Calvin Ling Email and Phone Number

Selected to be a Digital Graduate Analyst for Kijang Graduate Program 5.0.

Researching on crack formation arising from void within defective solder involving underfill in flip-chip ball grid array (BGA), commonly used in microprocessors, memory chips, central processing unit (CPU) chips and graphical processing unit (GPU) chips.Developed application to aid and predict ideal laser solder parameter to ensure robust solder joint for different materials, such as SAC305, SAC387, SAC396 and SAC405, which also enables user to add in materials with its properties for scalability purposes.Developed a numerical model analysis of seawater-sediment-freshwater interaction using smooth particle hydrodynamic (SPH) technique via DualSPHysics.

Developed PENFLOW, a software to predict vortex formation on the upstream of a dam and assessing the dam's volumetric flow. Involved in instructing modules on machine learning to industrial and academic experts. Published journal papers.

Involved in the conceptualization, component and system design, proof-of-concept through to testing and producing working prototypes for new applications and innovation.

Developed an algorithm to detect voids in laser solder using convolutional neural network.