Brandon Wolfe Email & Phone Number

Redmond, Washington, Us

Lead hardware designer for the next generation of lidar systems for ADAS and autonomous vehicles.

Koto-Ku, Toyosu, Tokyo, Jp

Spearheading the automotive release of digital controllers and PMIC ICs, leading AEC-Q100 qualification deliverables, and coordination of test plan development across characterization, ATE, and bench validation.

Phoenix, Arizona, Us

Creating the next generation of infotainment modules for battery electric and hydrogen fuel cell semi-trucks including head units and displays.

Chandler, Az, Us

Supervised the USB and networking group (UNG) validation team, with seven direct reports, leading to the successful release to production of automotive ethernet, switch and USB products. Served as technical lead for HW development and automotive EMC and ESD, active contributor to the SAE transceiver qualification specification release.

Chandler, Az, Us

Orchestrated EMC and ESD advancements in ethernet PHY and switch products for US, Europe, and Japanese automotive markets. Chartered common EMC and ESD test platforms to eliminate redundancy and focus on key problem areas including hardware debugging, IC modifications, and testing limitations.

San Jose, California, Us

Managed the systems engineering team, with two direct reports, leading all aspects of the mobile division’s optical and capacitive fingerprint solutions, leveraging in-depth expertise in project management and engineering to lead product, group, and individual employee meetings, addressing workflow in relation to plan, and compiling reports to director regarding progress. Contributed as technical lead of fingerprint module validation, quality/reliability testing, and hardware design to deliver the most robust quality product available.

San Jose, California, Us

Oversaw the capacitive and optical systems and validation engineering technical operations, which led directly to the world’s first mass-produced in display fingerprint sensor, ensuring comprehensive functionality and consistent quality in design. Constructed and verified sensor configurations in alignment with customer’s defined business requirements. Partnered with customers on- site to ensure seamless integration with mobile hardware and software, increasing customer’s digital security through biometrics.

San Jose, California, Us

Spearheaded the technical support for biometric fingerprint sensors for corporation’s largest mobile customer. Analyzed and resolved failure cases, conducting deep-dive assessments to identify and address root cause issues. Managed debugging module and in-system test failures; documented technical reports and reviewed schematics and flexible printed circuit board (PCB) layouts of new designs for upcoming product launches and upgrades.

Chandler, Az, Us

Accountable for the project management, supervision, and oversight of the global Electromagnetic Compatibility (EMC) and physical layer application team for Automotive Information Systems division. Coordinated schedules and task management, allocated resources, managed the budgets, and led program meetings in alignment with engineering objectives. Directed the validation, characterization, and hardware development for next generation physical layer integrated circuits (ICs). Delivered attentive customer support to improve designs, address and resolve inquiries, and provide training to end users regarding implementations and requirements. Researched and developed best practices for testing plans for Electromagnetic Compatibility and Electrostatic Discharge in alignment with stringent automotive manufacturer requirements.

Scottsdale, Arizona, Us

Created new parts for the micro integration and thyristor surge protection portfolio. Collaborated with application engineers to write application notes and create workshop materials. Facilitated the characterization testing of small signal devices.

M.S.E., Circuit Design

B.S.E.E., Electrical Engineering