Ch Lu Email & Phone Number

1. Advanced technology reliability certification and find the best process solution for the R&D integration team, and make sure the advanced technology can be mass production. Including 0.13um embedded flash, 0.18um embedded flash, 0.35um embedded flash and 0.18um mixed mode. Process qualification has GOI, Vt stability, HCI, EM, SM, TDDB and product qual has HTOL, THB, PCT, TC, TS, ESD, and Latch-Up.2. Reliability monitor for mass production technology to customer’s requirement, including 0.13um, 0.18um, 0.25um, 0.35um, 0.5um embedded flash.3. Build up advanced technology design rule as the bridge between foundry and the designer for mass production, including 16nm FinFET design rule, 22nm SOC design rule, 28nm high performance high-k metal gate design rule, 28nm low power high-k metal gate design rule, 45nm low power design rule, and 45nm high performance design rule.4. Improve production line yield by failure analysis, including 4 technology DRAM processes of 0.35um, 0.25um, 0.22um, and 0.18ums. 5. Build DRM test machine system, Burn In machine system and probe card. Failure analysis including wafer sort, burn-in and package FT.6. Acceptance of CP/FT/Burn-In machine system, mass production tooling, and probe card.

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  University Of Portsmouth

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