Senior Management Professional with 27 years of experience in Assembly Process Engineering and 12 years in OSAT management within semiconductor Assembly and Final Test Operations. Successfully led multiple high-impact projects, driving operational excellence and innovation. Expert in Cost of Ownership Reduction, utilizing 6 Sigma methodology, process optimization, and value engineering to significantly reduce manufacturing costs.Career Profile• Driving Operational Excellence: Proficient in collaborating with OSATs to meet key delivery targets through accurate capacity models, value stream mapping, and achieving benchmark process cycle times.• Cost of Ownership Reduction: Minimized costs by co-developing loading strategies with the Sourcing team, leading continuous yield improvement activities, and implementing value engineering practices, resulting in significant cost savings.• Effective Leadership: Demonstrated leadership during startups by motivating internal teams and establishing strong rapport with OSAT’s upper management and engineers, ensuring cohesive efforts towards common goals within set timelines.• Dedication and Commitment: Renowned for dedication and commitment to collaborating with all levels of the organization to meet company objectives.• Six Sigma Practitioner: Utilized Lean Six Sigma methodologies to eliminate waste in manufacturing processes, achieving benchmark cycle times and enhancing overall efficiency.Areas of Expertise• 6 Sigma methodology • Operation and OSAT Management• Continuous Improvement / Value Engineering • Cost Reduction and Gross Margin improvement• Process Start ups • Cross Functional Team Leadership
Utac Group
View- Website:
- utacgroup.com
- Employees:
- 1912
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Vice President, Operation ExcellenceUtac GroupSingapore -
Director, Ext Mfg Operation And PlanningOn Semiconductor Nov 2014 - PresentLeading a team of Operation Engineers to support daily engineering needs and sustain output to meet company's commitment to customers. Working closely with subcons to drive yield improvement and value engineering activities to reduce operation cost and maintain line / machine efficiency to reduce maximize capital investment.Lead Planning teams to develop capacity models with subcons and work with Corporate Planning on allocation and maximize output from Subcons base on lowest CoO. Concurrently driving subcons to reduce product cycle time to minimize WIP and reduce opportunity cost.Work with NPI team and BU PEs to enhance NPD EBR performance from subcons to meet time to market / revenue. -
Director Of Operations_Aptina Taiwan Engg OfficeAptina Dec 2012 - Nov 2014SingaporeResponsible for- Leading NPI team to driving NPI performance to meet AS/ES/ DP4 yield targets at respective subcons via the use of safe launch process.- Setting of AOP targets, quarter lock budget for MP operation.- Leading Operation team to drive subcon yield of MP devices to meet AOP targets in the most cost effective manner. - Leading Production Controller team to reduce the CT at all Subcons and therefore reduce WIP and promote JIT wafer delivery.- Manage R&D and Test Engg team in their daily operation.- Daily operation of Aptina Technical Engg Centre in Hsinchu, Taiwan. -
Senior Operation ManagerAptina Aug 2009 - Dec 2012SingaporeInvolve in the startup of various Subcons in Taiwan / Japan / Philippines and China to support Aptina's business needs in terms of die and package sales. Had gained experience in working with people from different cultures and mentality under demanding situations to generate common targets / improvement plans to meet yield targets, cost reduction and OTD.Championed and drive Subcon Development Plans at selected subcons to enhance their performance to match Aptina's expectations and requirements. It was heartening to witness 1 of the subcons establishing itself as a prominent subcon within the Imaging industry. -
Process ManagerMicron Technology Jun 2007 - Aug 2009Singapore• Promoted to Section Manager in 2007: Recognized for exceptional performance and leadership capabilities• Pioneered Imaging Die Sales Process: Played a key role in starting up the Imaging Die Sales Process for Micron Singapore. Successfully took over as the primary site for Die Sales Production, achieving a production volume of 6Mu per week and maintaining Micron’s position as the leading supplier of CMOS Imaging industry. • Led Process Engineering Team: Directed a team of Process Engineers to provide mass production support in Chip Prep processes. Developed advanced Thinning and Dicing processes to support Micron’s Advanced Packaging Roadmap for NAND and SDRAM products. Established a thinning and dicing process for 50um NAND die thickness using Film-On-Wire (FOW) tape for stack die packages• Innovative Patent Holder: Accumulated a total of 16 US personal and joint patents while working on Thinning, Dicing, and Wire Bonding processes (1998 – 2007). Patents cover innovative ideas related to Assembly Processes and Package Development.
Chee Peng Neo Skills
Chee Peng Neo Education Details
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Singapore Quality Institute6 Sigma Black Belt -
Biomedical/Medical Engineering -
Nanyang Technological UniversityMechanical Engineering
Frequently Asked Questions about Chee Peng Neo
What company does Chee Peng Neo work for?
Chee Peng Neo works for Utac Group
What is Chee Peng Neo's role at the current company?
Chee Peng Neo's current role is Vice President, Operation Excellence.
What schools did Chee Peng Neo attend?
Chee Peng Neo attended Singapore Quality Institute, Nanyang Technological University, Nanyang Technological University.
What are some of Chee Peng Neo's interests?
Chee Peng Neo has interest in Hiking And Running, Golfing.
What skills is Chee Peng Neo known for?
Chee Peng Neo has skills like Manufacturing, Six Sigma, Yield, Engineering, Fmea, Operations Management, Jmp, Dmaic, R&d, Lean Manufacturing, Microsoft Office, Design Of Experiments.
Who are Chee Peng Neo's colleagues?
Chee Peng Neo's colleagues are Ramya Palanisamy, Glaiza Rutaquio, 曹志奉, Tony Hsu, Thuya Thein Kyaw, Alep Lah, Ding Tou Xiong.
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