Experienced in multi layer PCB design, integrated passive component design, EM simulation and iteration, PCB assemble: 50+pins IC soldering, 01005 components soldering, impedance matching using passive components or transformers. Certified in bondwire machine operation. Familiar with 5G NR/4G LTE standard signals, experienced in gain, ACLR and impedance measurement of RF power amplifiers, MIPI RFFE communication standard, experienced in handling vector network analyzer, spectrum analyzer, communication tester. Experienced in end product handset power amplifier performance optimization projects.