Brian Gray Email & Phone Number

Kanata

- Thermal analysis of air and conduction of single board computers for military applications in FloTHERM XT, CREO Simulate, and Ansys IcePak. - Reliability analysis of single board computers in Sherlock for radar system. - Vibration analysis of single board computers for determination of product reliability in CREO simulate.- Detailed modeling of.

Ottawa, Canada Area

- Completed design of experiments to optimize thermal printing processes for hermetic pouches to meet Universal Device Identification directive from the Federal Drug Administration (FDA). Determined optimal print parameters to maximize through-put while meeting 2D barcode print quality factor. - Created monthly process control reports for manufacturing.

Ottawa

• Technical lead for root cause and corrective action (RCCA) of field failures. Directed analysis of failedproduct by external labs. Developed containment plan for shipped product and re-qualified manufacturing processes.
• Design of mechanical fixtures for test processes in Solidworks™ for contract manufacturers. Completeddetail and assembly drawings.
• Developed highly accelerated life test (HALT) plans for SMART products in the pre production phase.Recommended design changes to mitigate failure risk.
• Chaired bi-weekly field failure review meetings and identified system level failure trends for SMARTRoom System™. Determined action items and tracked to completion.

Toronto, Canada Area

• As a member of Celestica's Global Technology Group I performed electronics qualification testing forconsumer and enterprise customers. Also performed applied research pertaining to the changes in theelectronics.
• Measurement of strain and vibratory response of electronics under test. Analysed strain and vibrationresponses, performed failure analysis, and authored reports.
• Ranked most commonly used RoHS (reduction of hazardous substances) printed circuit board (PCB)laminates for susceptibility to pad-crater failure through design and execution of spherical bend testingprogram. Proved an.
• Qualification of electronics by bend and drop testing. Analysed failures and authored reports.
• Determination of product reliability through statistical analysis of failures.
• Design of mechanical test fixtures for strain and vibration analysis.While in this position, I authored two publications on printed circuit board reliability and completed a Master of Applied Science.

Toronto, Canada Area

• Process development for solder attach of new electronics component packages including QFNs, BGAs, andodd form components. Solid modeled custom nozzles and tooling in Solidworks.
• Evaluated and optimized processes through design of experiments (DOE) and data analysis.
• Automated quality report generation through Visual Basic scripts in Excel.
• Developed shop floor control system for moisture sensitive electronics. System was adopted by the Torontosite and won two awards.
• Design for manufacturability and assembly reports for wireless and enterprise customers.

Toronto, Canada Area

Dundas, Ontario, Canada

Bachelor Of Engineering (B.E.), Mechanical Engineering

Activities and Societies: Ethanol Hybrid Electric Vehicle Team.

Master Of Applied Science, Engineering