Brian Dolan Email & Phone Number

Minneapolis, Mn, Us

Minneapolis, Mn, Us

Boise, Idaho, Us

Responsible for the engineering team driving manufacturing, industrial engineering, and technology transfer at Micron’s advanced, fully-automated 300mm R&D fab in Boise.-Oversee product line execution, manufacturing area performance, and line reporting/data analytics. -Collaborate with the technical program teams to optimize silicon flow through the fab. -Own and improve fab operational KPIs, such as cycle time, line yield, starts/outs, and equipment utilization. -Program manage transfer of R&D products into High Volume Manufacturing sites with matched yield and quality.

Boise, Idaho, Us

Led a cross-functional team in developing and deploying DRAM products into manufacturing from both our Boise and Japan R&D facilities, helping drive Micron to a leadership position in DRAM process technology. -Identified and mitigated critical technical and schedule gaps. Created and tracked KPIs, and communicated program status and risks to stakeholders. -Managed program timeline, scope, and resourcing within acceptable ranges, delivering capital budget to plan for product introduction to manufacturing. -Led capital expense reduction effort, partnering with process development areas to optimize capacity and minimize risk to program schedule, resulting in a 10% reduction in capital on a 3 billion dollar overall spend. -Owned the R&D-wide technical maturity business process, enabling transparency and accountability for process capability into manufacturing through SPC, FDC, product specification definition and validation.

Boise, Idaho, Us

Solved next generation chemical etch process challenges on leading-edge NAND and DRAM semiconductor devices. Our team successfully developed and transferred full suites of chemical etch/clean, plasma ashing, copper electroplating, and wafer bevel plasma etch processes into high volume manufacturing on leading-edge 3D NAND, planar NAND and DRAM products at Micron. We developed novel, critical path enabling solutions for Micron/Intel’s unique 3D NAND technology with multiple advanced first of a kind processes in the industry.

Boise, Idaho, Us

Enabled four NAND technology transfers from R&D to manufacturing developing novel wet process solutions for implementation into the pilot line. Part Type Transfer Coordinator for two transfers (Intel/Micron 25nm and 20nm NAND) from part initiation into high volume manufacturing. Developed new chemical etchants to support Hi-K metal gate processing. Reduced chemical costs for a critical group of processes in the fab by 30% with novel process sequence introduction.

Boise, Idaho, Us

Identified processing issues and developed solutions related to copper wire bonding and electroless bond pad plating in semiconductor packaging for DRAM, NAND flash, and CMOS image sensors.

Washington, Dc, Us

NASA leadership development program combined with a materials science research project (high tensile strength amalgams for in-situ materials fabrication during long duration space missions) at Marshall Space Flight Center.

Masters, Engineering Management

Bs, Materials Science And Engineering