Brian Huffman Email & Phone Number

San Jose, California, United States

At Kinetic Technologies, I had a broad range of responsibilities from calling on Bay Area accounts to defining, debugging and modeling new power IC including, Buck, Boost, Buck-Boost, and Multi-Phase converters.I helped define and performed bench evaluation for the following products: Buck converter (KTB8330), Boost converter (KTC2110) and Multi-phase converter (KTZ8701). All these products have been released, with the Buck and Boost converter finding homes in Cellphones even before they were officially released and both shipping millions of units.

My primary focus was Solid State Drive (SSD) power solutions. Other projects include a PMIC for single cell headphones, high current I2C controlled Synchronous Buck converter for the SSD and tablet market, Lithium battery charger, and inductor inside power modules.Worked with strategic customers to create design specifications and Simplis models for Micrel Products.

I had 10 Application Engineers, with 3 other support staff in my group. I was responsible for the Non-Portable product line which accounted for about $120M, or 40% of Micrel’s revenue. The Non-Portable product line included the following: Switch-Mode Power Supplies, USB Switches, Hot-Swap Switches, LED Lighting, Op-Amps, and Voltage Supervisors.Standardized IC functional tests, parametric test procedures, and datasheets.

The power group within Marvell was treated as a startup. Therefore, I had to assume the responsibility of many roles:Wrote datasheets and developed marketing and sales slidesTrained internal AE and FAE and presented the marketing slides to customersDeveloped an automated IC characterization tool that made it easy to validate 100’s of IC’sPresented to the Sony PS3 power group Marvell’s proprietary 120A Synchronous Buck ConverterReviewed customers schematics and layouts.Designed, built and tested synchronous buck regulators circuits from 1A to 120A

At Micrel, I had the opportunity to be an Application Engineer, Marketing Manager, and Field Application EngineerEstimated IC cost, evaluated market potential and created launch plans for new productsCovered the Northwest US as a FAE and handled key accounts such as Palm, Sun and HPCreated a quarterly publication called “Micrel’s New Product News”Developed a Microsoft Excel spreadsheet which calculated the operating conditions for the buck, buck-boost, boost, and flyback Topologies

Msee, Micro-Electronics

Bsee, Engineering