Chris Combs Email and Phone Number

Director of Engineering of Intel's data centric product development organization responsible for leading platform HW development activities totaling >$500M in annual R&D spends to architect, design, manufacture, deploy, validate and accelerate product delivery across many data platform businesses including Cloud, AI, HPC, Enterprise, Government, Network and Edge

Engineering Manager / Director responsible for the engineers and automation team supporting the development of new Intel Product Packaging Technology and the engineers supporting the NPI Lab. Managed the capital budget and engineering resources to support prototype system assembly for Intel's business units and the process development for Intel component package technology. Responsible for the assembly development roadmap and validation of Intel’s CPU, SoC, chipset BGAs and sockets across Datacenter, AI, storage, network and Client business units. Implemented SAP automation, quality systems and LEAN manufacturing principles to improve quality and increase efficiency.

Strategic product planner responsible for the High Performance Computing / AI segment’s requirements and planning for the Xeon and Xeon Phi product roadmaps as well as technologies including network fabrics, memory and storage. The scope of the job includes being the Intel product planning representative to HPC customers, providing long range roadmap presentations, supporting large HPC cluster design wins, and leading deep technical engagements. Specific accomplishments include...- Led a task force that drove the IO bus strategy and roadmap decisions for the Xeon and Xeon Phi products.- Drove proposals for new products that impacted Intel’s server roadmaps.- Formed and led a cross divisional team that defined Intel's visualization strategy for technical computing and pitched a software development proposal to senior management.- Utilized decision quality (DQ) process and techniques that resulted in improved decision-making.

Program managed two high profile programs within two divisions at Intel, the Visual Computing Group and the Data Center Group.- Intel’s first Many Integrated Core product and SDV program, Knights Ferry, which targets the high performance computing (HPC / AI) market.- A complex and demanding product development program, Larrabee, that targeted the high end discrete graphics card market.Program management responsibility for each of these products involved leading and coordinating the efforts of hundreds of people working across multiple divisions and geographies to develop and deliver samples to customers and the ecosystem developers. Overall accountability for the product’s execution and success, including silicon design/mfg, board design/mfg, marketing, customer enabling, ecosystem enabling, software/tools development, and product validation. Directly reported status to the general manager and vice president. Effectively utilized consultative decision-making and mitigated conflict resolution across division boundaries while maintaining program priorities, requirements, and schedule.Other responsibilities included chairing the "War Room", which was the decision-making and escalation forum for engineering issue resolution. Led the working group that prepared and successfully executed the first Many Integrated Core A-0 silicon and platform power on.

Manager responsible for establishing and growing an engineering enabling group within Intel’s Technology Manufacturing Group. The group’s charter is to support the success of Intel platform launches by proactively mitigating Intel technology manufacturing, quality, and reliability integration issues. The group serves as consultants to Intel’s OEM and ODM customers as well as equipment manufacturers.Managed 13 engineers across Oregon, Washington, Arizona, and Malaysia sites supporting Intel’s major platform launches for the primary market segments: Desktop, Mobility, and Server. Established relationships with key business unit stakeholders, technology development partners, field account teams, and OEM / ODM customers in the U.S., China, Taiwan, Japan, Brazil, and Europe. Established a Customer Enabling Strategy for the Mobile Division, and then proliferated it across the organization, resulting in more structured customer engagements, planning, and value to Intel customers.

As the first program manager in a newly formed customer enabling team within Intel's Technology Manufacturing Group, I was awarded Intel's highest honor, the Intel Achievement Award for leading the first CME worldwide program that was credited for the industry success of Intel’s revolutionary new desktop CPU transition to the new Land Grid Array technology. I was also recognized by four separate divisions (DRAs) for leading cross-functional and geographically dispersed engineering teams responsible for the successful worldwide launches of Intel Customers’ Desktop Platforms within the OEM and ODM customer manufacturing sites. Other resposibilities included establishing OEM, ODM, and equipment supplier relationships worldwide to increase Intel’s influence as well as the development of multiple risk mitigation and customer enabling strategies, leading and lagging performance measures, and a customer issue response process.

As a technology development engineer within the Technology Manufacturng Group, I worked on several critical initiatives: Transferring products to a manufacturer in Malaysia, process development certification of four new technologies, developed and implemented a patented equipment improvement at manufacturing sites worldwide, development and transfer of a Server Platform to Malaysia, and the project lead responsible for installing and certifying a high volume / high mix manufacturing line.

Responisibilities included application engineering and technical sales support for several key customers including HP, IBM, Intel, Delphi, Jabil, Motorola, SCI, and Solectron. I also supported development teams in Ireland on beta-site testing to improve software and mechanical design as well as providing direct customer support on applications development and training on software and equipment.

As a manufacturing technology development engineer at Compaq, I had the pleasure to work on several interesting and challenging projects including:- Developed a vision inspection system and algorithms to improve product quality and reduce scrap.- Designed and implemented a high speed manufacturing line (annual savings of >$2.7 million per line).- Led an extensive cross-division team, evaluating board-to-board connectors for Compaq’s new portable products.- Developed a component re-balling process that resulted in a corporate annual savings of $200,000 per year.

As a manufacturing engineer at Motorola, in one of the first digital cellular phone factories, I was exposed to cutting edge manufacturing technology and every aspect of manufacturing.- Lead project manager over a $12.5M manufacturing line installation.- Product engineer for digital cellular phone models, supported manufacturing through the product lifecycle.- Manufacturing engineer that rotated through supporting all areas of manufacturing and assembly.- Led a weekly quality improvement meeting that resulted in a 20% increase in line yield.- Developed an automated machine vision system for inspecting cellular phone keypads and displays.

Being a co-op student and working for Delco Electronics provided amazing job assignments and a wealth of experience while attended Purdue. Some of the highlights include:- Originator of a patented wafer to board flip chip feeder for automated component placement machines.- Supervised 18 operators in a surface mount facility and increased efficiency by implementing a relief system.- Acted as a manufacturing engineer in Liverpool, England, providing engineering support in the SMT process.