Nanophorm, LLC provides ultraprecision single point diamond machining of advanced optical, optoelectronic, and MEMS components; injection mold inserts, replication masters; precision engineering services.Have developed novel processing technologies for fabrication of diffraction gratings, lens arrays, and free form optics

Managed mechanical, optomechanical, and motion control teams that developed ultraprecision SEM for semiconductor wafer defect inspectionResponsible for all aspects of creating hardware from system requirements and releasing it to production. Requirements, conceptual and detailed design, subsystem and system testing, and ECO/documentation in high-pressure environmentSub-nanometer motion control, ultra-high vacuum, high voltage, electron optics, wafer handling, and extreme contamination control

• Directed marketing, sales, and manufacturing for high product mix, optomechanical machining operation serving Defense, Telecom, Aerospace, and Semi Capital Equipment industries• Grew order input by 40% annually with mixed-media internet, email, and direct mail marketing campaign• Managed the internal development of custom machine tools and software

• Company co-founder, raised multiple-million-dollar venture capital funding• Responsible for overall P&L, directed marketing, engineering, sales, manufacturing, materials, and finance• Led the development and introduction of over two dozen major products including ultraprecision machine tools, air bearing slides and spindles, and motion controllers• Patented a state-of-the-art method for fabricating disk drive recording heads - US Patent # 5722156 - and developed a machine tool capable of dimensional control on the 25 nanometer level• Developed novel methods for: deterministic grinding of optical surfaces in glass and ceramic materials, producing electroform molds by diamond turning, producing single-mode multi-channel fiber optic connectors, force controlled scribing of III-V optoelectronic wafers, etc...

• Created applications engineering organization and directed technical staff• Developed air bearing wafer dicing machine capable of 250 nanometer workpiece accuracy• Developed novel ELID bronze dicing blade dressing technique• Developed novel approach for dicing Al2O3-TiC disk head wafers, increasing throughput by 400%

• Developed method for lapping the air bearing crown on disk head sliders• Determined relationship between surface finish, form, and contact-stop-start stiction in disk head sliders• Developed aqueous cleaning process for disk head sliders• Developed method for lapping throat height dimension in disk head sliders