Willis C. Email and Phone Number
Willis C. work email
- Valid
Willis C. personal email
- Valid
- Over 20+ years working experience, including RF, Mixed-mode IC designer, Application Engineer and FAE Manager in semiconductor industry.- Experience in managing and leading teams in a multicultural group.- Experience in supporting cross-region customers (China/Korea/Japan/SEA)- High Flexibility to visit customer promotion/debugging in APAC.- Familiar with IoT/ARM/AVR MCU, BLE, WiFi, GPS, DC-DC, AC-DC power, Being able to handle various market segments including smartphone, laptop, server, networking, and automotive.- Familiar with EV Battery Exchange System (FPGA) for eBike and eScooter.- Familiar with Server Power Supply System for Rack Server.- Familiar with Server/PC/IIoT/IoT Remote/Dataflash/Touch and Display Controller/TDDI Driver/Smart Metering/Optical transceiver/5G markets.- Solid experience in developing Driver and Touch controller architecture - Solid experience in developing key account’s strategic partnerships to meet current and future product needs.- Good communication and coordination ability for both internal team members and external customers.- Good problem solving, management skill, team work and negotiation skills.- An aggressive, efficient, integrity and willing to share his experience.- A discipline, broad-minded, and highly passion at work.-Holds an M.S. in Electrical Engineering from Tamkang University and Electrical Engineering from St. John’s University.
Renesas Electronics
View- Website:
- renesas.com
- Employees:
- 5650
-
Principal Application Engineer (Embedded Processing,Digital Power And Signal Chain Solution, Iot)Renesas Electronics Apr 2023 - PresentTaiwan, TaiwanRenesas Electronics acquired Dialog Semiconductor -
Principal Application Engineer (Dlg, Industrial Iot Business Group)Dialog Semiconductor Apr 2021 - Apr 2023台灣 Taipei City 台北 -
Fae Manager , Apac(Iots)Adesto Technologies May 2014 - Jul 2020United StatesAE/FAE Manager- In charge of Technical support and Reference Design activities in Asia Pac.Product Line: i. Memory: Octal/QSPI Flash, Wide Vcc flash and CBRAM/RRAMii. Communication: Power Line Communications (PLC), FT Transceiveriii. ASIC: RF SoC, SmartEdge, Rectifier ICiv. IP: Mixed-Signal IP , ADC IP and RF IPv. Embedded System: Pyxos FT Transceiver, IoT Server- Focus on Mixed-Signal IP licensing, Octal xSPI Flash and QSPI Flash for IoT/IIoT Remote solution which be design based on BLE, WiFi, ZWave , RF4CE, and GPS - Co-work with Intel/AMD/Qualcomm/CY/MCHP/Marvell/Qlogic/Z-wave/NXP/STM/Synaptics/Focaltech/Nuvoton/Realtek/MTK/Broadcom/Expressif/Telink/Novatek/Himax/ELAN/Vangotech for ref. design engagement and qualification.AchievementPower Line Comm (PLC) and PLC+PWM (Semitech Semi) Neo Tech: SM2400 PLC for Metering MP, 2019 Clou: Hybrid G3-PLC+RF (Sub-G)FT Transceiver (Echelon) China Tower: Pyxos Transceiver for Battery Exchange Box, MP 2019IP: Mixed-Signal IP, Memory IP (ADC/DAC, AC-DC, PLL, CBRAM)(S3-Semi) Socle Tech :ADC IP, 12-bit 6MS/s Altek: AC-DC converter 220/110VAC to 5V-1.8V Vangotech: 14-bit 1.2MS/s SAR ADC iConsbroad: AC-DC PSU Low Drop 100mA Regulator Rafael Micro: Low Noise Programmable PLL IP HLMC:55nm CBRAM 2Mbit IPOctal xSPI Flash : Chaolong e-dashboard Product Design Win and MP NXP RT1050 EVKit Realtek Ameba Pro Design Win Expressif ES2 WiFi SoC Design WinLow Power/Wide Vcc QSPI flash: Samsung/LG TV's BT Remote MP, 2015 Amazon TV Remote MP 2016 Home Control Remote MP, 2016 Tile Tracker Tag MP, 2016 HP Notebook BIOS MP, 2016 Realtek Ethernet/Camera controller DWin and MP NXP/Nuvoton MCU qualificationDataFlash Z-Wave MP, 2018 Realtek/Aquantia Ethernet controller MP 2020 H3C Server Board MP,2017CBRAM/RRAM: OmniVision CMOS Image Sensor D-Win 2018 LuxVision/Truly/Ofilm CCM Camera module D-Win 2018 OPPO/TCL rear CCM camera module MP,2019 AKM IoT CO2 detector MP 2019 -
Sr. Department Manager Of Field Application Engineer, WwFocaltech Systems Co., Ltd. Dec 2012 - May 2014HsinchuIn Charge of worldwide engineering team for Capacitive Sensing Touch technical support,Mainly focus on Smart Phone/Feature Phone and Large screen size for Tablet/Ultrabook/AIOalso product promotion and SPEC. discussion.Major countries and companies engaged are:- USA, Barnes & Noble, Amazon, HP, Dell, Cisco, Gopro, Garmin, Nvidia- Korea, Samsung, LG, Pantech, Thinkware, Suntel, Iligin - Japan, Panasonic, Toshiba, Japan Display, NisshaAchievementCap Sense Touch Product Design Win/MP GoPro Sport Camera US 2013 Adidas Smart Watch , US 2013 Samsung 15.6" NB Windows 8 Hardware certification, 2013 Samsung Notebook, Korea 2013 Panasonic Portable TV, Japan 2013 Pantech Feature phone, Korea 2013 LG Tablet, US 2013 -
Director Of Marketing And Product DevelopmentCoasia Microelectronics(Taiex: 8096)(Samsung Electronics Distributor) Dec 2011 - Dec 2012TaipeiNovember, 2011 – Sales and Marketing Director TSP Touch BU, CoAsia ElectronicResponsibilities In Charge of Cap sense Touch TSP module Sales/Technical support,Mainly focus on Smart Phone/Feature Phone and Large size touch screen module co-worked with FAE for new customer product presentation and SPEC. discussion. In Charge of Touch Panel EMS team included BOM generation and OEM management based on own developed TSP design which include ITO Pattern and FPC design also support distributor education for product training.AchievementCap Sense Touch Product Design Win/MP ARCHOS 10.1 inch G9 Tablet A87 (1280x800), Now in production ARCHOS 10.1 inch G9 Tablet A10HT(1024x600), Now in production ARCHOS 7” inch 70 Internet Tablet , Now in production ARCHOS 7” inch 70 G9 Tablet , Now in production ARCHOS 10.1 inch Tablet A101XS, Now in production ARCHOS 9.7 inch Tablet A97XS, Now in production ARCHOS 8 inch Tablet A80XS, Now in production ARCHOS 7 inch Tablet A70XS, Now in production Coby 10.1 inch Tablet (Kyros1045), Now in production Altek 3.2 inch DSC, , Now in production AVCT 3.5 inch Smart Phone (Fujitsu) -
Sr. Fae ManagerAtmel Corporation Jan 2004 - Nov 2011TaipeiJan. 2004 – Oct. 2011Sr. FAE Manager, Atmel CorporationResponsibilities In Charge of Cap sense product technical support, mainly focus on Mobile and Large size touch screen co-work with sales for new customer product presentation and spec discussion. In Charge of 32bit MCU included ARM based and Atmel own developed kernel which named AVR-32 technical support, disti education. In Charge of 8/32 bit MCU, Memory, Fingerprint, RF, TPM( Trust Platform Module), and FA process technical support also communication between BU, distributor even customer for technical even quality issue as well. In Charge of Atmel Taiwan Customer Training Center based on Touch/ARM/AVR-32/C51/Crypto/TPM/Fingerprint products. (Atmel CTC training center located in Taipei and Hsinchu). Taiwan Technical Contact Window for ARM/ASIC/CAP/SmartCard/Fingerprint/FPGA/CPLD team (France), AVR-32 design center (Norway), RF/Automotive team (Germany) and TPM/Crypto/EEPROM/FLASH team ( Colorado Spring, US) AchievementMCU Product Design Win. ARM7/ARM9 base – ASIC for Arcade Game (IGS) ARM7/ARM9 base – WiFi USB Dongle (Gemtek) ARM7/ARM9 base – Skype WiFi Phone (Linksys, Netgear, Senao) ARM7/ARM9 base – DSC (Premier) AVR-32/8 base – Home Automation (Zigbee) (Jabil) AVR 8 Base – Blood glucose meters (Altek, Roche) TPM (Trust Platform Module) – Dell, Fujitsu (MiTac/FIH) Laptop PC GPS Tracker( Global Sat, WonderProud) DAB (Mtech, GeroSignal)Cap Sense Product Design Win 2010, Design Win Acer 10.1 inch Tablet ICONIA A500, Now in production 2011, Design Win Acer 10.1 inch Tablet ICONIA A510, Now in production 4.3 inch Mobile (BB2) , Now in production 4.0 inch Mobile (IronMax) , Now in production 7 inch Tablet (Carbon TPK) , Now in production 10.1 inch Tablet( Intel GIX 10) , Now in production -
Senior Fae ManagerAtmel 2004 - Nov 2011Senior FAE Manager -
Sr. Ic Design Manager & Technical Marketing ManagerArchic Tech Corp ( Princeton Technology Group;Taiex: 6129) Aug 1999 - Oct 2003TaipeiEstablished the IC Design and Layout team;US Patent “Digital adjustable chip oscillator” US Patent number: 7002414Responsibilities In Charge of PLL IP design with 0.5um 2P3M CMOS technology targeting embedded 3~20MHz charge-pump PLL IP. In Charge of RF synthesizer design with 0.18um RF-CMOS technology targeting IEEE 802.11 a/g Direct-Conversion Transceiver chipset. In Charge of All CMOS Receiver design with 0.5um CMOS technology targeting ISM 433MHz Receiver chipset. In Charge of 3 band PLL (315MHz/433MHz/915MHz) IP design In Charge of 455KHz On chip Oscillator design RGB Line Driver IP Lecture of Mixed-Signal IC layout (TSMC, UMC, and Episil)Achievement ARC001C 3 band PLL (315MHz/433MHz/915MHz) ARC002B 3~20MHz charge-pump with lock detector PLL ARC003C 455KHz On chip Oscillator ARC005 Poly Fuse PROM ARC006B RGB Line Driver 2.4GHz RF synthesizer for IEEE 802.11 a/g IP (RF-CMOS 0.18um). ISM 315/433MHz All CMOS Receiver IP ISM 3 band PLL (315MHz/433MHz/915MHz) IP
Willis C. Skills
Willis C. Education Details
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Electrical Engineering
Frequently Asked Questions about Willis C.
What company does Willis C. work for?
Willis C. works for Renesas Electronics
What is Willis C.'s role at the current company?
Willis C.'s current role is FAE Manager , APAC at Adesto Technologies.
What is Willis C.'s email address?
Willis C.'s email address is wi****@****ech.com
What schools did Willis C. attend?
Willis C. attended Tamkang University.
What skills is Willis C. known for?
Willis C. has skills like Microcontrollers, Asic, Semiconductors, Ic, Usb, Wireless, Zigbee, Wifi, Firmware, Rf, Avr, Mixed Signal.
Who are Willis C.'s colleagues?
Willis C.'s colleagues are Jack (正軍) Beck (白), 長田純一, Shinichi Yoshida, Robert Lublow, 小杉龍一, Mohd Mirza Azri Bin Mat Zam, Noriyuki Shigehara.
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