1. Mm-wave and THz channel characterization and modeling for indoor propagation• Performed channel sounding measurements at 26.5–40 GHz, 110–170 GHz, and 300–320 GHz for comparing performance of various path loss models, e.g., ITU, 3GPP/FI, CI, CIF, ABG.• Characterized mm-wave and THz propagation interaction (insertion loss, reflection coefficient) with various materials, e.g., glass, plastic, ceramic, human body tissue, FR4, copper, wood.2. Modeling of diffraction and scattering at 30 GHz, 140 GHz, and 300 GHz• Performed channel sounding measurements for developing diffraction model based on the UniformGeometrical Theory of Diffraction (UTD).• Skilled at digital signal processing (DSP) for analyzing diffraction and scattering caused by ceramicmugs and metallic rods at mm-wave and THz frequencies.3. THz MIMO channel characterization and statistical modeling for data centers• Performed channel sounding measurements for developing statistical cluster-based model for power delay profile (PDP) and 2-D narrow band geometrical channel model for Doppler power spectrum.• Skilled at DSP for analyzing PDP, RMS delay spread, and coherence bandwidth, and evaluating the impacts of obstructions of cables, server racks, and mesh structures on THz propagation.4. 3D-printed double ridged broadband horn antenna at 4 GHz–16 GHz• Designed broadband 3D-printed horn antennas with gain of 18 dBi, center frequency of 10 GHz, and bandwidth of 12 GHz.• Conducted simulation with CST and fabricated antenna with 3D printer.5. RF matching network for 2.4 GHz front-end amplifier• Designed input/output matching networks to maximize gain of microwave amplifier; outperformed required return loss by 3 dB.• Proficient with Smith chart, ADS simulation, PCB layout and fabrication.6. Antenna-less RFID tag based on commercial FPGA• Invented antenna-less RFID tag based on existing microprocessors at zero cost without using antennas and RF front-end circuits

• Designed a process flow to accelerate FCC regulatory testing (SAR, MPE, RSE, EMC) for LTE/WLAN IEEE 802.11x across four divisions over three states and two continents.• Spearheaded customer enabling project that identified corporate divisional gap and streamlined business processes for IoT products.• Identified CPU and SOC products key architecture needs for Internet of Things (IoT) applications, including hardware, firmware, OS, drivers, software applications, and functional safety standards.

• Being one of the first five employees at Cognosos, which later raised $7.1 million in Series A funding.• Designed RF matching networks for 433 MHz GPS sensors.• Conducted RF diagnosis: VNA, spectrum analyzers, oscilloscopes, power meters, EIRP/TRP testing.• Contributed to products development full life cycle, including prototyping, field test, improving design based on customer feedback.

• Assisted 200+ senior students on topics of PCB layout design/fabrication, SMD soldering, measurement techniques, and Arduino/Raspberry Pi.

• Research topic: Fast Signal Integrity Methodology for High-Speed PCB Channels Analysis.• Proposed a modified formula for PCB channel evaluation; reflection noise reduced by45.8%.• Published a first-author paper entitled “Modified Pseudo Eye Metric for Mismatched TransmissionLines” in 2013 IEEE Electrical Design of Advanced Packaging & Systems (EDAPS) symposium.

• Engaged in testing enterprise-level cloud computing systems and proposed algorithmic solutions to reduce virtual machines construction time.

• Developed an innovative metric to to rapidly evaluate high-speed PCB channel performance; saved 90+% simulation time compared with traditional PRBS-eye diagram.• Proficient in EMC/EMI and signal integrity analysis for high-speed PCB systems, e.g. S-parameter characterization with HFSS, TDR measurement, impedance matching, crosstalk coupling analysis.