 Architect new platforms while working with the product management and software teams as well as keeping in mind the business goals and industry trends. Knowledge of x86 server architecture, including compute, storage, and networking. Experience working with DDR4, PCI-E, SATA, SSD, and 1GE/10GE Ethernet, etc. Experience working with cross functional disciplines like Firmware, Mechanical, Thermal, Testability, Diagnostics, EMC and Safety Compliance, etc. Lead product design, implementation and validation efforts through in-house resources and ODM/JDM partners from concept to production. Experience with server platform essentials such as BIOS, BMC, thermal, power optimization, and mechanical design. Independently drive product compliance by providing test configurations and necessary OS image to qualify components like CPU, memory, HDD/SSD and add-on NICs with all necessary driver support and testing scripts. Perform schematic capture including schematic symbols creation. Experience in Linux/BASH scripting, compiling driver and basic kernel level knowledge.

• Develop server systems based on the latest x86 architecture. This includes defining server configuration, system integration, and bring-up.• Evaluate and qualify system components such as CPUs, motherboards, SAS/SATA Drives, DIMMs, and PCIe add-on cards for current and next generation server platforms.• Review design schematics and board layout of NVRAM cards. Good understanding of Signal Integrity basics. Experience working with CMs for PCB fabrication, component selection and EOL component replacement.• Develop test fixtures for SDRAM DIMMs and disk drives. Perform DIMM testing under temperature variation and CPU load using linux based test software.• Perform thermal testing of server systems to qualify new hardware. This includes determining critical components, thermocouple routing, test bench setup, recording measurements and documentation. Familiarity with system compliance testing, which includes EMI/EMC, Safety, and RoHS qualifications.• Work with manufacturing engineers to create new product introduction (NPI) process to transition from prototype to production.• Perform failure analysis of field returns, DOAs, and prototypes. Generate root cause analysis report.• Research upcoming technologies and meet vendors to discuss and pursue the same.

• Customize rugged laptops and PDAs to meet customer requirements. Bring-out USB, VGA, and Ethernet signals to military connectors using motherboard schematics.• Test and troubleshoot electronic hardware at board, component, and system level. • Experience with complete product development cycle from prototype to production. Document work instructions for product customization and provide them to production team.• Participate in hardware design reviews and take inputs from all team members. Work as a team to achieve project goals, meet deadlines, and ensure quality products and customer satisfaction. • Analyze and record test results using Oscilloscope and other lab equipment. Good soldering skills.

Designed a Three-Stage Wideband Transimpedance Amplifier (TIA) in AMS BiCMOS Technology for Optical Receivers• Performed Small Signal Analysis of individual stages, and Overall AC and Transient analysis to measure Gain, Group Delay, -3dB bandwidth, Eye-Diagrams, and noise. All simulations performed in H-SPICE.