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> 8.5 years of experience in micro/nano-fabrication, semiconductor inspection and metrology, FEA and experiments (e.g., thermal, electrical, mechanics), mechatronics (e.g., MEMS, automation control, embedded system), image processing and interdisciplinary background in electrical engineering, mechanical engineering, artificial intelligence and material science.My areas of expertise:• Semiconductor Micro/Nano-fabrication Technology (Lithography, Photomask writer, Dry/Wet Etching, PVD/CVD/ALD, Laser Micromachining, Critical Point Dryer)• Semiconductor Inspection and Metrology (SEM, AFM, FIB, Profilometer and Ellipsometer)• Thermal, Mechanics and Electrical Finite Element Simulation (ANSYS and COMSOL)• Thermal, Mechanics and Electrical Experimental Design and Measurement (Thermal Imager, Oscilloscope, Multimeter, Signal Generator, High Voltage DC Power Supply, Lock-in Amplifier)• Mechatronics (Embedded System, System Automation Control, Test Automation)• Ultra-high Vacuum (UHV) Systems (Pump, Valve, Pressure Gauge, Stage, MFC, Diffuser, Purifier, Heater)• Artificial Intelligence, Programming and Software (Machine Learning, Deep Learning, C#, Java, Python, R, MATLAB, Wolfram Mathematica, AutoCAD, SolidWorks, LayoutEditor, BEAMER, Cadence, ADS, ModelSim)
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Research Scientist 3Kla Oct 2018 - Aug 2020Milpitas, California, Us• Working on an advanced high-throughput electron-beam inspection system based on arrays of miniature columns -
Senior Mechanical Engineer IAsm Aug 2018 - Oct 2018Almere, Flevoland, Nl• Redesigned the mechanical components in a pre-clean and an epitaxy tool to solve the customers’ problems -
Senior Research EngineerUniversity Of Pennsylvania - Singh Center For Nanotechnology Jun 2018 - Aug 2018Philadelphia, Pa, Us• Studied the dose and shape modification proximity effect correction of the e-beam lithography process -
Research AssistantUniversity Of Pennsylvania Aug 2013 - May 2018Philadelphia, Pa, UsResearch Assistant, Department of Mechanical Engineering and Applied Mechanics, University of PennsylvaniaAdvisor: Assistant Professor Igor Bargatin (e-mail: bargatin@seas.upenn.edu)High Efficiency Wafer-scale Thermionic Energy Converters (TECs)• Simulated, designed and microfabricated segmented expansion anode arrays to accommodate large thermal expansion• Simulated, designed, fabricated and characterized stretchable anode-cathode insulating standoffs with microscale height• Achieved good vacuum sealing using liquid metal alloy for future TEC vacuum packagingTuning the Mechanical Properties of Vertical Graphene (VG) Sheets• Tailored mechanical properties of VG sheets through different methods, such as fluorination and ion bombardmentPlate Mechanical Metamaterials (PMMs)• Micro/nano-fabricated robust, ultrathin, ultralight and flat PMMs (single-layer, two-layer and nanocardboard) with high bending stiffness and macroscopic lateral dimensions, and simulated and tested the mechanical properties of nanocardboardThermal and Electrical Contact Conductance Measurement• Characterized electrical or thermal contact conductance of conductive and highly insulating interfaces under high vacuum -
Research AssistantPeking University Sep 2010 - Jun 2013北京, Beijing, CnResearch Assistant, Institute of Microelectronics, Peking UniversityAdvisor: Professor Dacheng Zhang (e-mail: dchzhang@ime.pku.edu.cn)Research on the Performance Optimization of Tin Oxide Thin Film Gas Sensors• Studied tin oxide thin film gas sensor mechanisms, and designed the comb-shaped heating electrode to improve the selectivity and reliability of the device guided by ANSYS simulation results of the temperature, stress and current density distributions• Tested ethanol and humidity sensing properties after gas sensors were micro/nano-fabricated under different process conditions, and the composition and temperature distribution of the nanoscale tin oxide film were also measuredMonolithic Integrated CMOS-MEMS Technology• Designed new semiconductor fabrication processes with group members during the fabrication of the monolithic integrated CMOS-MEMS bimaterial micro-cantilever resonant infrared sensor and resonator -
Summer InternWuxi China Resources Huajing Microelectronics Co., Ltd. Jul 2010 - Aug 2010• Learned the semiconductor manufacturing process of the bipolar transistor chip and the method of the chip testing
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Research AssistantNankai University Mar 2010 - Jun 2010南开区, 天津市, CnAdvisor: Associate Professor Fuhai Zhang (e-mail: zhangfh@nankai.edu.cn)Application of Long-range RFID-based System Design • Studied various tag anti-collision algorithms and designed the hardware and software parts for the RFID systemMultifunctional Electronic Meter Ruler (Ultrasonic Ranging) • Designed, built, tested and packaged the ultrasonic ranging system together with group members
Chen Lin Skills
Chen Lin Education Details
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University Of PennsylvaniaMechanical Engineering And Applied Mechanics -
Stanford UniversityStanford Center For Professional Development (Scpd) Non-Degree Option (Ndo) Student
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University Of PennsylvaniaElectrical Engineering
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University Of PennsylvaniaMechanical Engineering And Applied Mechanics
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Peking UniversityMicroelectronics And Solid State Electronics
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Nankai UniversityMicroelectronics
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Wuxi No.1 High School
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Wuxi Foreign Language School
Frequently Asked Questions about Chen Lin
What is Chen Lin's role at the current company?
Chen Lin's current role is Ph.D. in Mechanical Engineering and Applied Mechanics at the University of Pennsylvania.
What is Chen Lin's email address?
Chen Lin's email address is ch****@****kla.com
What is Chen Lin's direct phone number?
Chen Lin's direct phone number is +121549*****
What schools did Chen Lin attend?
Chen Lin attended University Of Pennsylvania, Stanford University, University Of Pennsylvania, University Of Pennsylvania, Peking University, Nankai University, Wuxi No.1 High School, Wuxi Foreign Language School.
What are some of Chen Lin's interests?
Chen Lin has interest in Travelling, Music, Watching Movies And Tv Series, Reading.
What skills is Chen Lin known for?
Chen Lin has skills like Micro/nano Fabrication, Sem/esem/optical Microscope, Afm, Matlab, Thermal Conductance Measurement, Mems Device Design, Comsol/ansys, Matlab/mathematica/maple, Electrical Measurement, Ms Office, Autocad/inventor/solidworks/layouteditor/adobe Photoshop/imagej, High Vacuum.
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