Chris Ho Email and Phone Number

Knowing that semicon industry are using magazine, wafer box, metal wafer cassette, Jedec tray and metal tube are are contaminated, metal particles and foreign material. We have the solution and knowledge on how to clean all those parts. We did the process study by using DI water to clean those parts. On the first process, we are using Ultrasonic bath. Those part will submerged into the DI water. Using ultrasonic cleaning will be 100% uniformity. The slots will be able to take out those contamination, particles and foreign material out from the parts.Second process, we need to use DI water spray rinsing method to clean out those loose contamination from the parts. Third process, we need to use either slow pull or CDA air knives to take out those water droplets from the parts.Fourth process, we need to used hot air blower to dry the parts to make sure it is clean and dry before it is move to class 10k cleanroom.At the unloading station will be a cooling fan to cool down the parts in order for operator to take out. Our company are doing - - High Pressure Water Jet cleaning for BGA substrate to flash off the molding residue.- Flux Cleaning for IGBT product and also for SMT product.- Deburring Cleaning after semi sawn on the package.- Automation Intregation. We are also doing reserve engineering on the existing machines. We can support to improve the productivity and cost saving for customer.