Carl Benes Email & Phone Number

Burlington, VT, US

Burlington, Vermont Area

-Design of microelectronic packages for custom SoC in the Artificial Intelligence, Networking and Datacenter markets. -Development of leading-edge advance packing solutions including organic interposers, co packaged connectors, custom HBM, large body, embedded components, and chiplet integration. -Define connectivity, power supply, and mechanical.

Burlington, Vermont Area

Package Design Engineer. -Worked with customers to define microelectronic packaging for custom chips in the wired and wireless network infrastructure and Machine Learning spaces. -Interface with chip physical design, power, test, and noise teams to ensure functional first time right laminate and test card design. -Performed electrical verification testing.

Randolph, Massachusetts

-Use lean principles to develop, analyse and improve manufacturing processes of performance EMI materials-Design and execute experiments to determine root cause of electrical performance and manufacturing problems-Wide breath of rolls from manufacturing process control and improvement, to strategic road map development, maintenance trouble shooting.

Stow, MA

• Research in Class-D Switching Frequency Elevation
• Designed PCB to be used for high frequency reconstruction filter characterization
• Investigated new magnetic materials for HF performance
• Conducted inductor loss analysis through caloric and hysteresis measurements
• Utilized AD and BD switching as well as Pulse Width and Sigma Delta Modulation
• Analyzed amplifier performance using basic audio measurements. Freq. Response, THD, THD+N, CMRR, SNR

Randolph, MA

• Carried out design cycle, through early design, optimization, manufacturing, and production for MetalTag® Echo
• Incorporated specialized dielectric materials into the UHF RFID antenna design
• Presented findings and potential directions to upper management for a new IT asset tracking tag
• Designed a prototype tag with a longer read range than any commercially available tags.
• Analyzed manufacturing costs and made estimates for large scale production, compared to automation
• Managed a team to complete a large scale production order

Boxborough, MA

• Configured and tested routers for RF emissions and immunity to transient phenomena
• Evaluated product performance in harsh electromagnetic environments
• Mitigated design issues involved with chassis power supplies
• Wrote test plans and reports to share test results with current and future EMC team members