After obtaining my Bachelor's Degree in Chemical and Biological Engineering from Colorado State University, I embarked on a professional journey with Micron Technology, Inc., a global leader in semiconductor innovation. Currently, I hold the position of Real-time Defect Analysis Principal Engineering Lead within Micron's Boise Research & Development Fab, where I am leading a team of highly skilled engineers focused on defect reduction and yield improvement for several of Micron's cutting-edge emerging technologies.My experience at Micron has been multifaceted, initially serving as an RDA process engineer where I contributed significantly to multiple generations of 3DXP and RG NAND flash technologies. In this role, I honed my expertise in defect analysis and developed a deep understanding of the intricacies of semiconductor manufacturing.As an RDA Engineering Manager with experience on both HRAM, 3D DRAM, and other advanced nodes of Micron's DRAM roadmap, I am committed to driving excellence in defect reduction and yield improvement efforts. I bring a strategic and results-oriented approach to my managerial responsibilities, ensuring that our team remains at the forefront of innovation in semiconductor technology. My leadership is founded on a dedication to continuous improvement, fostering collaboration, and achieving tangible results that align with Micron's commitment to technological advancement.In summary, my tenure at Micron has been marked by a progression from a hands-on RDA process engineer to the leadership role of RDA Engineering Manager. I thrive on the challenges of working with cutting-edge technologies, and my passion lies in delivering impactful solutions that contribute to the success of Micron Technology on a global scale.
Listed skills include Rams, Academic Research, Ion Exchange, Chemical, and 166 others.