Managed semiconductor manufacturing facility. Responsible for directing and coordinating manufacturing, process engineering, equipment engineering, quality, finance, and other support organizations. Set organization’s goals, defined performance metric and budget. Managed projects to improve organization’s efficiency and flexibility, product quality, and reduce cost using Six Sigma, 5S, and Lean Manufacturing.- Improved cost, efficiency, and flexibility of the organization utilizing Lean… Show more Managed semiconductor manufacturing facility. Responsible for directing and coordinating manufacturing, process engineering, equipment engineering, quality, finance, and other support organizations. Set organization’s goals, defined performance metric and budget. Managed projects to improve organization’s efficiency and flexibility, product quality, and reduce cost using Six Sigma, 5S, and Lean Manufacturing.- Improved cost, efficiency, and flexibility of the organization utilizing Lean Manufacturing philosophy. Achieved $27,500,000 in revenue at pick loading, maintained efficient operation through loading fluctuations from 50% to 93% of the capacity, and ensured no supply disruptions.- Enhanced product quality through multiple projects implementing Six Sigma process control, process and equipment improvements, and work procedures optimization. Achieved zero customer returns in 2011 and 2012. Reduced wafers scrapped due to human error from 0.21% in 2008 to 0.03% in 2012.- Identified opportunities and managed cost reduction projects with result of 5% per year cost reduction.- Improved safety by utilizing 5S procedures for equipment and work area improvements, reduced safety incidents to one in 2011 and zero safety incidents in 2012 and 2013.- Assured organization’s compliance with ISO/TS16949, ISO14001, OHSAS 18001 standards and successfully passed annual audits. Show less

Led projects to introduce new technologies and products into Houston FAB on schedule with high process and die yield, manufacturability, and sameness. Improved HFAB systems for technology transfer and new product introduction. Worked with internal product, quality, and business organizations as well as customers to ensure products met customer requirements. Evaluated and recommended transfers to increase HFAB loading.- Executed three major technology and product offload projects.… Show more Led projects to introduce new technologies and products into Houston FAB on schedule with high process and die yield, manufacturability, and sameness. Improved HFAB systems for technology transfer and new product introduction. Worked with internal product, quality, and business organizations as well as customers to ensure products met customer requirements. Evaluated and recommended transfers to increase HFAB loading.- Executed three major technology and product offload projects. Introduced up to 70 new products per year.- Completed Tucson FAB technology transfer and product offload project for Bipolar 20/40V and CBC10 technologies. Worked with process engineering to improve manufacturability and modified technology to assure zener diode parametric performance.- Improved production efficiency by organizing and leading project to improve process and tool productivity by harmonizing different processes. Achieved 35% efficiency improvement for multiple processes.- Managed project to develop new 50µm-thick Copper Pillar redistribution layer processes. Process development and qualification was completed on time. Show less

Led technology transfer from four foundry customers into Sony FAB, including Bipolar, Power FET, and BiCMOS, generating $50,000,000 of revenue. Managed business relationship with foundry customers.- Managed project to transfer advanced bipolar technology from Ericsson Microelectronics in less than nine months in response to Ericsson’s urgent demand. Coordinated production ramp-up from engineering phase to 1,600 wafers per month production phase in three months. This project generated… Show more Led technology transfer from four foundry customers into Sony FAB, including Bipolar, Power FET, and BiCMOS, generating $50,000,000 of revenue. Managed business relationship with foundry customers.- Managed project to transfer advanced bipolar technology from Ericsson Microelectronics in less than nine months in response to Ericsson’s urgent demand. Coordinated production ramp-up from engineering phase to 1,600 wafers per month production phase in three months. This project generated over $25,000,000 in revenue.- Managed foundry relationships with two largest foundry customers, Legerity and DSP Group, and achieved $12,000,000 in revenue under adverse business conditions in 2002.- Led technology co-development of JFET power device and business relationship with Lovoltech, achieving functional device and securing $3,000,000 in revenue for company and equity position in Lovoltech.- Evaluated proposals for 12 potential business opportunities from technical and business points of view, recommending acceptance of five proposals for potential revenue of $30,000,000 per year. Show less

Managed device engineering and test engineering departments with more than 50 engineers and technicians responsible for technology integration, product engineering, yield enhancement, contamination-free manufacturing, parametric testing, and wafer-level functional testing.- Organized and led multidisciplinary project teams to introduce multiple technologies and products from Japan into San Antonio, allowing FAB to generate up to $220,000,000 in revenue per year.- Developed and managed… Show more Managed device engineering and test engineering departments with more than 50 engineers and technicians responsible for technology integration, product engineering, yield enhancement, contamination-free manufacturing, parametric testing, and wafer-level functional testing.- Organized and led multidisciplinary project teams to introduce multiple technologies and products from Japan into San Antonio, allowing FAB to generate up to $220,000,000 in revenue per year.- Developed and managed collaborative relationships with design and product engineering organizations, assembly, and external customers. Achieved rapid new product introduction and high profitability of products, including introduction of 0.35-micron burst SRAM generating $50,000,000 profit. Earned CEO award of the year for project.- Led San Antonio project team in cooperation with San Jose design center to develop Ethernet switch products, setting up high-yield manufacturing by building in manufacturability during design phase and product/yield characterization during trial phase. Established external subcontract back-end operations, including assembly, final test, and reliability testing.- Established systems for yield analysis and spearheaded continuous yield improvement projects. Sponsored multidisciplinary project teams to identify and eliminate mass failure causes in order to avoid cost associated with failures and improve FAB’s on-time delivery performance.- Introduced defect monitoring and improvement system into FAB to assure continuous defect density reduction and die yield improvement, achieving world-class defect levels of 0.17 defects cm-2.- Implemented procedures to handle non-standard material, ensuring quality of wafers and improving customer satisfaction and complaint reduction from 50 to 10 complaints per year.- Achieved reliable test operation, working with internal and external customers, including device engineering, assembly, and final test teams. Show less