Brian Bogdan Email & Phone Number

Expertise• Circuit pack design leader – From requirements creation to release of production at a contract manufacture.• Responsible for design specifications, schematics, layout and constraints, and DFM reviews for wireless embedded processor circuit packs• Lead Sprints with CAD, DFM engineers, RF and Power amplifier (PA) designer, simulation teams (signal and power integrity) team and drove issues to closure • Trouble shoot factory issues with test engineers at Contract Manufacture locations• Components qualification of Processors, USB modules, DDR devices, OCXOs, PCB vendors.• Closely worked with platform software members to bring-up boards and work through issues• Member of Circuit Pack Development Process team which is responsible for a common process across all wireless locations (US, Germany, France, China, England) Design Knowledge• Freescale’s processors: MPC8548, MPC8358, P2020, P3041• Xilinx’s Virtex 5, Spartan 3/6, and Virtex 7• DDR/2/3 interfaces up to 1666mbps• High-speed SERDES (SGMII, CPRI, JES-D) up to 9.8Gbps rates• MII, GMII, RGMII, MDI ethernet interfaces• Ethernet PHYs (Marvel and Broadcom)• Lattice ISP power/platform managers• 12-16 layer PWB with HDI (1-N-1) via technology• T1/E1 TDM based interfaces• USB, I2C, SPI, uwire™, 1-wire, FireWire™• JTAGExperience with Development Tools and Software• Mentor Graphics PCB design tools (Board Station and Expedition)• Mentor Graphics simulation tools (Linesim, Hyperlynx SI and Hyperlynx PI)• Cadence Allegro PCB, Sigrity SI/PI• EMA Design Automation Timing designer• Miscellaneous simulation tools: ADIsimPLL, NI Mulitsim • Lattice Diamond CPLD/FPGA design tools• PCB viewers - Valor Viewer, Mentor Graphics PCB Viewer• MS Office Suite (Word, Excel, PowerPoint, and Visio)

Listed skills include Embedded Systems, Wireless, Lte, Testing, and 11 others.