I manage a team responsible for the structural design, analysis and optimization of consumer electronic devices. My main focus is system level finite element simulation (static, dynamic and thermo-mechanical load cases). I have expertise in shock, drop, vibration, product level testing, test vs simulation correlation, materials characterization, predictive modeling for circuit boards and solder ball failure under high strain rate conditions, and workflow automation.

Responsible for mechanical design, materials development, materials characterization, modeling and finite element simulation with a focus on batteries and electro-mechanical-thermal systems.

Failure Analysis and R&D engineer.

Failure Analysis and Defect Metrology Engineer