Oversee operational functions, encompassing test and product engineering, NPI, supply chain, quality, and program management. Develop supply chain framework aligning with ITAR/EAR security standards and demands of commercial volume and pricing. Administer NPI initiatives for various dual-use processor projects, catering to space/defense and commercial sectors. Manage SOC edge processor designs in 5nm and 12nm nodes. Implement ISO9001 and AS9100 quality management systems across entire organization. Collaborate with cross-functional teams to ensure seamless integration of operations and quality standards. Streamline and optimize processes to enhance overall efficiency and productivity. Selected Accomplishments:-Established strong strategic supplier partnerships with existing and new contract manufacturers. -Creation of NPI process at company

Orchestrated three complete fabs in US and Germany, managing approximately 350 employees, including engineers, supply chain professionals, facilities staff, and production teams. Managed approximately 250 assembly manufacturing engineers dispersed across 25 assembly sites in Asia, North America, and Europe within business unit. Led development of annual operating and five-year strategic plans for all sites, involving considerations such as footprint optimization, growth, capital expenditures, and cost reductions. Collaborated with sales and product management to optimize facility sizes and procure necessary equipment. Executed multiple projects focused on new product introduction, cost reduction and continuous improvement initiatives.Selected Accomplishments:-Implemented a turnaround in key factory metrics based on operating strategy, resulting in doubling of production moves and 30% increase in revenue within six months.-Led project team that standardized systems for monitoring and interventions in Inventory Control systems.-Supported development and implementation of global operations strategies, including footprint optimization, aligned with, and supporting the long-term goals of company.-Led project team that combined two multi-million dollar manufacturing sites in Germany.

Directed day-to-day operations for 46 contract manufacturer, foundries, comprising 82 contract manufacturing sites for ON Semiconductor. Orchestrated a cross-functional team to establish annual operating plans and a 3-5 year strategic vision. Developed and delivered supplier scorecards, driving completion of Non-Disclosure Agreements (NDA), Statements of Work (SOW), and contracts. Led fab-related engineering, quality, and supply chain matters for products in risk/mass production, addressing delivery, yield improvement, NPI, RMA, excursions, and other quality issues. Facilitated collaboration between ON Semiconductor and subcontractors, cultivating strategic partnerships with key suppliers and transitioning relationships from transactional to collaborative. Collaborated with business units (three units encompassing over 40 product line divisions) on manufacturing strategy, production, new product, and engineering goals. Selected Accomplishments:-Oversaw performance, yields, and quality, representing a yearly spend exceeding $700M and product revenue exceeding $1B. -Established and implemented a supplier management model based on spend, relationship, and strategic value.-Established cross functional project management team that reduced product yield loss from $120M to $80M in year one, then to $60M in year two.-Headed four operations teams from three companies into a single coherent organization at ON Semiconductor.

Directed day-to-day operations for suppliers TSMC, Toppan, & Lfoundry, collaborating with internal fabs to ensure end-to-end production and optimal yields. Served as primary interface between Aptina and the foundries, regularly leading updates and working sessions with executive staff. Administered fab-related engineering activities concerning products in risk/mass production and NPI. Implemented Lean Six Sigma methodology to drive quality and efficiency improvements across operations. Selected Accomplishments:- Led successful technology transfer project from DRAM fab to TSMC's logic process, optimizing efficiency. - Pioneered specialized yield teams, achieving a 3-5% annual improvement in mature product yields, enhancing quality and performance.

• Managed group of new product PI engineers. Group is ultimately responsible for all planning, set-up, fabrication, yield improvement, production ramp, and quality issues until the parts are mature and handed off to sustaining engineering group. • Coordinated the activities of interdisciplinary teams (Product managers, R&D, various manufacturing engineering groups, marketing, and production) in fabs 1, 9, D. Managed conflicting priorities across multiple projects and programs as well as various groups.

• Managed group of engineers responsible for ramping & sustaining yields and minimizing fab excursions.• Led engineering & production team that ramped production 10x in 8 months (1500 wafer/week to over 15,000 wafer/week.)• Evaluated and approved all process changes on imagers in fab 1• Cooperated with various fab teams on cost reduction projects. • Product owner for multiple parts. Responsible for yield improvement and evaluation of any potential changes on parts.

• Responsible for determining cause of low yielding lots/wafers.• Performed electrical and physical failure analysis on 5 generations of parts.• Responsible for evaluation and purchase of new tools for lab.