Brion Ebert Email & Phone Number

Cranbury, New Jersey, Us

- Responsible for designing, building, and testing of boards and modules for integration into EVSE products and systems.- Responsible for interfacing with third-party consultants and customers for design reviews and verification. - Expertise in complying with international standards for EVSE equipment, such as SAE J1772, IEC 61851-1, ISO/IEC 15118

Cranbury, New Jersey, Us

Designing boards and products to be integrated into EVSE systems.

Geneva, Switzerland, Ch

- Responsible for the designing, building, and testing of the test chip hardware platform for ST's first generation HomePlug AV compliant ASIC. - Responsible for the designing, building, and testing of a demonstration platform (main board and carrier boards) for ST's ST2100 HomePlug AV compliant ASIC. - Completed OFDM modem front end hardware tuning (aspects such as TX power, spectral flatness, notch depth, RX filter response, pass band flatness, SNR, sensitivity, and powerline communication performance (throughput)).- Supported customer Demonstration/Proof of Concept/Product designs, from initial schematic design to prototype to final product, including testing and PLC performance verification (5 customers, 20 hardware designs as of 2015).- Supported hardware design/testing/verification for customers developing electric vehicle chargers (EVSE) utilizing HPAV communication (compliant with ISO/IEC 15118, SAE J1772 standards).

Us

- Responsible for the development/test hardware platforms for Arkados’ first generation HomePlug compliant ASIC and the second generation HomePlug AV compliant ASIC.- Designs included application-specific development platforms and proof-of-concept hardware platforms for audio and video customer designs, and prototype/production hardware designs for all customer applications and products for the entire development process – from initial reference design to final product design. Encompassed over 10 customers, over 30 prototype designs, and over 10 final product designs.- Managed all hardware design activities (including schematic level, board level, and application level) for development board, internal, reference, customer, and OEM designs. This includes the initial functional level design based on the application, design parameters, operational requirements, and product features, and matches available/enhanced functionalities to the goals of the product or application goals (including providing auxiliary component/device recommendations and third-party selection reviews).- Worked with third party OEMs during the entire product development cycle, from providing the initial reference design to reviewing the final production design, including compliance related issues (EMI/RFI, overvoltage, leakage, etc.) and powerline-related issues (conducted noise, sensitivity, performance, co-existence, etc.).

- Revised the company’s pre-existing powerline communication technology to increase system performance and add voice transport capability. - Provided product definition and architectural design of company’s main powerline communication technology product line. - Managed the hardware design team, provided oversight of functional level designs (especially the internals of the design that contained modules performing high-speed DSP functions such as FEC encoders and decoders, interleavers, scramblers, and mapper, FFT, and window functions).

Piscataway, Nj, Us

- MTS and later manager of the hardware group on hardware platforms of an Integrated Access Device capable of supporting voice and data traffic over wide range of network media types, and a Voice Gateway capable of interfacing to ATM, IP, and TDM based access networks, and ATM, IP, and TDM (TR-008 and GR-303) Voice Networks.- Management of hardware design team on the architectural and functional level design (some of the implementations include modifications of CPCI backplane to accommodate 1.2GBPS ATM Bus, VoIP/VoDSL DSP Processing Module, OC3c interface card with Cell buffering FIFO, IAD packaging, embedded IP Router Module, POTS Line interface implementation, etc.).- Completed detailed board level and FPGA level design using OrCAD Express Enterprise Edition and Xilinx Alliance Series software, and debugging using Logic Analyzers, Protocol and Interface Analyzers and Emulators, Embedded ICE, software assisted debugging tools, etc.- Other activities included: components procurement and third party services procurement, participation in integration testing and product verification testing, and solving compliance related issues and measures and associated analysis (EMI/RFI, overvoltage, leakage, etc.).

- Member of technical staff that participated in the product definition and architectural design of the main product line of the company, a three-tier data acquisition and control system based on PC and microcontroller platforms.- Participated in the design of parts and modules (sensors, communication interfaces, transducers, specialized controllers, data acquisition boards, data acquisition I/O interfaces, etc.) of the system, as well as development of a proprietary communication network, and studies of the network tolerance to noise, crosstalk, and EMI/RFI.- Completed board level and FPGA level design of the communication, data, and controller interfaces using Ezroute, OrCad, Xilinx Xact Step design tools.- Other activities included: component selection based on cost, availability, interoperability, environmental compliance, etc., component procurement, coordination of subcontract manufacturing and outsourcing.

Bachelors Of Technology In Electrical Engineering

Associates Of Science In Electrical Engineering