree, Electrical And Computer Engineering, 3.93/4.00

Activities and Societies: Eta Kappa Nu (HKN), IEEE, ECE Graduate Student Advancement Committee (ECE-GSAC)

Bachelor'S Degree, Materials Science And Engineering, Minor In Electrical Engineering, 3.99/4.00

Activities and Societies: Materials Advantage, Keramos, INSPIRE (Institute for Solar Photovoltaic Innovation and Edutraining)-Social Chair.