Chong Swee Shing Email & Phone Number

Ipoh, My

Ipoh, Perak, Malaysia

Malaysia

Ipoh

1. Responsible for new customer development2. Responsible for demonstrating & presenting company products including Capillary, Ag Alloy wire, Oven, Tester and test socket.3. Provide the technical support for the customer to perform capillary qualification.4. Fine tune parameters to set optimal condition for capillary.5. Provide training and after sales support to customers on the operation and maintenance of the engineering equipment.6. Support customer on the application of Oven and Tester.7. Liaise closely with customers, suppliers and team mates.8. To monitor and follow up on meeting the require delivery schedule.

Singapore

Responsibilities: • Develop and qualify assembly process and packaging technology for stack die products.• Perform packaging material, process, equipment and design rule advancement.• Transfer packaging technology to production site to ensure smooth production ramp up.Achievement : 1. Develop wire bond process capability on BPO/BPP (40um/45um) for controller die with 0.7mil Au wire.2. Successfully transfer J59E 8+1DP CuS-FOD to NPI team on Wirebond process capability.3. Successfully transfer wire bond capability on Bond finger pitch 60um to support next eMCP product roadmap with 110s mDRAM (Z11M/Z1AM).4. Complete package characterization and wire bond process readiness on S15C 8DP 1.5mm/1.3mm Package with 2 channel and 1 channel package with 0.8mil Au wire.5. Demonstrate Functional Samples of 64DP w/B17A.6. Successfully eliminated the lifted metal device with new improve capillary.7. Establish (3D Nand)B27A 1.4mm 16DP package recipe for Qual.

Melaka

Responsibilities:1. Responsible for driving product performance improvements in manufacturing to meet business case by analyzing product characteristics, making changes to process, materials and design to achieve desired quality and cost performance. 2. Support development and qualification of new products and packages and successfully introduce new products into manufacturing. Execute on customer sample requirement and collaborate with various internal organizations to ensure successful business ramp. Perform troubleshooting of product issues through characterization and failure analysis to identify root cause. 3. Engage with customers and the field to drive quality and reliability enhancements in line with customer expectation.4. Understand and apply process / package qualification reliability criteria on development packages. 5. Project management for timely release of new technologies / packages and cost saving initiatives. 6. Collaboration with Product Line on new package development. Timely update project development status to management & Product Line.EXPERIENCES GAINED:1. Driving and execution success for new automotive devices received.2. Strong technical skill in WB on SDS new devices by improving wire sweep performance through new looping profile and/or stitch positioning.3. Qualify 0.8mil & 1.0mil PCC wire on QFN package and others Cu/PCC development.4. Play critical role in wire bond diagram disposition and provide judgment to BU for resolution.

Melak

RESPONSIBILITIES:1. Source, characterize, develop, and implement new processes and packages meeting product specification and business requirement.2. Support development of new process technologies and definition of key process characteristics.3. Continuous process capability improvements to support product design enhancements.4. Technical process consultancy support for new product designs and package variants.5. Provide innovative technical solutions to identified challenges.6. Working in global teams / environment to deliver committed project targets.EXPERIENCES GAINED:1. 65/50um Cu wire project.2. Cu wire bond on uPPF leadframe.3. New package development.