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Chirag Mutha Email & Phone Number

Silicon Packaging Engineer@intel | MS Automotive Engineering @Clemson university at Intel Corporation
Location: United States, United States, United States 7 work roles 2 schools
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Silicon Packaging Engineer@intel | MS Automotive Engineering @Clemson university
Location
United States, United States, United States
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Who is Chirag Mutha? Overview

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Chirag Mutha is listed as Silicon Packaging Engineer@intel | MS Automotive Engineering @Clemson university at Intel Corporation, a company with 10 employees, based in United States, United States, United States. AeroLeads shows a matched LinkedIn profile for Chirag Mutha.

Chirag Mutha previously worked as Silicon Packaging Engineer at Intel Corporation and Research project – Hysteresis in P3HT based (OTFTs) mentor Dr. William Harrell at Clemson University College Of Engineering, Computing And Applied Sciences. Chirag Mutha holds Master Of Science In Automotive Engineering, Automotive from Clemson University International Center For Automotive Research.

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Intel Corporation

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About Chirag Mutha

I am a highly motivated automotive engineer with a strong background in semiconductor device physics. I have experience in studying organic thin-film transistors (OTFTs) and semiconductor manufacturing processes such as photolithography, thin-film deposition, etching, diffusion, and wet processes. My research is focused on investigating hysteresis on different types of thin film organic transistors and proposing solutions to improve device performance by overcoming these losses.In addition to my research experience, I have also developed real-time health-tracking systems using data analytics and neural networks (RNNs). I have conducted root cause analysis (RCA), Process FMEA, and Design FMEA to identify factors influencing defects.I also worked as a Design and Development Engineer with three years of experience in conducting root cause analysis (RCA), Process FMEA, and Design FMEA to identify factors influencing defects. Accomplished cleanroom design and installation with expertise in AUTOCAD, ISO-14644-1, and Federal Cleanroom Standards, successfully installed cleanroom machinery and HVAC system at Tier 1 supplier industry.Expertise - Programming languages: MATLAB & Simulink, Python, C++, Linux, ROS.Software: Minitab, M.S. Office, SolidWorks, UGNX, ANSYS, HyperWorks, COMSOL, Moldex 3D. Material and Device Characterization: Atomic Force Microscopy (AFM), Current Voltage measurement • Capacitance Voltage Measurement, Four-point probe measurement, Profilometry,Instruments: Metrology tools, Data acquisition unit, Analog to digital converters, Function generator, Optical microscope. Processing and Data Analysis: Metrology, Semiconductor Fab Process, Wet Processing, PhotolithographySemiconductor Devices: Schottky diodes and Thermionic emissions, JFETs and MESFETs, MOS and MIS Diodes/ Capacitors, MOSFETs, BJT, HBT, and Solar cell.I am passionate about using my skills and knowledge to make a positive impact in the automotive and semiconductor industries. Please reach out to me at chiragmutha24@gmail.com if you would like to learn more about my work or discuss potential opportunities.

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Chirag Mutha's current company

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Intel Corporation
Intel Corporation
Silicon Packaging Engineer@intel | MS Automotive Engineering @Clemson university
(408) 765-8080
Website
Employees
10
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7 roles

Chirag Mutha work experience

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Silicon Packaging Engineer

Current

Santa Clara, California, US

Feb 2024 - Present

Research Project – Hysteresis In P3Ht Based (Otfts) Mentor Dr. William Harrell

Current

Clemson, SC, US

  • Investigated hysteresis in 4 diverse types of P3HT-based Organic Thin-Film Transistors (OTFTs) and proposed solutions to improve device performance by overcoming these hysteresis losses.
  • Performed current-voltage measurements (electrical characterization) using a Semiconductor Parameter Analyzer on each type of OTFTs to determine the threshold voltage and mobility.
  • Proficient in Semiconductor Device Physics, OTFTs, and semiconductor manufacturing processes such as photolithography, thin film deposition, etching, diffusion, and wet processes.
Jan 2023 - Present

It Lab Assistant

Clemson, SC, US

Windows imaging, software installation, software/hardware troubleshooting on all types of computers, University electronics inventory management, procedure documentation for software installations and troubleshooting, AV troubleshooting in classrooms, and client management - Cherwell Service Desk software.

Jun 2022 - Feb 2024

Graduate Assistant

Clemson, SC, US

  • Mentored 20 undergraduate physics and other engineering major students for the Air Force Office of Scientific Research (AFOSR) Research Experiences for Undergraduates (REU) summer program.
  • Guided, supported, and shared valuable insights into their research projects, helping them navigate the challenges of scientific exploration and discovery throughout the program.
May 2023 - Aug 2023

Graduate Research Assistant

Greenville, South Carolina, US

  • Developed a real-time health tracking system using Time series data and Neural Networks (RNN).
  • Established a data pipeline, using Python, to estimate the user's force exertion with 20% accuracy and identify the operator's health and working state from Wearable Sensors-Glove and other body-worn sensors.
  • Devised neural network algorithms for real-time data-driven recommendations for the operator's working state to tackle any kind of worker health injury with 98% accuracy and improve shop floor bottom-line efficiency.
Feb 2022 - Jan 2023

Design And Development Engineer

Airfil Cleanroom Systems
  • Collaborated with cross-functional teams in the manufacturing of two cleanroom plants.
  • Responsibilities: Gathered client requirements, designed, and successfully installed cleanroom machinery and HVAC system at Walter Pack plant (Pune, India) – Tier 1 supplier. Utilized AUTOCAD for designing, adhering to.
  • Developed SOPs resulting in a 30% increase in process efficiency in terms of manufacturing time of parts.
  • Conducted root cause analysis (RCA) to identify anomalies in supplier parts (dashboards and speedometers), achieving a 25% defect reduction, significantly reducing waste and Cost of Poor Quality (COPQ).
  • Implemented Statistical Process Control (SPC) techniques to monitor and control process variability, minimizing defects by 20%.
Jun 2018 - Jun 2021

Student Internship

Pune, Maharashtra, IN

Analysis of V-8 Engine Block and Car’s front and rear doors made of different materials using HyperWorks

Jan 2018 - Jan 2018
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Colleagues at Intel Corporation

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2 education records

Chirag Mutha education

Master Of Science In Automotive Engineering, Automotive

Clemson University International Center For Automotive Research

Bachelor Of Engineering - Be, Mechanical Engineering

Vishwakarma Institute Of Information Technology
FAQ

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Quick answers generated from the profile data available on this page.

What company does Chirag Mutha work for?

Chirag Mutha works for Intel Corporation.

What is Chirag Mutha's role at Intel Corporation?

Chirag Mutha is listed as Silicon Packaging Engineer@intel | MS Automotive Engineering @Clemson university at Intel Corporation.

Where is Chirag Mutha based?

Chirag Mutha is based in United States, United States, United States while working with Intel Corporation.

What companies has Chirag Mutha worked for?

Chirag Mutha has worked for Intel Corporation, Clemson University College Of Engineering, Computing And Applied Sciences, Clemson University International Center For Automotive Research, Airfil Cleanroom Systems, and Eleation.

Who are Chirag Mutha's colleagues at Intel Corporation?

Chirag Mutha's colleagues at Intel Corporation include Afifaa Fairos, Vishal Sandhu, Stanley Ye, Abhaya Shetty, and Karim Emad Morsy.

How can I contact Chirag Mutha?

You can use AeroLeads to view verified contact signals for Chirag Mutha at Intel Corporation, including work email, phone, and LinkedIn data when available.

What schools did Chirag Mutha attend?

Chirag Mutha holds Master Of Science In Automotive Engineering, Automotive from Clemson University International Center For Automotive Research.

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