Che Guevara Email & Phone Number

Costa Rica

Factory Strategic Project DeploymentAdvance packaging developmentProject Manager - Development of capability and deployment into production of DPS( Die Processing Service ) for FC DieDPS Operations Engineering ManagerSubcon Engineering and project management

 Project manager for the successful factory site transfer program of implantable medical products from Microsemi’s Scottsdale Arizona factory to Microsemi, Philippines. Start up operation and ramp up to production management at Microsemi, Philippines Headed the Quality System Management group tasks with ensuring all requirements and preparations for site qualification audit by Microsemi’s various customers are met. Worked cooperatively with various cross functional group both within Microsemi and the subcontractor to ensure project success.

 Resident Assembly Engineer stationed in Carsem Ipoh Malaysia for Microsemi’s Analog and Mixed Signal products. Coordinated assembly manufacturing activities on suppliers located in Malaysia, Thailand, and China covering a total of 8 factory sites. Reviewed requirements, specifications and package assembly design prior implementation by suppliers. Participated in weekly operations meeting with supplier to drive yield and continuous improvement programs. Responsible for ensuring all qualified assembly and test subcontractor in Asia are in compliance to Microsemi requirements. Performed annual supplier quality system audit based on ISO standards. Hosted 3rd party customer audit of Microsemi’s subcontractor in Asia Coordinated customer complaint resolution with supplier to ensure closure and that permanent corrective actions are implemented. Ensures compliance of all suppliers to RoHS requirements.

 Led a team of Package Development Engineers responsible in defining best assembly process in System in Package( SIP ) for RF, Memory and Fingerprint Sensor Modules. Managed a core team of Process Engineers in qualifying new customers for Amkor’s SIP technology. Coordinated all technical development activities( MSL improvement programs, design rule enhancements, Green BOM and next generation material qualification ) for SIP. Specific tasks related to RF Module Product Engineering include :- Package design and Material review and approval- Special Work Instruction generation- Daily coordination of build requirements and scheduling of Engineering and Qual builds- Initiates process flow and qualified material list for customer approval- CCAR and customer issue resolution thru 8D methodology with direct involvement on failure analysis activities.1995 - 1998 : Reliability and Failure Analysis Engineer Was part of the QRE set up team for Amkor Philippines P3 factory.1998 - 2000 : Assembly FOL Process Engineer II and III Chip Array BGA Package assembly with prime expertise in Die attach and Wirebond process2000 - 2003 : Senior Engineer/Section head System in Package( SiP ) Module package and process development

Ece, Electronics And Communications Engineering

Education record