In charge of IC substrate front end engineering managers.1. Communication to customers and internal corporate groups for NPI and engineering issues2. Yield improvements, process capability improvements and process issue solving3. Manage the engineering activities during product development stage including process tuning, performance characterization, qualification and handover to production. 4.New machines/process/material stepwise and qualification.5. Drive plant level task force to solve the IC substrates process excursion/day1 issue.

Process engineering manager for SiP products and PLP (Panel Level Package)Responsible for1. Accountable for the tactical and strategic management of a multi skilled, high performance engineering team 2. Communication to customers and internal corporate groups for NPI and engineering issues3. Yield improvements, process capability improvements and process issue solving4. Manage the engineering activities during product development stage including design validation, performance characterization, qualification and release to production. 5. Manage product sustaining activities which include driving product performance, yields, and cost by working closely with manufacturing and QA teams.6. Work with the Manufacturing, Quality, and Failure Analysis teams in the disposition of product excursions.7. Coach and mentor team to improve engineering work standard, bridge technical competency gap, reduce dependency to central engineering and build concrete high moral team8.Coordinate on time completion of overall project timing, milestones, and key deliverables including samples, as well as tracking program/projects APQP, Costs, Quality, and Validation.

New product integration department for new product layout/ structure/ process flow design to provide the the optimum solutions, and provide end customers and assembly houses technologies and design guidelines information to reach the tripartite needs.

New product engineering manager for Fan-in WLCSP products including RDL only products, the job contains control Qual run progress, contact the factory resources to meet customer’s request & complete the technology transfer and provide the customer related processes and solutions to achieve customers' needs.

Project Management Department assistant manager, applied new concept of the PTP (Paper Thin Package) package. In this project, I was responsible for process definition, structure spec. definition, control plan & FMEA develop and yield improvement projects and I was also responsible for the development of the Square panel fan-out WLCSP project, Double side fan-out WLCSP project (PoP WLCSP), New fan-out WLCSP material evaluation &New fan-out WLCSP – slit coater machine evaluation and other project development

I was responsible forEmbedded passive component substrate projectEmbedded chip substrate project15/15 & 20/20 PCF fine line projectLow CTE core material evaluationParticipateLow cost flip chip CSP projecta-S3 substrate developAnd other R & D project development at the ASE during employment, raised a total of more than 40 patent applications, including the licensing of 24 patent drafting process, and learn how to make the patent map.