Ching-Tzu Chen Email & Phone Number

Current research areas:• Post-Cu interconnect technologies, specifically topological, directional, and intermetallic conductors• Emergent memory technologies, e.g., PCM, MRAM, RRAM• Technologies, architectures, and algorithms for AI hardware• BEOL transistors and post-Si FEOL transistors • Topological materials and devices for semiconductor technologiesOther services/obligations:• Member, Science Advisory Board, Semiconductor Research Corporation's Joint University Microelectronics Program (SRC/JUMP2)• Technical Lead, IBM RPI Artificial Intelligence Research Collaboration (AIRC), Track 3: Semiconductor Technology • Liaison, Semiconductor Research Corporation's Global Research Collaboration Program (SRC/GRC)• Member, External Advisory Board, Illinois Materials Research Science and Engineering Center (UIUC I-MRSEC)Past research:• Spintronics, nano-devices, and quasi-2D systems: graphene, topological insulators, spin-orbit materials• Superconductivity• Scanning probe microscopy and spectroscopy

Listed skills include Physics, Nanotechnology, Nanomaterials, Thin Films, and 22 others.