Brian Lynch Email & Phone Number

Phoenix, Arizona, United States

Phoenix, Arizona Area

Phoenix, Az

Consulting on OSAT space and advanced semiconductor packaging

Laminate Products Business Unit 12/12 to PresentP&L responsible for a ~$700 M product line manufacturing in 4 Asian countries and 6 factories for ~100 international semiconductor companies.Managed CapEx expenditures of $100M+ annuallyBusiness Management, Administration, and Pricing 3/05 to 12/12Responsible for pricing and business administration for a $2.7 B international high technology corporation supplying services to the world's top semiconductor companiesImplemented a systematic approach to quote, bill, and collect for customer requested operations and pass through commodity price increases.Led a team of multi-nationals implementing SAP (Sales and Distribution module) in our largest factories in Korea and PhilippinesLed a team of 5 pricing professionals providing over 5k of RFQs annually to over 250 customersEstablished a core team of quote and billing experts to facilitate the customer quote processWorked with sales, business units, finance, ICS, legal, auditing (internal and external) groups, and the factory on various contracts, agreements, and dispute resolutionsWorked with several major customer's e-business processes to improve time to cashDeveloped work flows and processes to ensure compliance to SOX 404 revenue compliancy

Leadframe and Hermetics Business UnitResponsible for understanding customer end markets and alignment of corporate resources for a $850 M businessFinancial analysis and justification of major product lines expansions to maximize corporate ROIAnalysis of future factory costs to determine corporate direction in new factory locationsNegotiation with major customers to internalize their assembly and test operationsIdentification and negotiation with Chinese domestic assembly houses to acquire assets

Responsible for all aspects (P&L, technical, and development) of a $260 M businessEstablishment of corporate roadmaps, resource allocation, capacity installation timing and rationalization, payback analysis, factory consolidation, and justification in 5 factories located in Korea, Philippines, Japan, and TaiwanImproved operating profit through material cost reduction, asset re-deployment, process simplification and non-value added process eliminationInterfaced with many multi-national customers to establish product requirements, cost targets, and production needs for the company's most diversified product offeringWorked with several international suppliers to establish design rules, process flows, and material sets which resulted in significant improvements to product cost, performance, and reliabilityVoting member of Amkor's patent council and active participant in quarterly supplier negotiations

Responsible for all aspects (P&L, technical, and development) of a $165 M businessEstablishment of corporate roadmaps, resource allocation, and capacity installation timing, rationalization, payback analysis, and justification in 2 factories located in Korea and PhilippinesInterfaced with many multi-national customers to establish product requirements, cost targets, and production needs for the most thermally and electrically demanding customer's devicesWorked with several international suppliers to establish design rules, process flows, and material sets which resulted in significant improvements to product cost, performance, and reliabilitySupervised and directed the activities of several product engineers

Directed the work of engineers focused on advanced package developmentPackage diversification based on technical, supply base, and financial meritIncreased sales from 10 M$ in '97 to 45 M$ in '98 and to 85 M$ in '99Diversified customer base to include segment leaders in 4 key market segments

Fremont, Ca

Evaluated various flip chip interconnection and package constructionsAssessed cost, reliability, manufacturability and meritDeveloped wafer bumping and assembly processes w/ various subcontractorsIntegrated interconnection solutions w/ Si and package designs for customer applicationsManaged all technical aspects of the package w/ supplierInterfaced with end customer to optimize package electrical performanceCreation and updating of process and package specifications

Neuchatel, Switzerland

Wafer bumping, photolithography engineer

Installation and characterization of complete Au wafer bumping line Development of 100, 125, and 150-mm straight wall bump processes Creation and updating of production process specifications

Rebuilding of destroyed wafer-bumping areaEquipment evaluation, identification, selection, and characterizationSecond wafer bumping source identification and qualification

Master Of Science, Engineering

Microelectronics Packaging 8/95 Thesis - Copper Tin Intermetallic Compounds in Flip Chip Interconnects

Material Science, Metallurgical Engineering