Ching-Kai Chou
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Ching-Kai Chou Email & Phone Number

Deputy Technical Manager at Moldex3D (CoreTech System Co., Ltd.)
Location: New Taipei City, Taiwan, Province of China 8 work roles 2 schools
1 work email found @moldex3d.com LinkedIn matched
✓ Verified August 2026 4 data sources Profile completeness 100%

Contact Signals · 1 work email

Work email c****@moldex3d.com
LinkedIn Profile matched
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Role
Deputy Technical Manager
Location
New Taipei City, Taiwan, Province of China
Company size

Who is Ching-Kai Chou? Overview

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Quick answer

Ching-Kai Chou is listed as Deputy Technical Manager at Moldex3D (CoreTech System Co., Ltd.), a with 183 employees, based in New Taipei City, Taiwan, Province of China. AeroLeads shows a work email signal at moldex3d.com and a matched LinkedIn profile for Ching-Kai Chou.

Ching-Kai Chou previously worked as Assistant Technical Manager at Moldex3D (Coretech System Co., Ltd.) and Principal Engineer at Moldex3D (Coretech System Co., Ltd.). Ching-Kai Chou holds Doctor Of Philosophy (Phd), Civil Engineering from National Taiwan University.

Company email context

Email format at Moldex3D (CoreTech System Co., Ltd.)

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cchou@moldex3d.com
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AeroLeads found 1 current-domain work email signal for Ching-Kai Chou. Compare company email patterns before reaching out.

Profile bio

About Ching-Kai Chou

As a dedicated Software Engineer, Developer, and Researcher specializing in Computational Physics and Mechanics, I bring a wealth of experience and a strong academic background to my work. I am passionate about advancing technology and solving complex problems through innovative solutions.Professional Experience:My professional journey began as a Ph.D. student at National Taiwan University, specializing in Civil Engineering with a focus on Computational Fluid Dynamics. During this time, I was awarded a scholarship to serve as a Visiting Scholar at The University of Texas at Austin, where I conducted cutting-edge research at the Institute for Computational Engineering and Sciences (ICES) under Professor Thomas J.R. Hughes.Currently, I hold leadership roles at Special Enterprise Ltd. 思倍秀有限公司 and Bonus Enterprise Co. Ltd. 柏納思股份有限公司, contributing to strategic decision-making and company growth. My role at Moldex3D (CoreTech System Co., Ltd.) has further deepened my expertise in Computational Mechanics (CM), Computational Fluid Dynamics (CFD), High-Performance Computing (HPC), and Computational Materials Science, focusing on polymer flow simulation and advanced semiconductor packaging simulation.Research and Innovations:I have made significant contributions to computational mechanics and fluid dynamics through patents and publications. My patented method of mesh generation for resin transfer molding processes (US20230058453A1) introduces an advanced approach to creating solid meshes that integrate different grid dimensions, improving simulation accuracy and efficiency. Additionally, my patent on measuring voids in underfill packages (US11521903B1) provides a novel technique for identifying and simulating high-risk void regions, enhancing the reliability of underfill materials.My research publications demonstrate my commitment to solving complex engineering problems through innovative methods. I developed a meshless approximation finite volume method for handling convection-dominated problems on unstructured and deformed meshes. Combining the method of characteristics with the meshless localized radial basis function collocation method, I provided a robust solution for simulating shallow water equations, ensuring stability and accuracy even in challenging conditions. Additionally, my work on the method of fundamental solutions for 3D exterior potential flows offers a meshless approach to solving unbounded domain problems, simplifying computational procedures and reducing resource requirements.

Listed skills include Research, Cae, Matlab, Simulations, and 21 others.

Current workplace

Ching-Kai Chou's current company

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Moldex3D (CoreTech System Co., Ltd.)
Moldex3D (Coretech System Co., Ltd.)
Deputy Technical Manager
hsinchu county, taiwan, taiwan
Website
Employees
183
AeroLeads page
8 roles

Ching-Kai Chou work experience

A career timeline built from the work history available for this profile.

Chief Executive Officer

Bonus Enterprise Co. Ltd. 柏納思股份有限公司

Taipei, Taipei City, Taiwan

Chairman Of The Board Of Directors

Special Enterprise Ltd. 思倍秀有限公司

Taipei City, Taiwan

Team & coworkers

Colleagues at Moldex3D (CoreTech System Co., Ltd.)

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2 education records

Ching-Kai Chou education

FAQ

Frequently asked questions about Ching-Kai Chou

Quick answers generated from the profile data available on this page.

What company does Ching-Kai Chou work for?

Ching-Kai Chou works for Moldex3D (CoreTech System Co., Ltd.).

What is Ching-Kai Chou's role at Moldex3D (CoreTech System Co., Ltd.)?

Ching-Kai Chou is listed as Deputy Technical Manager at Moldex3D (CoreTech System Co., Ltd.).

What is Ching-Kai Chou's email address?

AeroLeads has found 1 work email signal at @moldex3d.com for Ching-Kai Chou at Moldex3D (CoreTech System Co., Ltd.).

Where is Ching-Kai Chou based?

Ching-Kai Chou is based in New Taipei City, Taiwan, Province of China while working with Moldex3D (CoreTech System Co., Ltd.).

What companies has Ching-Kai Chou worked for?

Ching-Kai Chou has worked for Moldex3D (Coretech System Co., Ltd.), Bonus Enterprise Co. Ltd. 柏納思股份有限公司, Special Enterprise Ltd. 思倍秀有限公司, and The University Of Texas At Austin.

Who are Ching-Kai Chou's colleagues at Moldex3D (CoreTech System Co., Ltd.)?

Ching-Kai Chou's colleagues at Moldex3D (CoreTech System Co., Ltd.) include Yi-Ting Chen, Ruo-An L., Wenkai Wu, John Lin, and 鍾玉玲.

How can I contact Ching-Kai Chou?

You can use AeroLeads to view verified contact signals for Ching-Kai Chou at Moldex3D (CoreTech System Co., Ltd.), including work email, phone, and LinkedIn data when available.

What schools did Ching-Kai Chou attend?

Ching-Kai Chou holds Doctor Of Philosophy (Phd), Civil Engineering from National Taiwan University.

What skills is Ching-Kai Chou known for?

Ching-Kai Chou is listed with skills including Research, Cae, Matlab, Simulations, Finite Element Analysis, Engineering, C++, and C.

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