Experienced in multi layer PCB design, integrated passive component design, EM simulation and iteration, PCB assemble: 50+pins IC soldering, 01005 components soldering, impedance matching using passive components or transformers. Certified in bondwire machine operation. Familiar with 5G NR/4G LTE standard signals, experienced in gain, ACLR and impedance measurement of RF power amplifiers, MIPI RFFE communication standard, experienced in handling vector network analyzer, spectrum analyzer, communication tester. Experienced in end product handset power amplifier performance optimization projects.
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Hmic Test TechnicianIts Electronics Aug 2022 - PresentVaughan, Ontario, CaMeasuring and optimizing RF modules in terms of gain, P1dB, spurious emission, image rejection (for upconverter and downconverter), and generate datasheet for the measurement. Troubleshoot returned units and retune the mixer and PA. -
Member Of Technical StaffSana Semiconductors Jul 2018 - Apr 2022Kr
Carlson Lai Education Details
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The Hong Kong University Of Science And TechnologyElectronic And Communications Engineering Technology/Technician
Frequently Asked Questions about Carlson Lai
What company does Carlson Lai work for?
Carlson Lai works for Its Electronics
What is Carlson Lai's role at the current company?
Carlson Lai's current role is RF Rngineer.
What schools did Carlson Lai attend?
Carlson Lai attended The Hong Kong University Of Science And Technology.
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