Electrical Engineer
CurrentCurrent responsibilities include whitepaper, bid and proposal preparation, performing trade studies, mathematical modeling and systems simulation, definition of circuit card assembly (CCA) specifications, development of interface control documents, test plans, circuit simulation and schematic capture, oversight of PCB design, fabrication, assembly, and test, support of systems integration, flight-line testing, management of peer and critical design reviews.• RDE for conduction cooled VPX 6U wide band digital signal processing CCA. Embedded system, Kintex-7 and multiple Virtex-7 FPGA. DDR3 SDRAM, QDRII+, Gigabit Ethernet, Gigabit serial (SRIO, Aurora), high speed ADC.• RDE for conduction cooled VPX 3U wide band digital signal processing CCA. Embedded system, multiple Kintex-7 FPGA. DDR3 SDRAM, QDRII+, Gigabit Ethernet, Gigabit serial (PCIe, SRIO, Aurora), high speed ADC.• RDE for environmental control sub-system. Low power environmental control system for payload elements. Embedded design, Spartan-6 FPGA, actuator control, control system.• Hardware Technical Lead for SIGINT payload, communications link. Oversight of flight-line testing, development of payload hardware and firmware.• High-Speed serial firmware design for next-generation wide-band signal processing system. Oversight of research and development for Serial RapidIO solutions on Virtex-5 FPGAs communicating across VPX backplane. Development of FPGA internal module communication architecture.• Lead firmware design of communications link development. Oversight of firmware development for ground and air data-link. Support of systems integration and test and preliminary flight-line testing.• Lead firmware design of RF Distribution and Copy architecture. Oversight of CCA level testing and systems level integration.• Steering Team Lead for design capture and tools migration. Department level activity, coordination with section and sector level management.